SCHEMBL5031504

SCHEMBL5031504

CCCCCCOC1C=Cc2ccccc21

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
EYA2 O00167 1/20 0.50
TSHR P16473 2/20 0.41
LMNA P02545 2/20 0.41
ALDH1A1 P00352 1/20 0.41
RET P07949 2/20 0.40
GBA1 P04062 2/20 0.39
CYP3A4 P08684 2/20 0.38
TP53 P04637 1/20 0.38
MAPK1 P28482 1/20 0.38
HTR2A P28223 1/20 0.36
LTA4H P09960 1/20 0.36
CNR2 P34972 4/20 0.34
CNR1 P21554 1/20 0.34
MEN1 O00255 1/20 0.34
NR1I2 O75469 1/20 0.34
CHRM2 P08172 1/20 0.34
ADRA2A P08913 1/20 0.34
MAPT P10636 1/20 0.34
OPRK1 P41145 1/20 0.34
HTR2B P41595 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31740759 1.00 EYA2 (0.50) EYA2TSHRLMNAALDH1A1RET
SCHEMBL27819841 1.00 EYA2 (0.50) EYA2TSHRLMNAALDH1A1RET
SCHEMBL5031539 0.98 EYA2 (0.48) EYA2TSHRLMNAALDH1A1RET
SCHEMBL4506450 0.94 EYA2 (0.43) EYA2TSHRLMNAALDH1A1RET
SCHEMBL29815940 0.94 EYA2 (0.43) EYA2TSHRLMNAALDH1A1RET
SCHEMBL29434193 0.87 RET (0.44) EYA2LMNAALDH1A1RETCYP3A4
SCHEMBL28919635 0.84 EYA2 (0.43) EYA2TSHRLMNAALDH1A1RET
SCHEMBL28602300 0.82 EYA2 (0.41) EYA2TSHRLMNAALDH1A1RET
SCHEMBL5034587 0.80 RET (0.39) EYA2LMNARETCYP3A4TP53
SCHEMBL4516491 0.80 RET (0.42) LMNARETCYP3A4TP53HTR2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260109853-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
US-12447719-B2 Metal-clad laminate, wiring board, resin-including metal foil, and resin composition PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-10-21 US disclosed
US-12109779-B2 Copper-clad laminate, wiring board, and copper foil with resin PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-10-08 US disclosed
US-12024590-B2 Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-07-02 US disclosed
US-12022611-B2 Prepreg, metal-clad laminate, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-06-25 US disclosed
US-11958951-B2 Resin composition, prepreg, resin-equipped film, resin-equipped metal foil, metal-cladded layered sheet, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-04-16 US disclosed
CN-112368311-B Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal foil-clad laminate, and wiring board 松下知识产权经营株式会社 2023-11-03 CN disclosed
US-20230094806-A1 METAL-CLAD LAMINATE, WIRING BOARD, RESIN-INCLUDING METAL FOIL, AND RESIN COMPOSITION PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2023-03-30 US disclosed
US-20230054257-A1 COPPER-CLAD LAMINATE, WIRING BOARD, AND COPPER FOIL WITH RESIN PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2023-02-23 US disclosed
US-20220275122-A1 RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLADDED LAYERED SHEET, AND WIRING BOARD PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2022-09-01 US disclosed
CN-114555357-A Metal-clad laminate, wiring board, metal foil with resin, and resin composition 松下知识产权经营株式会社 2022-05-27 CN disclosed
CN-114555360-A Copper-clad laminate, wiring board, and resin-attached copper foil 松下知识产权经营株式会社 2022-05-27 CN disclosed
CN-114174411-A Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board 松下知识产权经营株式会社 2022-03-11 CN disclosed
US-11242425-B2 Resin composition, prepreg, resin-added film, resin-added metal foil, metal-clad layered plate, and wiring plate PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2022-02-08 US disclosed
US-7402645-B2 Soluble polyfunctional vinyl aromatic polymer and method of producing the same NIPPON STEEL CHEMICAL CO., LTD. (JP) 2008-07-22 US disclosed
US-20070155923-A1 Soluble polyfunctional vinyl aromatic polymer and method of producing the same NIPPON STEEL CHEMICAL CO., LTD. (JP) 2007-07-05 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260109853-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME PSMA1, PSMB10, RAD51 EYA2 4067/4885TSHR 4166/4885LMNA 293/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.