SCHEMBL506229

SCHEMBL506229

NC(=O)CCCCCCCC1(C(N)=O)Cc2cccc(c2)C1

nearest known ligand 0.33

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
TBXAS1 P24557 1/20 0.33
LTB4R Q15722 1/20 0.32
MEN1 O00255 1/20 0.31
KMT2A Q03164 1/20 0.31
MPO P05164 1/20 0.30
HDAC3 O15379 1/20 0.30
HDAC4 P56524 1/20 0.30
HDAC1 Q13547 1/20 0.30
HDAC7 Q8WUI4 1/20 0.30
HDAC2 Q92769 1/20 0.30
HDAC10 Q969S8 1/20 0.30
HDAC11 Q96DB2 1/20 0.30
HDAC8 Q9BY41 1/20 0.30
HDAC6 Q9UBN7 1/20 0.30
HDAC9 Q9UKV0 1/20 0.30
HDAC5 Q9UQL6 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL675034 1.00 TBXAS1 (0.33) TBXAS1LTB4RMEN1KMT2AMPO
SCHEMBL676161 1.00 TBXAS1 (0.33) TBXAS1LTB4RMEN1KMT2AMPO
SCHEMBL5616689 0.98 MEN1 (0.32) TBXAS1MEN1KMT2AMPO
SCHEMBL39754 0.94 MTNR1A (0.31)
SCHEMBL11787061 0.87 KDM4E (0.31) TBXAS1MEN1KMT2A
SCHEMBL5613217 0.87 KDM4E (0.31) TBXAS1MEN1KMT2A
SCHEMBL1165196 0.87 KDM4E (0.31) TBXAS1MEN1KMT2A
SCHEMBL3989288 0.87 SPHK2 (0.39) MEN1KMT2AHDAC6
SCHEMBL11801495 0.87 SPHK2 (0.39) MEN1KMT2AHDAC6
SCHEMBL5613236 0.85

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 56 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0272503-B1 MOLDING POLYAMIDE RESIN COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1991-06-26 EP claimed
US-4822846-A POLY(M-XYLENESEBECAMIDE) BLENDED WITH NYLON-610 OR NYLON-612; CHEMICAL RESISTANCE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1989-04-18 US claimed
EP-0272503-A1 Molding polyamide resin composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1988-06-29 EP claimed
JP-2011647-A None JP disclosed
EP-2561970-B1 MULTILAYERED CONTAINER, DIE FOR MULTILAYERED CONTAINER, AND METHOD FOR PRODUCING MULTILAYERED CONTAINER MITSUBISHI GAS CHEMICAL CO (JP) 2021-07-21 EP disclosed
EP-2792714-B2 MOLDED PRODUCTS MITSUBISHI GAS CHEMICAL CO (JP) 2020-09-23 EP disclosed
EP-2626377-B1 POLYAMIDE RESIN MOULDING AND PROCESS MITSUBISHI GAS CHEMICAL CO (JP) 2018-10-24 EP disclosed
EP-2792714-B9 MOLDED PRODUCTS MITSUBISHI GAS CHEMICAL CO (JP) 2018-04-04 EP disclosed
EP-2682252-B1 STRETCHED POLYAMIDE FILM TOYO BOSEKI (JP) 2018-01-10 EP disclosed
EP-2352783-B1 POLYAMIDE AND BIORESOURCED REINFORCEMENT COMPOSITIONS ARKEMA FRANCE (FR) 2017-08-23 EP disclosed
EP-2792714-B1 MOLDED PRODUCTS MITSUBISHI GAS CHEMICAL CO (JP) 2017-08-23 EP disclosed
US-5019439-A Gas barriers JSP CORPORATION (JP) 1991-05-28 US disclosed
JP-H0211647-A POLYAMIDE COMPOSITION TOYOBO CO LTD 1990-01-16 JP disclosed
EP-0337719-A2 Method of producing thermoplastic resin film and cushioning material using same JSP CORPORATION (JP) 1989-10-18 EP disclosed
US-4822846-A POLY(M-XYLENESEBECAMIDE) BLENDED WITH NYLON-610 OR NYLON-612; CHEMICAL RESISTANCE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1989-04-18 US disclosed
US-4822846-A POLY(M-XYLENESEBECAMIDE) BLENDED WITH NYLON-610 OR NYLON-612; CHEMICAL RESISTANCE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1989-04-18 US disclosed
EP-0272503-A1 Molding polyamide resin composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1988-06-29 EP disclosed
EP-0272503-A1 Molding polyamide resin composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1988-06-29 EP disclosed
EP-0254531-A2 Cushioning material Japan Styrene Paper Corporation (JP) 1988-01-27 EP disclosed
US-3946089-A Block copolymer of polyamide and polyether, and its preparation and use TOYO BOSEKI KABUSHIKI KAISHA (JA) 1976-03-23 US disclosed