SCHEMBL5145803

SCHEMBL5145803

CCCCCCCCOC(=O)c1[c]cccc1

nearest known ligand 0.62

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.62
TSHR P16473 4/20 0.62
LMNA P02545 2/20 0.62
CYP3A4 P08684 2/20 0.59
MAPK1 P28482 2/20 0.59
TP53 P04637 1/20 0.59
HSD17B10 Q99714 2/20 0.55
KDM4E B2RXH2 1/20 0.55
POLB P06746 1/20 0.55
TDP1 Q9NUW8 2/20 0.53
L3MBTL1 Q9Y468 2/20 0.53
NPC1 O15118 1/20 0.50
MAPT P10636 1/20 0.50
RAB9A P51151 1/20 0.50
MMP2 P08253 1/20 0.48
PPARG P37231 3/20 0.47
CNR2 P34972 1/20 0.47
MMP1 P03956 1/20 0.47
MMP9 P14780 1/20 0.47
MMP12 P39900 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4623124 1.00 ALDH1A1 (0.62) ALDH1A1TSHRLMNACYP3A4MAPK1
SCHEMBL5144058 1.00 ALDH1A1 (0.62) ALDH1A1TSHRLMNACYP3A4MAPK1
SCHEMBL4630885 1.00 ALDH1A1 (0.62) ALDH1A1TSHRLMNACYP3A4MAPK1
SCHEMBL4698719 1.00 ALDH1A1 (0.62) ALDH1A1TSHRLMNACYP3A4MAPK1
SCHEMBL4630359 0.98 TSHR (0.61) ALDH1A1TSHRLMNACYP3A4MAPK1
SCHEMBL131719 0.94 TSHR (0.60) ALDH1A1TSHRLMNACYP3A4MAPK1
SCHEMBL130905 0.87 ALDH1A1 (0.58) ALDH1A1TSHRLMNACYP3A4MAPK1
SCHEMBL10445790 0.85 TSHR (0.49) ALDH1A1TSHRLMNACYP3A4MAPK1
SCHEMBL5147088 0.84 TSHR (0.49) ALDH1A1TSHRLMNACYP3A4MAPK1
SCHEMBL11416341 0.84 TSHR (0.49) ALDH1A1TSHRLMNACYP3A4MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11886119-B2 Material for forming underlayer film, resist underlayer film, method of producing resist underlayer film, and laminate MITSUI CHEMICALS, INC. (JP) 2024-01-30 US disclosed
CN-110709774-B Underlayer film forming material, resist underlayer film, method for producing resist underlayer film, and laminate 三井化学株式会社 2023-12-08 CN disclosed
US-20230185195-A1 MATERIAL FOR FORMING UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD OF PRODUCING RESIST UNDERLAYER FILM, AND LAMINATE MITSUI CHEMICALS, INC. (JP) 2023-06-15 US disclosed
US-11599025-B2 Resin material for forming underlayer film, resist underlayer film, method of producing resist underlayer film, and laminate MITSUI CHEMICALS, INC. (JP) 2023-03-07 US disclosed
US-20220050379-A1 MATERIAL FOR FORMING UNDERLAYER FILM, RESIST UNDERLAYER FILM, AND LAMINATE MITSUI CHEMICALS, INC. (JP) 2022-02-17 US disclosed
EP-3922456-A1 MATERIAL FOR UNDERLAYER FILM FORMATION USE, RESIST UNDERLAYER FILM, AND LAMINATE Mitsui Chemicals, Inc. (JP) 2021-12-15 EP disclosed
CN-113365820-A Material for forming underlayer film, resist underlayer film, and laminate 三井化学株式会社 2021-09-07 CN disclosed
US-20200264511-A1 MATERIAL FOR FORMING UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD OF PRODUCING RESIST UNDERLAYER FILM, AND LAMINATE MITSUI CHEMICALS, INC. (JP) 2020-08-20 US disclosed
WO-2020162183-A1 MATERIAL FOR UNDERLAYER FILM FORMATION USE, RESIST UNDERLAYER FILM, AND LAMINATE 三井化学株式会社 2020-08-13 WO disclosed
EP-3693793-A1 RESIN MATERIAL FOR FORMING UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD FOR PRODUCING RESIST UNDERLAYER FILM, AND LAYERED PRODUCT Mitsui Chemicals, Inc. (JP) 2020-08-12 EP disclosed
US-20200241419-A1 RESIN MATERIAL FOR FORMING UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD OF PRODUCING RESIST UNDERLAYER FILM, AND LAMINATE MITSUI CHEMICALS, INC. (JP) 2020-07-30 US disclosed
CN-110709774-A Material for forming underlayer film, resist underlayer film, method for producing resist underlayer film, and laminate 三井化学株式会社 2020-01-17 CN disclosed
US-7205083-B2 Recording material FUJIFILM CORPORATION (JP) 2007-04-17 US disclosed
US-20040082472-A1 Recording material FUJI PHOTO FILM CO., LTD. 2004-04-29 US disclosed