Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3795192 | 0.86 | ALDH1A1 (0.36) | ALDH1A1MAPT | |
| SCHEMBL5886602 | 0.76 | TSHR (0.37) | ALDH1A1MAPT | |
| SCHEMBL5070177 | 0.76 | — | — | |
| SCHEMBL4685787 | 0.73 | — | — | |
| SCHEMBL10699251 | 0.72 | THRB (0.31) | — | |
| SCHEMBL5886592 | 0.72 | ALDH1A1 (0.39) | ALDH1A1MAPT | |
| SCHEMBL3925592 | 0.70 | ALDH1A1 (0.35) | ALDH1A1MAPT | |
| SCHEMBL2957666 | 0.69 | MAPT (0.55) | ALDH1A1MAPT | |
| SCHEMBL29074511 | 0.68 | CES2 (0.43) | — | |
| SCHEMBL618450 | 0.68 | TSHR (0.42) | ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1339113-B1 | PACKAGING MATERIAL FOR ELECTRONIC-PART CASE, AND OTHERS | SHOWA DENKO PACKAGING CO (JP) | 2008-04-09 | — | — | EP | disclosed |
| US-7022391-B2 | acrylic polymer layer having hindered amine, cycloalkyl or benzotriazole groups between an aluminum foil layer and a thermoplastic resin not-drawn film inner layer; heat resistant resin drawn film outer layer | SHOWA DENKO PACKAGING CO. (JP) | 2006-04-04 | — | — | US | disclosed |
| EP-0975693-B2 | LIQUID CURABLE RESIN COMPOSITION | KONINK DSM N V (NL) | 2006-01-18 | — | — | EP | disclosed |
| US-20040142190-A1 | acrylic polymer layer having hindered amine, cycloalkyl or benzotriazole groups between an aluminum foil layer and a thermoplastic resin not-drawn film inner layer; heat resistant resin drawn film outer layer | SHOWA DENKO PACKAGING CO. (JP) | 2004-07-22 | — | — | US | disclosed |
| EP-1339113-A1 | PACKAGING MATERIAL FOR ELECTRONIC-PART CASE, AND OTHERS | Showa Denko Packaging Co. (JP) | 2003-08-27 | — | — | EP | disclosed |
| EP-0975693-B1 | LIQUID CURABLE RESIN COMPOSITION | DSM NV (NL) | 2002-12-18 | — | — | EP | disclosed |
| US-6359025-B1 | MINIMUM YELLOWING, DURABILITY | DSM N.V. (NL) | 2002-03-19 | — | — | US | disclosed |
| US-6136880-A | USING PHOTOINITIATOR | DSM N.V. (NL) | 2000-10-24 | — | — | US | disclosed |
| EP-0975693-A1 | LIQUID CURABLE RESIN COMPOSITION | DSM N.V. (NL) | 2000-02-02 | — | — | EP | disclosed |
| WO-1998047954-A9 | LIQUID CURABLE RESIN COMPOSITION | DSM NV (NL) | 1999-12-09 | — | — | WO | disclosed |
| WO-1998047954-A1 | LIQUID CURABLE RESIN COMPOSITION | DSM N.V. (NL) | 1998-10-29 | — | — | WO | disclosed |