SCHEMBL5082270

SCHEMBL5082270

O=C(c1ccc(Cl)cc1)c1ccc(Cl)c(S(=O)(=O)O)c1.[BaH2]

nearest known ligand 0.56

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
MMP2 P08253 2/20 0.49
SRD5A2 P31213 3/20 0.47
MAPK1 P28482 2/20 0.47
ITGA1 P56199 2/20 0.43
HPGD P15428 1/20 0.42
CNR1 P21554 1/20 0.41
CNR2 P34972 1/20 0.41
MEN1 O00255 1/20 0.41
KMT2A Q03164 1/20 0.41
TDP1 Q9NUW8 1/20 0.41
FLT1 P17948 1/20 0.41
FLT4 P35916 1/20 0.41
KDR P35968 1/20 0.41
ELANE P08246 1/20 0.41
VCAM1 P19320 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL250228 0.98 MMP2 (0.50) MMP2SRD5A2MAPK1ITGA1HPGD
SCHEMBL5082310 0.97 MMP2 (0.49) MMP2SRD5A2MAPK1ITGA1HPGD
SCHEMBL250653 0.91 MMP2 (0.51) MMP2SRD5A2MEN1KMT2ATDP1
SCHEMBL2572655 0.90 MMP2 (0.50) MMP2SRD5A2MEN1KMT2ATDP1
SCHEMBL4365596 0.90 MMP2 (0.50) MMP2SRD5A2MEN1KMT2ATDP1
SCHEMBL4365592 0.90 MMP2 (0.50) MMP2SRD5A2MEN1KMT2ATDP1
SCHEMBL11586064 0.85 VCAM1 (0.51) MMP2SRD5A2ITGA1MEN1KMT2A
SCHEMBL8009870 0.85 MMP2 (0.48) MMP2SRD5A2MAPK1ITGA1MEN1
SCHEMBL5082265 0.83 MMP2 (0.49) MMP2SRD5A2MAPK1ITGA1HPGD
SCHEMBL5082308 0.82 MMP2 (0.48) MMP2SRD5A2MAPK1ITGA1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1497374-B1 FILLER REINFORCED POLYETHER IMIDE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF GEN ELECTRIC (US) 2008-08-13 EP disclosed
US-7244778-B2 Filler reinforced polyether imide resin composition and molded article thereof GENERAL ELECTRIC COMPANY (US) 2007-07-17 US disclosed
US-20050131105-A1 Filler reinforced polyether imide resin composition and molded article thereof SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2005-06-16 US disclosed
EP-1497374-A1 FILLER REINFORCED POLYETHER IMIDE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF GENERAL ELECTRIC COMPANY (US) 2005-01-19 EP disclosed
WO-2003087226-A1 FILLER REINFORCED POLYETHER IMIDE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF GENERAL ELECTRIC COMPAMY (US) 2003-10-23 WO disclosed