SCHEMBL5032260

SCHEMBL5032260

CC(C)C1CCC(c2ccc(O)cc2)CC1

nearest known ligand 0.62

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
ESR2 Q92731 19/20 0.62
ESR1 P03372 7/20 0.53
CYP3A4 P08684 2/20 0.53
CYP2C9 P11712 2/20 0.53
CYP2D6 P10635 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3811445 0.82 ESR2 (0.81) ESR2ESR1CYP3A4CYP2C9CYP2D6
SCHEMBL3809909 0.82 ESR2 (0.81) ESR2ESR1CYP3A4CYP2C9CYP2D6
SCHEMBL1986271 0.82 ESR2 (0.81) ESR2ESR1CYP3A4CYP2C9CYP2D6
SCHEMBL1865798 0.82 ESR2 (0.81) ESR2ESR1CYP3A4CYP2C9CYP2D6
SCHEMBL432492 0.80 ESR2 (0.53) ESR2ESR1CYP3A4CYP2C9CYP2D6
SCHEMBL660938 0.80 ESR2 (0.53) ESR2ESR1CYP3A4CYP2C9CYP2D6
SCHEMBL10140514 0.80 ESR2 (0.38) ESR2ESR1CYP3A4CYP2C9
SCHEMBL12462967 0.80 ESR2 (0.38) ESR2ESR1CYP3A4CYP2C9
SCHEMBL12000483 0.80 DRD2 (0.47) ESR2CYP2C9
SCHEMBL18574578 0.79 SLC18A3 (0.48) CYP2D6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 79 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113574114-B Resin composition for infrared shielding transparent member and molded article 帝人株式会社 2024-05-28 CN disclosed
CN-117957283-A Resin composition and molded article thereof 帝人株式会社 2024-04-30 CN disclosed
CN-114502356-B Method for producing curved member and hard-coated polycarbonate resin laminate for hot bending 帝人株式会社 2023-12-26 CN disclosed
CN-111829995-B Resin degradation degree evaluation test method and resin recycling system using the same 柯尼卡美能达株式会社 2023-12-01 CN disclosed
CN-117083177-A Laminated film and bag 住友化学株式会社 2023-11-17 CN disclosed
CN-116829646-A Polycarbonate resin composition and molded article 帝人株式会社 2023-09-29 CN disclosed
CN-116624808-A Lampshade 住友化学株式会社 2023-08-22 CN disclosed
CN-113383035-B Molding material comprising carbon fiber-reinforced polycarbonate resin composition 帝人株式会社 2023-08-01 CN disclosed
CN-113557270-B Impeller and resin composition thereof 帝人株式会社 2023-07-28 CN disclosed
EP-3409723-B1 POLYCARBONATE RESIN COMPOSITION, HEAT RAY-SHIELDING MOLDED ARTICLE, AND HEAT RAY-SHIELDING LAMINATE SUMITOMO METAL MINING CO (JP) 2023-07-05 EP disclosed
CN-101456251-B Method for producing extruded resin sheet SUMITOMO CO LTD 2013-03-27 CN disclosed
CN-1712199-B Method for recycling recovered discs, flame retardant resin composition and flame retardant resin molded products SONY CORP 2010-12-08 CN disclosed
CN-101456251-A Method for producing extruded resin sheet SUMITOMO CHEMICAL CO (JP) 2009-06-17 CN disclosed
CN-101450527-A Method for producing extruded resin sheet SUMITOMO CHEMICAL CO (JP) 2009-06-10 CN disclosed
EP-1983030-A1 RESIN COMPOSITION, MOLDED ARTICLE AND THEIR PRODUCTION METHODS Teijin Chemicals, Ltd. (JP) 2008-10-22 EP disclosed
CN-100387425-C Sheet-form layered structure with attractive apperance and utilziation thereof TEIJIN CHEMICALS LTD (JP) 2008-05-14 CN disclosed
US-20050286397-A1 Method for recycling recovered discs, flame retardant resin composition and flame retardant resin molded products SONY CORPORATION (JP) 2005-12-29 US disclosed
CN-1712199-A Method for recycling recovered discs, flame retardant resin composition and flame retardant resin molded products SONY CORP (JP) 2005-12-28 CN disclosed
EP-1285940-A1 DISC SUBSTRATE FOR OPTICAL USE AND MOLDING MATERIAL THEREFOR Teijin Chemicals, Ltd. (JP) 2003-02-26 EP disclosed
CN-1392834-A Sheet-like layered structure having high appearance and use thereof TEIJIN CHEMICALS LTD (JP) 2003-01-22 CN disclosed