SCHEMBL5137448

SCHEMBL5137448

O=S(=O)(O)c1cc(Br)c(Br)s1.[NaH]

nearest known ligand 0.41

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.41
POLB P06746 2/20 0.41
MAPT P10636 2/20 0.41
GSK3B P49841 2/20 0.38
GAA P10253 1/20 0.38
RAB9A P51151 1/20 0.38
P4HTM Q9NXG6 1/20 0.37
MMP8 P22894 2/20 0.36
MMP3 P08254 1/20 0.36
PLAU P00749 1/20 0.35
HTR7 P34969 1/20 0.33
MEN1 O00255 2/20 0.33
KMT2A Q03164 2/20 0.33
KDM4E B2RXH2 1/20 0.30
ALDH1A1 P00352 1/20 0.30
HTT P42858 1/20 0.30
L3MBTL1 Q9Y468 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3193588 0.98 LMNA (0.41) LMNAPOLBMAPTGSK3BGAA
Hydrochloric Acid SCHEMBL27591757 0.96 LMNA (0.41) LMNAPOLBMAPTGSK3BGAA
SCHEMBL5137805 0.96 LMNA (0.41) LMNAPOLBMAPTGSK3BGAA
SCHEMBL5524092 0.77 CA2 (0.44) LMNAPOLBMAPTGAARAB9A
SCHEMBL2914595 0.77 FBP1 (0.44)
SCHEMBL630120 0.76 LMNA (0.41) LMNAPOLBMAPTGSK3BGAA
SCHEMBL13450815 0.76 MAPT (0.41) LMNAPOLBMAPTGSK3BGAA
Hydrochloric Acid SCHEMBL27779742 0.75 FBP1 (0.43)
SCHEMBL5137447 0.74 LMNA (0.41) LMNAPOLBMAPTGSK3BGAA
SCHEMBL5137804 0.74 LMNA (0.41) LMNAPOLBMAPTGSK3BGAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1497374-B1 FILLER REINFORCED POLYETHER IMIDE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF GEN ELECTRIC (US) 2008-08-13 EP disclosed
US-7244778-B2 Filler reinforced polyether imide resin composition and molded article thereof GENERAL ELECTRIC COMPANY (US) 2007-07-17 US disclosed
US-20050131105-A1 Filler reinforced polyether imide resin composition and molded article thereof SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2005-06-16 US disclosed
EP-1497374-A1 FILLER REINFORCED POLYETHER IMIDE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF GENERAL ELECTRIC COMPANY (US) 2005-01-19 EP disclosed
WO-2003087226-A1 FILLER REINFORCED POLYETHER IMIDE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF GENERAL ELECTRIC COMPAMY (US) 2003-10-23 WO disclosed