SCHEMBL4516491

SCHEMBL4516491

CCOC1C=Cc2ccccc21

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
RET P07949 2/20 0.42
LMNA P02545 2/20 0.41
SMN1; SMN2 Q16637 2/20 0.41
HTR2A P28223 3/20 0.38
HTR6 P50406 1/20 0.38
SIGMAR1 Q99720 6/20 0.36
KDM4E B2RXH2 2/20 0.35
ADRA2B P18089 2/20 0.35
ADRA2C P18825 2/20 0.35
HTR2C P28335 2/20 0.35
HTR2B P41595 2/20 0.35
CYP2D6 P10635 2/20 0.35
TP53 P04637 1/20 0.35
CHRM2 P08172 1/20 0.35
CYP3A4 P08684 1/20 0.35
CHRM1 P11229 1/20 0.35
DRD2 P14416 1/20 0.35
NFKB1 P19838 1/20 0.35
CHRM3 P20309 1/20 0.35
SLC6A2 P23975 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29434193 0.85 RET (0.44) RETLMNASMN1; SMN2HTR2AHTR6
SCHEMBL29815940 0.82 EYA2 (0.43) RETLMNASMN1; SMN2HTR2AHTR6
SCHEMBL4506450 0.82 EYA2 (0.43) RETLMNASMN1; SMN2HTR2AHTR6
SCHEMBL40508 0.81 RET (0.40) RETLMNASMN1; SMN2HTR2AADRA2B
SCHEMBL5031539 0.81 EYA2 (0.48) RETLMNASMN1; SMN2HTR2AHTR6
SCHEMBL5718862 0.81 RET (0.39) RETLMNASMN1; SMN2HTR2AHTR6
SCHEMBL5036744 0.80 RET (0.36) RETLMNASMN1; SMN2HTR2AHTR6
SCHEMBL5031504 0.80 EYA2 (0.50) RETLMNAHTR2AHTR2BTP53
SCHEMBL31740759 0.80 EYA2 (0.50) RETLMNAHTR2AHTR2BTP53
SCHEMBL27819841 0.80 EYA2 (0.50) RETLMNAHTR2AHTR2BTP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12545780-B2 Flexible metal clad laminates and methods of preparation thereof NOTARK CORPORATION (US) 2026-02-10 US disclosed
US-12447719-B2 Metal-clad laminate, wiring board, resin-including metal foil, and resin composition PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-10-21 US disclosed
US-12312452-B2 Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-05-27 US disclosed
US-12233621-B2 Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foil PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-02-25 US disclosed
WO-2024219272-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME 日本化薬株式会社 2024-10-24 WO disclosed
US-12109779-B2 Copper-clad laminate, wiring board, and copper foil with resin PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-10-08 US disclosed
US-12024590-B2 Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-07-02 US disclosed
US-12022611-B2 Prepreg, metal-clad laminate, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-06-25 US disclosed
US-11958951-B2 Resin composition, prepreg, resin-equipped film, resin-equipped metal foil, metal-cladded layered sheet, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-04-16 US disclosed
CN-117720787-A Flexible metal clad laminate and method of making the same 科腾聚合物荷兰有限责任公司 2024-03-19 CN disclosed
CN-112020523-A Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board 松下知识产权经营株式会社 2020-12-01 CN disclosed
WO-2020230870-A1 COPPER-CLAD LAMINATED PLATE, RESIN-CLAD COPPER FOIL, AND CIRCUIT SUBSTRATE USING SAID PLATE AND FOIL パナソニックIPマネジメント株式会社 2020-11-19 WO disclosed
WO-2020196759-A1 PREPREG, METAL-CLAD LAMINATE, AND WIRING BOARD パナソニックIPマネジメント株式会社 2020-10-01 WO disclosed
CN-111620982-A Thermosetting resin composition, and adhesive sheet, metal-clad laminate and printed wiring board produced using same 南亚新材料科技股份有限公司 2020-09-04 CN disclosed
WO-2020017399-A1 RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE AND WIRING BOARD パナソニックIPマネジメント株式会社 2020-01-23 WO disclosed
US-7595362-B2 Curable resin composition NIPPON STEEL CHEMICAL CO., LTD. (JP) 2009-09-29 US disclosed
US-7402645-B2 Soluble polyfunctional vinyl aromatic polymer and method of producing the same NIPPON STEEL CHEMICAL CO., LTD. (JP) 2008-07-22 US disclosed
US-20070155923-A1 Soluble polyfunctional vinyl aromatic polymer and method of producing the same NIPPON STEEL CHEMICAL CO., LTD. (JP) 2007-07-05 US disclosed
US-20070129502-A1 Polyphenylene ethers; improved chemical resistance, dielectric, low water-absorption, heat resistance, flame retardance, and mechanical properties; laminates NIPPON STEEL CHEMICAL CO., LTD. (JP) 2007-06-07 US disclosed
US-20060177666-A1 Curable resin compositions NIPPON STEEL CHEMICAL CO., LTD. (JP) 2006-08-10 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12545780-B2 Flexible metal clad laminates and methods of preparation thereof DSG1, CDH1, CAD RET 4581/4885LMNA 429/4885SMN1; SMN2 453/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.