SCHEMBL5034587

SCHEMBL5034587

CC(C)CCCOC1C=Cc2ccccc21

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
RET P07949 2/20 0.39
SIGMAR1 Q99720 4/20 0.33
EYA2 O00167 1/20 0.33
KDM4E B2RXH2 2/20 0.33
HTR2A P28223 2/20 0.33
LMNA P02545 1/20 0.33
TP53 P04637 1/20 0.33
CHRM2 P08172 1/20 0.33
CYP3A4 P08684 1/20 0.33
CYP2D6 P10635 1/20 0.33
CHRM1 P11229 1/20 0.33
DRD2 P14416 1/20 0.33
ADRA2B P18089 1/20 0.33
ADRA2C P18825 1/20 0.33
NFKB1 P19838 1/20 0.33
CHRM3 P20309 1/20 0.33
SLC6A2 P23975 1/20 0.33
HTR2C P28335 1/20 0.33
ADRA1A P35348 1/20 0.33
HRH1 P35367 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5036828 0.91 RET (0.41) RETSIGMAR1KDM4EHTR2ALMNA
SCHEMBL29815940 0.83 EYA2 (0.43) RETSIGMAR1EYA2KDM4EHTR2A
SCHEMBL4506450 0.83 EYA2 (0.43) RETSIGMAR1EYA2KDM4EHTR2A
SCHEMBL5031539 0.81 EYA2 (0.48) RETSIGMAR1EYA2KDM4EHTR2A
SCHEMBL5034597 0.81 RET (0.38) RETSIGMAR1EYA2HTR2AHTR6
SCHEMBL27819841 0.80 EYA2 (0.50) RETEYA2HTR2ALMNATP53
SCHEMBL31740759 0.80 EYA2 (0.50) RETEYA2HTR2ALMNATP53
SCHEMBL5031504 0.80 EYA2 (0.50) RETEYA2HTR2ALMNATP53
SCHEMBL29434193 0.79 RET (0.44) RETSIGMAR1EYA2KDM4EHTR2A
SCHEMBL4516491 0.75 RET (0.42) RETSIGMAR1KDM4EHTR2ALMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260109853-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
US-12545780-B2 Flexible metal clad laminates and methods of preparation thereof NOTARK CORPORATION (US) 2026-02-10 US disclosed
US-20250367910-A1 LAMINATES BASED ON COPOLYMERS OF DIISOALKENYLARENES NOTARK CORPORATION (US) 2025-12-04 US disclosed
US-12447719-B2 Metal-clad laminate, wiring board, resin-including metal foil, and resin composition PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-10-21 US disclosed
US-12312452-B2 Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-05-27 US disclosed
US-12233621-B2 Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foil PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-02-25 US disclosed
WO-2024219272-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME 日本化薬株式会社 2024-10-24 WO disclosed
US-12109779-B2 Copper-clad laminate, wiring board, and copper foil with resin PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-10-08 US disclosed
US-12024590-B2 Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-07-02 US disclosed
US-12022611-B2 Prepreg, metal-clad laminate, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-06-25 US disclosed
WO-2021079817-A1 METAL CLAD LAMINATE, WIRING BOARD, RESIN-INCLUDING METAL FOIL, AND RESIN COMPOSITION パナソニックIPマネジメント株式会社 2021-04-29 WO disclosed
WO-2021060178-A1 RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD パナソニックIPマネジメント株式会社 2021-04-01 WO disclosed
CN-112368311-A Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board 松下知识产权经营株式会社 2021-02-12 CN disclosed
WO-2021024923-A1 RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLADDED LAYERED SHEET, AND WIRING BOARD パナソニックIPマネジメント株式会社 2021-02-11 WO disclosed
CN-112020523-A Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board 松下知识产权经营株式会社 2020-12-01 CN disclosed
WO-2020230870-A1 COPPER-CLAD LAMINATED PLATE, RESIN-CLAD COPPER FOIL, AND CIRCUIT SUBSTRATE USING SAID PLATE AND FOIL パナソニックIPマネジメント株式会社 2020-11-19 WO disclosed
WO-2020196759-A1 PREPREG, METAL-CLAD LAMINATE, AND WIRING BOARD パナソニックIPマネジメント株式会社 2020-10-01 WO disclosed
WO-2020017399-A1 RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE AND WIRING BOARD パナソニックIPマネジメント株式会社 2020-01-23 WO disclosed
US-7402645-B2 Soluble polyfunctional vinyl aromatic polymer and method of producing the same NIPPON STEEL CHEMICAL CO., LTD. (JP) 2008-07-22 US disclosed
US-20070155923-A1 Soluble polyfunctional vinyl aromatic polymer and method of producing the same NIPPON STEEL CHEMICAL CO., LTD. (JP) 2007-07-05 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260109853-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME PSMA1, PSMB10, RAD51 RET 1898/4885SIGMAR1 4081/4885EYA2 4067/4885
US-12545780-B2 Flexible metal clad laminates and methods of preparation thereof DSG1, CDH1, CAD RET 4581/4885SIGMAR1 1875/4885EYA2 3690/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.