SCHEMBL5038677

SCHEMBL5038677

O=C(O)c1ccc(Oc2ccc(-c3cccc(Oc4ccc(C(=O)O)cc4)c3)cc2)cc1

nearest known ligand 0.67

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
RXRA P19793 5/20 0.67
RXRB P28702 4/20 0.67
SRD5A2 P31213 3/20 0.61
AKR1C3 P42330 1/20 0.61
FFAR4 Q5NUL3 2/20 0.58
FFAR1 O14842 1/20 0.58
PTGES O14684 1/20 0.56
ALOX5 P09917 1/20 0.56
TRIM24 O15164 1/20 0.54
TRIM33 Q9UPN9 1/20 0.54
LMNA P02545 1/20 0.54
GAA P10253 1/20 0.54
PARP15 Q460N3 1/20 0.53
PARP10 Q53GL7 1/20 0.53
RXRG P48443 1/20 0.53
BCL2 P10415 1/20 0.53

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30705228 1.00 RXRA (0.67) RXRARXRBSRD5A2AKR1C3FFAR4
SCHEMBL29963803 0.96 SRD5A2 (0.65) RXRARXRBSRD5A2AKR1C3FFAR4
SCHEMBL5042492 0.96 SRD5A2 (0.65) RXRARXRBSRD5A2AKR1C3FFAR4
SCHEMBL5044252 0.92 AKR1C3 (0.74) RXRARXRBAKR1C3FFAR4FFAR1
SCHEMBL30705230 0.92 AKR1C3 (0.74) RXRARXRBAKR1C3FFAR4FFAR1
SCHEMBL2708209 0.87 SRD5A2 (0.71) RXRARXRBSRD5A2AKR1C3PARP15
SCHEMBL11419154 0.87 SRD5A2 (0.71) RXRARXRBSRD5A2AKR1C3PTGES
SCHEMBL8999835 0.87 SRD5A2 (0.78) SRD5A2AKR1C3PARP15PARP10
SCHEMBL5038711 0.87 EGFR (0.55) RXRARXRBSRD5A2AKR1C3FFAR4
SCHEMBL2747020 0.86 AKR1C3 (0.82) SRD5A2AKR1C3LMNAGAAPARP15

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240043619-A1 POLYIMIDE PRECURSOR RESIN COMPOSITION ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-02-08 US disclosed
WO-2022211086-A1 POLYIMIDE, RESIN COMPOSITION, POLYIMIDE FILM, AND PRODUCTION METHOD THEREFOR 旭化成株式会社 2022-10-06 WO disclosed
US-20210246268-A1 SILICON-CONTAINING COMPOUND SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-08-12 US disclosed
EP-3786213-A1 SILICON-CONTAINING COMPOUND Shin-Etsu Chemical Co., Ltd. (JP) 2021-03-03 EP disclosed
US-20190352463-A1 POLYIMIDE PRECURSOR RESIN COMPOSITION ASAHI KASEI KABUSHIKI KAISHA (JP) 2019-11-21 US disclosed
US-20170165879-A1 RESIN PRECURSOR, RESIN COMPOSITION CONTAINING SAME, POLYIMIDE RESIN MEMBRANE, RESIN FILM, AND METHOD FOR PRODUCING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2017-06-15 US disclosed
US-7416822-B2 Resin and resin composition ASAHI KASEI EMD CORPORATION (JP) 2008-08-26 US disclosed
US-20070154843-A1 Resin and resin composition ASAHI KASEI EMD CORPORATION (JP) 2007-07-05 US disclosed
EP-1333050-B1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO (JP) 2006-12-27 EP disclosed
EP-1707588-A1 RESIN AND RESIN COMPOSITION Asahi Kasei EMD Corporation (JP) 2006-10-04 EP disclosed
US-7049371-B2 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2006-05-23 US disclosed
US-20040002572-A1 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2004-01-01 US disclosed
EP-1333050-A1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2003-08-06 EP disclosed
EP-1327653-A1 HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN AND INSULATING FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2003-07-16 EP disclosed
US-6518390-B2 Polybenzoxazole and crosslinking agent SUMITOMO BAKELITE COMPANY, LTD. (JP) 2003-02-11 US disclosed
US-20020013443-A1 Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2002-01-31 US disclosed