Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.46 |
| ▸ | LMNA | P02545 | 1/20 | 0.46 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.46 |
| ▸ | MGAM | O43451 | 1/20 | 0.45 |
| ▸ | GAA | P10253 | 1/20 | 0.45 |
| ▸ | SI | P14410 | 1/20 | 0.45 |
| ▸ | MGAM2 | Q2M2H8 | 1/20 | 0.45 |
| ▸ | LTA4H | P09960 | 4/20 | 0.45 |
| ▸ | TSHR | P16473 | 1/20 | 0.44 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.41 |
| ▸ | MAPT | P10636 | 1/20 | 0.38 |
| ▸ | HPGD | P15428 | 1/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.38 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.38 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.38 |
| ▸ | TOP2A | P11388 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4380952 | 0.89 | ALDH1A1 (0.42) | ALDH1A1LMNAHSD17B10GAALTA4H | |
| SCHEMBL4464939 | 0.86 | GAA (0.59) | ALDH1A1MGAMGAASIMGAM2 | |
| SCHEMBL5701679 | 0.85 | TSHR (0.46) | ALDH1A1LMNAHSD17B10MGAMGAA | |
| SCHEMBL13756031 | 0.84 | GAA (0.56) | ALDH1A1MGAMGAASIMGAM2 | |
| Hydrochloric Acid SCHEMBL11851530 | 0.84 | GAA (0.56) | ALDH1A1MGAMGAASIMGAM2 | |
| SCHEMBL4378677 | 0.84 | ALDH1A1 (0.35) | ALDH1A1LMNAHSD17B10MGAMGAA | |
| SCHEMBL28565091 | 0.84 | CHRM5 (0.38) | ALDH1A1LMNAHSD17B10GAALTA4H | |
| SCHEMBL13435480 | 0.83 | GAA (0.46) | ALDH1A1MGAMGAASIMGAM2 | |
| SCHEMBL5383899 | 0.82 | LTA4H (0.38) | ALDH1A1GAALTA4HTSHRCYP1A2 | |
| SCHEMBL28046764 | 0.82 | LTA4H (0.38) | ALDH1A1LMNAHSD17B10MGAMGAA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115044040-B | Polyimide-containing polymer, positive photosensitive resin composition, negative photosensitive resin composition, and pattern forming method | 信越化学工业株式会社 | 2024-07-02 | — | — | CN | disclosed |
| CN-113527101-B | Novel compound, polymer, process for producing the same, photosensitive resin composition, pattern forming process, cured film, and electronic component | 信越化学工业株式会社 | 2024-04-23 | — | — | CN | disclosed |
| CN-111381447-B | Photosensitive resin composition, laminate, and pattern forming method | 信越化学工业株式会社 | 2024-03-08 | — | — | CN | disclosed |
| CN-117501180-A | Laminate, method for producing laminate, and method for forming pattern | 信越化学工业株式会社 | 2024-02-02 | — | — | CN | disclosed |
| CN-109388023-B | Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, laminate, and pattern forming method | 信越化学工业株式会社 | 2023-12-22 | — | — | CN | disclosed |
| CN-109388022-B | Silicone-structure-containing polymer, photosensitive resin composition, photosensitive resin coating layer, photosensitive dry film, laminate, and pattern forming method | 信越化学工业株式会社 | 2023-07-28 | — | — | CN | disclosed |
| CN-113527680-B | Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component | 信越化学工业株式会社 | 2023-04-28 | — | — | CN | disclosed |
| CN-108107676-B | Chemically amplified positive resist film laminate and pattern formation method | 信越化学工业株式会社 | 2023-02-21 | — | — | CN | disclosed |
| CN-108388082-B | Photosensitive resin composition, photosensitive dry film, photosensitive resin coating and pattern forming method | 信越化学工业株式会社（JP） | 2023-01-13 | — | — | CN | disclosed |
| CN-108459469-B | Pattern forming method | 信越化学工业株式会社 | 2022-11-11 | — | — | CN | disclosed |
| CN-106249542-A | Semiconductor device, stack-up type semiconductor device, sealing back-set bed type semiconductor device and the manufacture method of these devices | 信越化学工业株式会社 | 2016-12-21 | — | — | CN | disclosed |
| CN-105487337-A | Chemically amplified negative resist composition, photo-curable dry film, making method, patterning process, and electric/electronic part-protecting film | SHINETSU CHEMICAL CO | 2016-04-13 | — | — | CN | disclosed |
| CN-105404096-A | CHEMICALLY AMPLIFIED POSITIVE RESIST DRY FILM, DRY FILM LAMINATE AND METHOD OF PREPARING LAMINATE | SHINETSU CHEMICAL CO | 2016-03-16 | — | — | CN | disclosed |
| CN-105315467-A | Silicone structure-bearing polymer, negative resist composition, photo-curable dry film, and patterning process | SHINETSU CHEMICAL CO | 2016-02-10 | — | — | CN | disclosed |
| CN-105301905-A | Chemically amplified positive resist composition and patterning process | SHINETSU CHEMICAL CO | 2016-02-03 | — | — | CN | disclosed |
| US-7396633-B2 | Damascene process; forming connectors; exposure; development; using acid generator, quencher and buffer | NEC ELECTRONICS CORPORATION (JP) | 2008-07-08 | — | — | US | disclosed |
| EP-1693707-A1 | Positive resist composition, and patterning process using the same | Shinetsu Chemical Co., Ltd. (JP) | 2006-08-23 | — | — | EP | disclosed |
| US-20050079446-A1 | Novel polymerizable compound, polymer, positive-resist composition, and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-04-14 | — | — | US | disclosed |
| US-20050079440-A1 | Novel polymer, positive resist composition, and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-04-14 | — | — | US | disclosed |
| US-20040259029-A1 | Chemically amplified resist composition and manufacturing method of semiconductor integrated circuit device with such chemically amplified resist composition | NEC ELECTRONICS CORPORATION (JP) | 2004-12-23 | — | — | US | disclosed |