Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KMT2A | Q03164 | 1/20 | 0.55 |
| ▸ | SMPD1 | P17405 | 3/20 | 0.55 |
| ▸ | PLA2G4B | P0C869 | 1/20 | 0.55 |
| ▸ | THRB | P10828 | 2/20 | 0.54 |
| ▸ | NR1H4 | Q96RI1 | 2/20 | 0.52 |
| ▸ | PRSS1 | P07477 | 6/20 | 0.50 |
| ▸ | THRA | P10827 | 1/20 | 0.50 |
| ▸ | KAT6A | Q92794 | 1/20 | 0.49 |
| ▸ | USP2 | O75604 | 1/20 | 0.49 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.49 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5033472 | 0.95 | SMPD1 (0.61) | KMT2ASMPD1PLA2G4BTHRBNR1H4 | |
| SCHEMBL16950914 | 0.86 | KMT2A (0.58) | KMT2ASMPD1PLA2G4BTHRBNR1H4 | |
| SCHEMBL8067261 | 0.85 | ALDH1A1 (0.50) | KMT2ASMPD1PRSS1 | |
| SCHEMBL25077874 | 0.84 | KMT2A (0.54) | KMT2ANR1H4KAT6AMAPK1 | |
| SCHEMBL27963971 | 0.83 | KMT2A (0.55) | KMT2ASMPD1PLA2G4BTHRBNR1H4 | |
| SCHEMBL24749935 | 0.83 | KMT2A (0.47) | KMT2ASMPD1PRSS1MAPK1 | |
| SCHEMBL1436145 | 0.83 | THRB (0.65) | KMT2ASMPD1PLA2G4BTHRBNR1H4 | |
| SCHEMBL16961943 | 0.83 | KMT2A (0.51) | KMT2ASMPD1PLA2G4BTHRBNR1H4 | |
| SCHEMBL16957113 | 0.82 | KMT2A (0.54) | KMT2ASMPD1PLA2G4BTHRBNR1H4 | |
| SCHEMBL11056943 | 0.82 | KMT2A (0.62) | KMT2ASMPD1PLA2G4BTHRBNR1H4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12024590-B2 | Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2024-07-02 | — | — | US | disclosed |
| US-12022611-B2 | Prepreg, metal-clad laminate, and wiring board | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2024-06-25 | — | — | US | disclosed |
| US-11958951-B2 | Resin composition, prepreg, resin-equipped film, resin-equipped metal foil, metal-cladded layered sheet, and wiring board | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2024-04-16 | — | — | US | disclosed |
| CN-117720787-A | Flexible metal clad laminate and method of making the same | 科腾聚合物荷兰有限责任公司 | 2024-03-19 | — | — | CN | disclosed |
| CN-112368311-B | Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2023-11-03 | — | — | CN | disclosed |
| CN-112020523-B | Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2023-10-24 | — | — | CN | disclosed |
| US-20230094806-A1 | METAL-CLAD LAMINATE, WIRING BOARD, RESIN-INCLUDING METAL FOIL, AND RESIN COMPOSITION | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2023-03-30 | — | — | US | disclosed |
| US-20230054257-A1 | COPPER-CLAD LAMINATE, WIRING BOARD, AND COPPER FOIL WITH RESIN | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2023-02-23 | — | — | US | disclosed |
| US-20220220272-A1 | COPPER-CLAD LAMINATED PLATE, RESIN-CLAD COPPER FOIL, AND CIRCUIT SUBSTRATE USING SAID PLATE AND FOIL | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2022-07-14 | — | — | US | disclosed |
| CN-114555360-A | Copper-clad laminate, wiring board, and resin-attached copper foil | 松下知识产权经营株式会社 | 2022-05-27 | — | — | CN | disclosed |
| WO-2021079817-A1 | METAL CLAD LAMINATE, WIRING BOARD, RESIN-INCLUDING METAL FOIL, AND RESIN COMPOSITION | パナソニックＩＰマネジメント株式会社 | 2021-04-29 | — | — | WO | disclosed |
| WO-2021060178-A1 | RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD | パナソニックＩＰマネジメント株式会社 | 2021-04-01 | — | — | WO | disclosed |
| CN-112368311-A | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2021-02-12 | — | — | CN | disclosed |
| WO-2021024923-A1 | RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLADDED LAYERED SHEET, AND WIRING BOARD | パナソニックＩＰマネジメント株式会社 | 2021-02-11 | — | — | WO | disclosed |
| CN-112020523-A | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2020-12-01 | — | — | CN | disclosed |
| WO-2020230870-A1 | COPPER-CLAD LAMINATED PLATE, RESIN-CLAD COPPER FOIL, AND CIRCUIT SUBSTRATE USING SAID PLATE AND FOIL | パナソニックＩＰマネジメント株式会社 | 2020-11-19 | — | — | WO | disclosed |
| WO-2020196759-A1 | PREPREG, METAL-CLAD LAMINATE, AND WIRING BOARD | パナソニックＩＰマネジメント株式会社 | 2020-10-01 | — | — | WO | disclosed |
| WO-2020017399-A1 | RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE AND WIRING BOARD | パナソニックＩＰマネジメント株式会社 | 2020-01-23 | — | — | WO | disclosed |
| US-7402645-B2 | Soluble polyfunctional vinyl aromatic polymer and method of producing the same | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 2008-07-22 | — | — | US | disclosed |
| US-20070155923-A1 | Soluble polyfunctional vinyl aromatic polymer and method of producing the same | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 2007-07-05 | — | — | US | disclosed |