SCHEMBL5031608

SCHEMBL5031608

C=Cc1ccc(C(=O)Nc2cc(C)ccc2O)cc1

nearest known ligand 0.68

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
KCNMA1 Q12791 5/20 0.68
HDAC1 Q13547 1/20 0.53
GAA P10253 7/20 0.50
NPC1 O15118 5/20 0.50
MAPT P10636 4/20 0.50
TP53 P04637 3/20 0.50
SMN1; SMN2 Q16637 2/20 0.50
RAB9A P51151 3/20 0.49
ADRB2 P07550 1/20 0.46
MEN1 O00255 2/20 0.46
KMT2A Q03164 2/20 0.46
HDAC2 Q92769 1/20 0.46
ALDH1A1 P00352 1/20 0.46
HTT P42858 1/20 0.46
TDP1 Q9NUW8 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5033736 0.89 NPC1 (0.54) KCNMA1GAANPC1MAPTSMN1; SMN2
SCHEMBL6029542 0.88 KCNMA1 (0.84) KCNMA1HDAC1GAANPC1MAPT
SCHEMBL2605548 0.86 KCNMA1 (0.82) KCNMA1HDAC1GAANPC1MAPT
SCHEMBL14154080 0.83 KCNMA1 (0.64) KCNMA1HDAC1GAANPC1MAPT
SCHEMBL14363236 0.83 KCNMA1 (0.77) KCNMA1HDAC1GAANPC1MAPT
SCHEMBL5039454 0.83 KCNMA1 (0.68) KCNMA1HDAC1NPC1TP53RAB9A
SCHEMBL19927859 0.82 HDAC2 (0.54) KCNMA1HDAC1GAANPC1MAPT
SCHEMBL10873010 0.80 KCNMA1 (1.00) KCNMA1HDAC1GAANPC1MAPT
SCHEMBL14363234 0.80 KCNMA1 (0.72) KCNMA1HDAC1GAANPC1MAPT
SCHEMBL7300963 0.79 KCNMA1 (0.71) KCNMA1HDAC1GAANPC1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7439005-B2 Styrene derivative, styrene polymer, photosensitive resin composition, and method for forming pattern NEC CORPORATION (JP) 2008-10-21 US disclosed
US-7439005-B2 Styrene derivative, styrene polymer, photosensitive resin composition, and method for forming pattern NEC CORPORATION (JP) 2008-10-21 US disclosed
US-7439005-B2 Styrene derivative, styrene polymer, photosensitive resin composition, and method for forming pattern NEC CORPORATION (JP) 2008-10-21 US disclosed
US-20070134586-A1 Styrene derivative, styrene polymer, photosensitive resin composition, and method for forming pattern NEC CORPORATION (JP) 2007-06-14 US disclosed
US-20070134586-A1 Styrene derivative, styrene polymer, photosensitive resin composition, and method for forming pattern NEC CORPORATION (JP) 2007-06-14 US disclosed
US-20070134586-A1 Styrene derivative, styrene polymer, photosensitive resin composition, and method for forming pattern NEC CORPORATION (JP) 2007-06-14 US disclosed