SCHEMBL5044252

SCHEMBL5044252

O=C(O)c1cccc(Oc2ccc(-c3cccc(Oc4cccc(C(=O)O)c4)c3)cc2)c1

nearest known ligand 0.74

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
AKR1C3 P42330 1/20 0.74
KMO O15229 2/20 0.62
KDM4E B2RXH2 1/20 0.61
LMNA P02545 1/20 0.60
GAA P10253 1/20 0.60
NPC1 O15118 1/20 0.57
POLB P06746 1/20 0.57
CYP2C9 P11712 1/20 0.57
RAB9A P51151 1/20 0.57
FFAR1 O14842 1/20 0.57
FFAR4 Q5NUL3 1/20 0.57
FABP1 P07148 2/20 0.57
RXRA P19793 2/20 0.56
RXRB P28702 2/20 0.56
MRGPRX4 Q96LA9 2/20 0.56
NR4A2 P43354 1/20 0.56
TNKS O95271 1/20 0.54
PARP15 Q460N3 1/20 0.54
PARP14 Q460N5 1/20 0.54
PARP10 Q53GL7 1/20 0.54

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30705230 1.00 AKR1C3 (0.74) AKR1C3KMOKDM4ELMNAGAA
SCHEMBL30307443 0.95 AKR1C3 (0.82) AKR1C3KMOKDM4ELMNAGAA
SCHEMBL30705229 0.95 AKR1C3 (0.82) AKR1C3KMOKDM4ELMNAGAA
SCHEMBL2747020 0.95 AKR1C3 (0.82) AKR1C3KMOKDM4ELMNAGAA
SCHEMBL5042777 0.93 AKR1C3 (0.79) AKR1C3KMOKDM4ELMNAGAA
SCHEMBL5038677 0.92 RXRA (0.67) AKR1C3LMNAGAAFFAR1FFAR4
SCHEMBL30705228 0.92 RXRA (0.67) AKR1C3LMNAGAAFFAR1FFAR4
SCHEMBL1042631 0.89 AKR1C3 (0.92) AKR1C3KMOKDM4ENPC1POLB
SCHEMBL30266789 0.89 AKR1C3 (0.92) AKR1C3KMOKDM4ENPC1POLB
SCHEMBL5042492 0.88 SRD5A2 (0.65) AKR1C3KMOKDM4EFFAR1FFAR4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240043619-A1 POLYIMIDE PRECURSOR RESIN COMPOSITION ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-02-08 US disclosed
WO-2022211086-A1 POLYIMIDE, RESIN COMPOSITION, POLYIMIDE FILM, AND PRODUCTION METHOD THEREFOR 旭化成株式会社 2022-10-06 WO disclosed
US-20210246268-A1 SILICON-CONTAINING COMPOUND SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-08-12 US disclosed
EP-3786213-A1 SILICON-CONTAINING COMPOUND Shin-Etsu Chemical Co., Ltd. (JP) 2021-03-03 EP disclosed
WO-2020241523-A1 POLYIMIDE PRECURSOR AND POLYIMIDE RESIN COMPOSITION 旭化成株式会社 2020-12-03 WO disclosed
US-20190352463-A1 POLYIMIDE PRECURSOR RESIN COMPOSITION ASAHI KASEI KABUSHIKI KAISHA (JP) 2019-11-21 US disclosed
US-20170165879-A1 RESIN PRECURSOR, RESIN COMPOSITION CONTAINING SAME, POLYIMIDE RESIN MEMBRANE, RESIN FILM, AND METHOD FOR PRODUCING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2017-06-15 US disclosed
US-7416822-B2 Resin and resin composition ASAHI KASEI EMD CORPORATION (JP) 2008-08-26 US disclosed
US-20070154843-A1 Resin and resin composition ASAHI KASEI EMD CORPORATION (JP) 2007-07-05 US disclosed
EP-1333050-B1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO (JP) 2006-12-27 EP disclosed
EP-1707588-A1 RESIN AND RESIN COMPOSITION Asahi Kasei EMD Corporation (JP) 2006-10-04 EP disclosed
US-7049371-B2 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2006-05-23 US disclosed
US-20040002572-A1 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2004-01-01 US disclosed
EP-1333050-A1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2003-08-06 EP disclosed
EP-1327653-A1 HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN AND INSULATING FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2003-07-16 EP disclosed
US-6518390-B2 Polybenzoxazole and crosslinking agent SUMITOMO BAKELITE COMPANY, LTD. (JP) 2003-02-11 US disclosed
US-20020013443-A1 Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2002-01-31 US disclosed