SCHEMBL516226

SCHEMBL516226

CCCN(CCC)c1cccc2ccccc12

nearest known ligand 0.48

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
SIGMAR1 Q99720 3/20 0.48
CRHR1 P34998 6/20 0.48
HTR1B P28222 2/20 0.46
HTR1D P28221 1/20 0.46
ALDH1A1 P00352 1/20 0.43
KMT2A Q03164 1/20 0.43
L3MBTL1 Q9Y468 1/20 0.42
CYP1A2 P05177 1/20 0.41
CYP2D6 P10635 1/20 0.41
CYP2C19 P33261 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7772408 0.92 SIGMAR1 (0.53) SIGMAR1CRHR1HTR1BHTR1DALDH1A1
SCHEMBL9051240 0.89 SIGMAR1 (0.43) SIGMAR1CRHR1HTR1BHTR1DALDH1A1
SCHEMBL1509321 0.89 HTR1B (0.50) SIGMAR1CRHR1HTR1BHTR1DALDH1A1
SCHEMBL29862254 0.89 HTR1B (0.50) SIGMAR1CRHR1HTR1BHTR1DALDH1A1
SCHEMBL30301305 0.89 HTR1B (0.50) SIGMAR1CRHR1HTR1BHTR1DALDH1A1
Hydrochloric Acid SCHEMBL25414408 0.88 CRHR1 (0.41) SIGMAR1CRHR1HTR1BHTR1DALDH1A1
SCHEMBL28024667 0.87 HTR1B (0.45) SIGMAR1CRHR1HTR1BHTR1DALDH1A1
SCHEMBL28680127 0.85 HTR1B (0.44) SIGMAR1HTR1BHTR1DALDH1A1KMT2A
SCHEMBL28159089 0.85 HTR1B (0.44) SIGMAR1HTR1BHTR1DALDH1A1KMT2A
SCHEMBL27875483 0.85 HTR1B (0.44) SIGMAR1HTR1BHTR1DALDH1A1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2020129373-A1 UNSATURATED POLYESTER RESIN COMPOSITION AND CURED PRODUCT OF SAID COMPOSITION 昭和電工株式会社 2020-06-25 WO disclosed
CN-105074514-A Polarizing plate SUMITOMO CHEMICAL CO 2015-11-18 CN disclosed
CN-103890056-B Carbon fiber-reinforced thermoplastic resin composition, molding material, prepreg, and methods for producing same TORAY INDUSTRIES 2015-07-22 CN disclosed
EP-2738010-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR PRODUCING RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR PRODUCING RELIEF PRINTING PLATE, AND RELIEF PRINTING PLATE FUJIFILM Corporation (JP) 2014-06-04 EP disclosed
EP-2481583-B1 Resin composition for laser engraving, relief printing plate precursor for laser engraving, and relief printing plate and process for making the same FUJIFILM CORP (JP) 2014-05-28 EP disclosed
US-20140130693-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR PRODUCING RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR MAKING RELIEF PRINTING PLATE, AND RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2014-05-15 US disclosed
EP-2393666-B1 RELIEF PRINTING PLATE FUJIFILM CORP (JP) 2014-01-15 EP disclosed
US-8618208-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving and process for producing the same, and relief printing plate and process for making the same FUJIFILM CORPORATION (JP) 2013-12-31 US disclosed
US-8541534-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate and method for producing relief printing plate FUJIFILM CORPORATION (JP) 2013-09-24 US disclosed
CN-102300719-B Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate and method for producing relief printing plate FUJIFILM CORP 2013-09-04 CN disclosed
US-20120135196-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING THE SAME, AND RELIEF PRINTING PLATE AND PROCESS FOR MAKING THE SAME FUJIFILM CORPORATION (JP) 2012-05-31 US disclosed
CN-102436139-A Resin composition for laser engraving, relief printing plate precursor for laser engraving and process for producing the same, relief printing plate and process for making the same FUJIFILM CORP 2012-05-02 CN disclosed
US-20120024224-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING THE SAME, AND RELIEF PRINTING PLATE AND PROCESS FOR MAKING THE SAME FUJIFILM CORPORATION (JP) 2012-02-02 US disclosed
CN-102300719-A Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate and method for producing relief printing plate 2011-12-28 CN disclosed
US-20110076454-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING STARTING PLATE FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, AND RELIEF PRINTING PLATE AND PROCESS FOR MAKING SAME FUJIFILM CORPORATION (JP) 2011-03-31 US disclosed
EP-2301750-A1 Resin composition for laser engraving, relief printing starting plate for laser engraving and process for producing the same Fujifilm Corporation (JP) 2011-03-30 EP disclosed
WO-2010090345-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2010-08-12 WO disclosed
EP-0206621-B1 PROCESS FOR DISPROPORTIONATING SILANES MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-11-15 EP disclosed
US-4500715-A CHEMICAL INTERMEDIATES FOR PLANT SAFENING AGENTS AND DYES BAYER AKTIENGESELLSCHAFT (DE) 1985-02-19 US disclosed
US-4268438-A Cationic 1,3,4-thiadiazole dyestuffs BAYER AKTIENGESELLSCHAFT (DE) 1981-05-19 US disclosed