SCHEMBL5070177

SCHEMBL5070177

CCC(F)OC(=O)C(F)=C(F)F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10699251 0.78 THRB (0.31)
SCHEMBL5069798 0.76 ALDH1A1 (0.34)
SCHEMBL618450 0.74 TSHR (0.42)
SCHEMBL608721 0.74 ALDH1A1 (0.35)
SCHEMBL18632237 0.72
SCHEMBL608722 0.72
SCHEMBL5886448 0.72 TSHR (0.43)
SCHEMBL27813389 0.72
SCHEMBL27903545 0.70
SCHEMBL27870975 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110256625-A Highly filled fluorine-containing hydroxy polyacrylate aqueous dispersion and the preparation method and application thereof 华南理工大学 2019-09-20 CN claimed
EP-3077429-A1 SOFT HYDROPHOBIC ACRYLIC MATERIALS Novartis AG (CH) 2016-10-12 EP claimed
WO-2015084786-A1 SOFT HYDROPHOBIC ACRYLIC MATERIALS NOVARTIS AG (CH) 2015-06-11 WO claimed
US-7022381-B2 Method for producing high dielectric strength microvalves SANDIA NATIONAL LABORATORIES (US) 2006-04-04 US claimed
US-20040123658-A1 High dielectric strength microvalves NATIONAL TECHNOLOGY & ENGINEERING SOLUTIONS OF SANDIA, LLC 2004-07-01 US claimed
US-20020160256-A1 Non-aqueous electrolyte secondary battery DENSO CORPORATION (JP) 2002-10-31 US claimed
CN-106132689-B The manufacture method of stack membrane and stack membrane 东丽株式会社 2018-01-23 CN disclosed
CN-104903102-B Stack membrane 东丽株式会社 2017-12-19 CN disclosed
CN-103620447-B The manufacture method of moulding material, coating composition and moulding material 东丽株式会社 2016-12-21 CN disclosed
CN-106132689-A Stack membrane and the manufacture method of stack membrane 东丽株式会社 2016-11-16 CN disclosed
CN-103492190-B Recording medium HEWLETT-PACKARD DEVELOPMENT CO.,L.P. (US) 2015-10-07 CN disclosed
CN-104903102-A Laminated film TORAY INDUSTRIES 2015-09-09 CN disclosed
CN-101052667-B Liquid fluorochemical composition for surface treatment of mineral and non-mineral substrates EVONIK DEGUSSA GMBH 2012-01-04 CN disclosed
EP-1339113-B1 PACKAGING MATERIAL FOR ELECTRONIC-PART CASE, AND OTHERS SHOWA DENKO PACKAGING CO (JP) 2008-04-09 EP disclosed
US-7022381-B2 Method for producing high dielectric strength microvalves SANDIA NATIONAL LABORATORIES (US) 2006-04-04 US disclosed
US-7022391-B2 acrylic polymer layer having hindered amine, cycloalkyl or benzotriazole groups between an aluminum foil layer and a thermoplastic resin not-drawn film inner layer; heat resistant resin drawn film outer layer SHOWA DENKO PACKAGING CO. (JP) 2006-04-04 US disclosed
US-20040142190-A1 acrylic polymer layer having hindered amine, cycloalkyl or benzotriazole groups between an aluminum foil layer and a thermoplastic resin not-drawn film inner layer; heat resistant resin drawn film outer layer SHOWA DENKO PACKAGING CO. (JP) 2004-07-22 US disclosed
US-20040123658-A1 High dielectric strength microvalves NATIONAL TECHNOLOGY & ENGINEERING SOLUTIONS OF SANDIA, LLC 2004-07-01 US disclosed
EP-1339113-A1 PACKAGING MATERIAL FOR ELECTRONIC-PART CASE, AND OTHERS Showa Denko Packaging Co. (JP) 2003-08-27 EP disclosed
US-20020160256-A1 Non-aqueous electrolyte secondary battery DENSO CORPORATION (JP) 2002-10-31 US disclosed