SCHEMBL514111

SCHEMBL514111

CC1=C(C)C(C)(C)C([Os]C2=C(C)C(C)=C(C)C2(C)C)=C1C

nearest known ligand 0.33

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
CTSD P07339 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2230540 0.73 CTSD (0.43) CTSD
SCHEMBL4742800 0.67 CTSD (0.35) CTSD
SCHEMBL8052129 0.67 CTSD (0.35) CTSD
SCHEMBL27712901 0.67 CTSD (0.35) CTSD
SCHEMBL28961651 0.65 CTSD (0.38) CTSD
Hydrochloric Acid SCHEMBL15023076 0.65 CTSD (0.33) CTSD
SCHEMBL334727 0.65 CTSD (0.33) CTSD
SCHEMBL782177 0.65 CTSD (0.33) CTSD
SCHEMBL9472583 0.63 CTSD (0.32) CTSD
SCHEMBL28475566 0.61 CTSD (0.31) CTSD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118204074-A Cyclic ether MOF stabilized solitary atom catalyst and preparation and application thereof 中国科学院大连化学物理研究所 2024-06-18 CN claimed
CN-109719304-B Method for preparing noble metal lone atoms in solution and application 中国科学院大连化学物理研究所 2022-08-09 CN claimed
EP-4591122-A1 BAKE-SENSITIVE UNDERLAYERS TO REDUCE DOSE TO SIZE OF EUV PHOTORESIST Lam Research Corporation (US) 2025-07-30 EP disclosed
WO-2025058006-A1 PHOTOCURABLE ADHESIVE COMPOSITION, BONDED BODY, AND 2-CYANOACRYLATE COMPOSITION FOR PHOTOCURABLE ADHESIVE 東亞合成株式会社 2025-03-20 WO disclosed
WO-2025047585-A1 METHOD FOR PRODUCING JOINED BODY 東亞合成株式会社 2025-03-06 WO disclosed
WO-2024233496-A1 OXIDATIVE SURFACE TREATMENTS ON UNDERLAYERS TO REDUCE THE DOSE TO SIZE OF EUV PHOTORESISTS LAM RESEARCH CORPORATION (US) 2024-11-14 WO disclosed
WO-2024064071-A1 BAKE-SENSITIVE UNDERLAYERS TO REDUCE DOSE TO SIZE OF EUV PHOTORESIST LAM RESEARCH CORPORATION (US) 2024-03-28 WO disclosed
CN-109719304-B Method for preparing noble metal lone atoms in solution and application 中国科学院大连化学物理研究所 2022-08-09 CN disclosed
EP-3074450-B1 MOISTURE CURABLE COMPOUND WITH METAL-ARENE COMPLEXES MOMENTIVE PERFORMANCE MAT INC (US) 2020-11-11 EP disclosed
CN-105793326-B Moisture-curable compositions with metal-arene complexes 莫门蒂夫性能材料股份有限公司 2020-07-21 CN disclosed
EP-3539655-A1 METHOD FOR PREPARING PRECIOUS METAL ISOLATED ATOMS IN SOLUTION, AND APPLICATIONS THEREOF Dalian Institute of Chemical Physics, Chinese Academy of Sciences (CN) 2019-09-18 EP disclosed
US-20040005753-A1 Method of growing electrical conductors ASM INTERNATIONAL N.V. (NL) 2004-01-08 US disclosed
US-20030096468-A1 Method of growing electrical conductors ASM INTERNATIONAL N.V. (NL) 2003-05-22 US disclosed
EP-1124159-B1 Photocurable composition THREE BOND CO LTD (JP) 2003-03-12 EP disclosed
US-6503959-B1 Composition also including cleavage photoinitiator THREE BOND CO., LTD. (JP) 2003-01-07 US disclosed
US-6482740-B2 REDUCTION OF METAL OXIDE TO FORM METAL FILM ASM MICROCHEMISTRY OY (FI) 2002-11-19 US disclosed
US-20020004293-A1 Method of growing electrical conductors ASM INTERNATIONAL N.V. (NL) 2002-01-10 US disclosed
EP-0769721-B1 Photocurable composition THREE BOND CO LTD (JP) 2002-01-02 EP disclosed
EP-1124159-A1 Photocurable composition THREE BOND CO., LTD. (JP) 2001-08-16 EP disclosed
EP-0769721-A1 Photocurable composition THREE BOND CO., LTD. (JP) 1997-04-23 EP disclosed