Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.42 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.42 |
| ▸ | TSHR | P16473 | 1/20 | 0.42 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.42 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.41 |
| ▸ | NPC1 | O15118 | 1/20 | 0.41 |
| ▸ | LMNA | P02545 | 1/20 | 0.41 |
| ▸ | MAPT | P10636 | 1/20 | 0.41 |
| ▸ | HPGD | P15428 | 1/20 | 0.41 |
| ▸ | RAB9A | P51151 | 1/20 | 0.41 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.41 |
| ▸ | ADORA2A | P29274 | 1/20 | 0.40 |
| ▸ | ADORA1 | P30542 | 1/20 | 0.40 |
| ▸ | PGR | P06401 | 1/20 | 0.39 |
| ▸ | PNMT | P11086 | 1/20 | 0.38 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.37 |
| ▸ | EGFR | P00533 | 1/20 | 0.37 |
| ▸ | ACHE | P22303 | 5/20 | 0.36 |
| ▸ | FABP4 | P15090 | 1/20 | 0.35 |
| ▸ | BCHE | P06276 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29409550 | 1.00 | ALDH1A1 (0.42) | ALDH1A1CYP3A4TSHRMAPK1KDM4E | |
| SCHEMBL20340068 | 0.87 | ALDH1A1 (0.46) | ALDH1A1CYP3A4TSHRMAPK1KDM4E | |
| SCHEMBL28275364 | 0.83 | ESR2 (0.45) | ALDH1A1KDM4ENPC1LMNAMAPT | |
| SCHEMBL20483771 | 0.83 | CYP3A4 (0.43) | ALDH1A1CYP3A4KDM4ENPC1LMNA | |
| SCHEMBL28311215 | 0.83 | ADORA2A (0.43) | ALDH1A1KDM4ENPC1LMNAMAPT | |
| SCHEMBL25248438 | 0.83 | KDM4E (0.41) | ALDH1A1KDM4ENPC1LMNAMAPT | |
| SCHEMBL29409548 | 0.83 | KDM4E (0.41) | ALDH1A1KDM4ENPC1LMNAMAPT | |
| SCHEMBL31046749 | 0.83 | PGR (0.44) | ALDH1A1CYP3A4TSHRKDM4ENPC1 | |
| SCHEMBL7919926 | 0.83 | PGR (0.44) | ALDH1A1CYP3A4TSHRKDM4ENPC1 | |
| Benzene SCHEMBL28224971 | 0.82 | PGR (0.43) | ALDH1A1CYP3A4TSHRKDM4ENPC1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1407463-A2 | CAPACITOR HAVING EPOXY DIELECTRIC LAYER CURED WITH AMINOPHENYLFLUORENES | 3M Innovative Properties Company (US) | 2004-04-14 | — | — | EP | claimed |
| US-6577492-B2 | Use of 9,9-bis(aminophenyl)fluorene curing agents reduces water adsorption in the dielectric layer | 3M INNOVATIVE PROPERTIES COMPANY | 2003-06-10 | — | — | US | claimed |
| US-20030030966-A1 | Capacitor having epoxy dielectric layer cured with aminophenylfluorenes | 3M INNOVATIVE PROPERTIES COMPANY | 2003-02-13 | — | — | US | claimed |
| WO-2003007319-A2 | CAPACITOR HAVING EPOXY DIELECTRIC LAYER CURED WITH AMINOPHENYLFLUORENES | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2003-01-23 | — | — | WO | claimed |
| CN-119735806-A | Fluorine-free alkali-soluble resin, composition containing the same, cured film, and pattern processing method | 武汉柔显科技股份有限公司 | 2025-04-01 | — | — | CN | disclosed |
| US-11123936-B2 | Resin infusion process for manufacturing fiber-reinforced composites | CYTEC INDUSTRIES INC. (US) | 2021-09-21 | — | — | US | disclosed |
| CN-108367512-B | Resin infusion method for manufacturing fiber reinforced composite material | 塞特工业公司 | 2021-05-28 | — | — | CN | disclosed |
| EP-3233438-B1 | MODIFIED RESIN SYSTEMS SUITABLE FOR LIQUID RESIN INFUSION | CYTEC IND INC (US) | 2021-02-17 | — | — | EP | disclosed |
| CN-107108857-B | Modified resin system suitable for liquid resin infusion | 塞特工业公司 | 2020-07-17 | — | — | CN | disclosed |
| US-10682791-B2 | Modified resin systems suitable for liquid resin infusion | CYTEC INDUSTRIES INC. (US) | 2020-06-16 | — | — | US | disclosed |
| CN-110450494-A | Laminated body and its manufacturing method | SUMITOMO CHEMICAL CO | 2019-11-15 | — | — | CN | disclosed |
| EP-3390023-B1 | RESIN INFUSION PROCESS FOR MANUFACTURING FIBER-REINFORCED COMPOSITES | CYTEC IND INC (US) | 2019-11-06 | — | — | EP | disclosed |
| WO-2016100365-A1 | MODIFIED RESIN SYSTEMS SUITABLE FOR LIQUID RESIN INFUSION | CYTEC INDUSTRIES, INC. (US) | 2016-06-23 | — | — | WO | disclosed |
| EP-1407463-B1 | ELECTRICAL ARTICLE HAVING EPOXY DIELECTRIC LAYER CURED WITH AMINOPHENYLFLUORENES | 3M INNOVATIVE PROPERTIES CO (US) | 2007-02-28 | — | — | EP | disclosed |
| EP-1407463-A2 | CAPACITOR HAVING EPOXY DIELECTRIC LAYER CURED WITH AMINOPHENYLFLUORENES | 3M Innovative Properties Company (US) | 2004-04-14 | — | — | EP | disclosed |
| EP-0826017-B1 | CURABLE RESIN SOLS | MINNESOTA MINING & MFG (US) | 2004-03-31 | — | — | EP | disclosed |
| US-6577492-B2 | Use of 9,9-bis(aminophenyl)fluorene curing agents reduces water adsorption in the dielectric layer | 3M INNOVATIVE PROPERTIES COMPANY | 2003-06-10 | — | — | US | disclosed |
| US-20030030966-A1 | Capacitor having epoxy dielectric layer cured with aminophenylfluorenes | 3M INNOVATIVE PROPERTIES COMPANY | 2003-02-13 | — | — | US | disclosed |
| WO-2003007319-A2 | CAPACITOR HAVING EPOXY DIELECTRIC LAYER CURED WITH AMINOPHENYLFLUORENES | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2003-01-23 | — | — | WO | disclosed |
| US-5648407-A | Curable resin sols and fiber-reinforced composites derived therefrom | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1997-07-15 | — | — | US | disclosed |