SCHEMBL5073201

SCHEMBL5073201

CCCCCCCCOP(O)Oc1ccc(CCCC)cc1CCCC

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HTT P42858 4/20 0.46
MAPT P10636 4/20 0.46
MEN1 O00255 3/20 0.46
KMT2A Q03164 3/20 0.46
MAPK1 P28482 3/20 0.46
RAD52 P43351 2/20 0.46
SMN1; SMN2 Q16637 2/20 0.46
NPC1 O15118 1/20 0.46
NPSR1 Q6W5P4 1/20 0.46
APAF1 O14727 2/20 0.44
THRB P10828 1/20 0.44
L3MBTL1 Q9Y468 1/20 0.44
ALDH1A1 P00352 2/20 0.43
KDM4E B2RXH2 1/20 0.43
LMNA P02545 1/20 0.43
POLB P06746 1/20 0.43
BLM P54132 1/20 0.43
TDP1 Q9NUW8 1/20 0.43
PPARG P37231 1/20 0.39
PPARA Q07869 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13506691 0.88 HTT (0.49) HTTMAPTMEN1KMT2AMAPK1
SCHEMBL10730145 0.88 HTT (0.49) HTTMAPTMEN1KMT2AMAPK1
SCHEMBL7949242 0.83 HTT (0.45) HTTMAPTMEN1KMT2AMAPK1
SCHEMBL28977532 0.82 THRA (0.49) MAPTMEN1KMT2ATHRBALDH1A1
SCHEMBL28058769 0.82 HTT (0.41) HTTMAPTMEN1KMT2AMAPK1
SCHEMBL22749527 0.82 THRA (0.49) MAPTMEN1KMT2ATHRBALDH1A1
SCHEMBL9239878 0.82 HTT (0.49) HTTMAPTMEN1KMT2AMAPK1
SCHEMBL28354766 0.82 HTT (0.49) HTTMAPTMEN1KMT2AMAPK1
SCHEMBL31290840 0.82 HTT (0.45) HTTMAPTMEN1KMT2AMAPK1
SCHEMBL2715741 0.82 HTT (0.45) HTTMAPTMEN1KMT2AMAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112442272-B Maleimide resin film and composition for maleimide resin film 信越化学工业株式会社 2024-06-25 CN disclosed
CN-116004005-A Cyclic imide resin composition, liquid adhesive, film, prepreg, copper-clad laminate, and printed wiring board 信越化学工业株式会社 2023-04-25 CN disclosed
CN-115701446-A Thermosetting resin composition 信越化学工业株式会社 2023-02-10 CN disclosed
CN-114656788-A Cyclic imide resin composition, prepreg, copper-clad laminate, and printed circuit board 信越化学工业株式会社 2022-06-24 CN disclosed
CN-112442272-A Maleimide resin film and composition for maleimide resin film 信越化学工业株式会社 2021-03-05 CN disclosed
US-7351766-B2 polycrbonate compatible homo/copolymer of akyl(meth)acrylate, copolymer of an aromatic alkenyl -vinyl cyanide monomer, copolymer of alkyl(meth)acrylate- vinyl cyanide or aromatic alkenyl monomer graft polymerized with polycarbonate incompatible polyalkyl(meth)acrylate or polyorganosiloxane; fluidity MITSUBISHI RAYON CO., LTD. (JP) 2008-04-01 US disclosed
US-20050159533-A1 polycrbonate compatible homo/copolymer of akyl(meth)acrylate, copolymer of an aromatic alkenyl -vinyl cyanide monomer, copolymer of alkyl(meth)acrylate- vinyl cyanide or aromatic alkenyl monomer graft polymerized with polycarbonate incompatible polyalkyl(meth)acrylate or polyorganosiloxane; fluidity MITSUBISHI RAYON CO., LTD. (JP) 2005-07-21 US disclosed