⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22781191 | 0.67 | — | — | |
| SCHEMBL7174117 | 0.63 | SMN1; SMN2 (0.34) | — | |
| SCHEMBL997122 | 0.60 | — | — | |
| SCHEMBL29047510 | 0.59 | — | — | |
| SCHEMBL10782642 | 0.57 | TP53 (0.38) | — | |
| SCHEMBL1994837 | 0.57 | CYP19A1 (0.32) | — | |
| SCHEMBL11039302 | 0.57 | CYP19A1 (0.32) | — | |
| SCHEMBL30550560 | 0.57 | CCR2 (0.33) | — | |
| SCHEMBL30509008 | 0.56 | OPRM1 (0.32) | — | |
| SCHEMBL1153470 | 0.56 | MAOA (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 79 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113402990-A | Adhesive tape with foamable structure and preparation process | 优链新材料科技（上海）有限公司 | 2021-09-17 | — | — | CN | claimed |
| EP-2230267-B1 | Method of producing a curable epoxy resin composition | ABB RESEARCH LTD (CH) | 2014-08-13 | — | — | EP | claimed |
| US-20140079924-A1 | RESIN COMPOSITION FOR PACKAGE SUBSTRATE AND PACKAGE SUBSTRATE COMPRISING CORE LAYER AND PREPREG USING THE SAME | Samsung Electro-Mechanisc Co., Ltd. (KR) | 2014-03-20 | — | — | US | claimed |
| US-20140063427-A1 | RESIN COMPOSITION FOR THERMAL RADIATION BOARD AND THERMAL RADIATION BOARD COMPRISING THE SAME | SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) | 2014-03-06 | — | — | US | claimed |
| WO-2013139390-A1 | CURABLE EPOXY RESIN COMPOSITION | ABB RESEARCH LTD. (CH) | 2013-09-26 | — | — | WO | claimed |
| WO-2013032190-A1 | PHOTOPOLYMERIZABLE UNSATURATED RESIN, PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE SAME, AND LIGHT SHIELDING SPACER AND LIQUID CRYSTAL DISPLAY DEVICE FORMED THEREFROM | ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) | 2013-03-07 | — | — | WO | claimed |
| US-20120202918-A1 | CURABLE EPOXY RESIN COMPOSITION | ABB RESEARCH LTD (CH) | 2012-08-09 | — | — | US | claimed |
| EP-2470583-A1 | CURABLE EPOXY RESIN COMPOSITION | ABB Research Ltd. (CH) | 2012-07-04 | — | — | EP | claimed |
| EP-2454308-A1 | EPOXY RESIN COMPOSITION | ABB Research Ltd. (CH) | 2012-05-23 | — | — | EP | claimed |
| US-20120025151-A1 | CURABLE EPOXY RESIN COMPOSITION | ABB RESEARCH LTD (CH) | 2012-02-02 | — | — | US | claimed |
| WO-2011006530-A1 | EPOXY RESIN COMPOSITION | ABB RESEARCH LTD (CH) | 2011-01-20 | — | — | WO | claimed |
| WO-2010106084-A1 | CURABLE EPOXY RESIN COMPOSITION | ABB RESEARCH LTD (CH) | 2010-09-23 | — | — | WO | claimed |
| EP-2230267-A1 | Curable Epoxy Resin Composition | ABB Research Ltd. (CH) | 2010-09-22 | — | — | EP | claimed |
| US-6713230-B2 | INCLUDES AN ACRYLATED, EPOXIDIZED NOVOLAK PREPOLYMER, PHOTOCURABLE MONOMERS AND AN EPOXY COMPOUND THAT ALSO HAS A VINYL GROUP, AND CLAY NANOCOMPOSITE | NAN YA PLASTICS CORPORATION (TW) | 2004-03-30 | — | — | US | claimed |
| EP-0845499-B1 | Process for providing a heat-conductive paste | SUMITOMO BAKELITE CO (JP) | 2003-05-21 | — | — | EP | claimed |
| US-6544652-B2 | Cyanate ester-containing insulating composition, insulating film made therefrom and multilayer printed circuit board having the film | SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) | 2003-04-08 | — | — | US | claimed |
| US-20020197479-A1 | Cyanate ester-containing insulating composition, insulating film made therefrom and multilayer printed circuit board having the film | SAMSUNG ELECTRO-MECHANICS CO., LTD. | 2002-12-26 | — | — | US | claimed |
| US-20020136986-A1 | Novel photosensitive ink composition | CHANG CHI-MING (US) | 2002-09-26 | — | — | US | claimed |
| US-5908881-A | FOR SEMICONDUCTORS; BLEND OF EPOXY RESIN AND PHENOLIC CURING AGENT | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1999-06-01 | — | — | US | claimed |
| EP-0845499-A2 | Heat-conductive paste | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1998-06-03 | — | — | EP | claimed |