SCHEMBL5082248

SCHEMBL5082248

COc1c(Cl)cc(S(=O)(=O)O)cc1Cl.[NaH]

nearest known ligand 0.44

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
▸ ALDH1A1 P00352 3/20 0.44
▸ KDM4E B2RXH2 2/20 0.44
▸ GAA P10253 1/20 0.44
▸ PTGS2 P35354 7/20 0.42
▸ PTGS1 P23219 2/20 0.41
▸ TPMT P51580 1/20 0.41
▸ TAS1R3 Q7RTX0 3/20 0.38
▸ TAS1R1 Q7RTX1 3/20 0.38
▸ TAS1R2 Q8TE23 3/20 0.38
▸ HPGD P15428 1/20 0.38
▸ LCK P06239 1/20 0.36
▸ FYN P06241 1/20 0.36
▸ HSD17B10 Q99714 1/20 0.36
▸ SLC2A1 P11166 1/20 0.35
▸ LMNA P02545 1/20 0.35
▸ ING2 Q9H160 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11856695 0.98 ALDH1A1 (0.46) ALDH1A1KDM4EGAAPTGS2PTGS1
SCHEMBL11344310 0.85 NT5E (0.41) ALDH1A1KDM4EGAAPTGS2PTGS1
SCHEMBL14120915 0.79 PTGS2 (0.44) ALDH1A1KDM4EGAAPTGS2PTGS1
SCHEMBL24539858 0.77 CXCR5 (0.36) ALDH1A1LCKFYNING2
SCHEMBL13966789 0.77 ABCB11 (0.39) ALDH1A1KDM4EGAALCKFYN
SCHEMBL5082244 0.76 PTGS2 (0.45) ALDH1A1KDM4EGAAPTGS2PTGS1
SCHEMBL10498837 0.76 ALDH1A1 (0.52) ALDH1A1PTGS2PTGS1HPGDLMNA
SCHEMBL2217165 0.75 CYP3A4 (0.52) ALDH1A1KDM4EGAAPTGS2HPGD
SCHEMBL11802845 0.75 TDP1 (0.54) ALDH1A1KDM4ETPMTHPGDLCK
SCHEMBL16308957 0.75 ALDH1A1 (0.42) ALDH1A1GAALCKFYNLMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1497374-B1 FILLER REINFORCED POLYETHER IMIDE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF GEN ELECTRIC (US) 2008-08-13 — — EP disclosed
US-7244778-B2 Filler reinforced polyether imide resin composition and molded article thereof GENERAL ELECTRIC COMPANY (US) 2007-07-17 — — US disclosed
US-20050131105-A1 Filler reinforced polyether imide resin composition and molded article thereof SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2005-06-16 — — US disclosed
EP-1497374-A1 FILLER REINFORCED POLYETHER IMIDE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF GENERAL ELECTRIC COMPANY (US) 2005-01-19 — — EP disclosed
WO-2003087226-A1 FILLER REINFORCED POLYETHER IMIDE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF GENERAL ELECTRIC COMPAMY (US) 2003-10-23 — — WO disclosed
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