SCHEMBL7919926

SCHEMBL7919926

Cc1cc(-c2ccc3c(c2-c2ccc(N)c(C)c2)Cc2ccccc2-3)ccc1N

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PGR P06401 2/20 0.44
ALDH1A1 P00352 3/20 0.43
CYP3A4 P08684 2/20 0.43
TSHR P16473 1/20 0.43
TDP1 Q9NUW8 1/20 0.43
NPC1 O15118 3/20 0.41
RAB9A P51151 3/20 0.41
KDM4E B2RXH2 2/20 0.41
MAPT P10636 2/20 0.41
SMN1; SMN2 Q16637 2/20 0.41
LMNA P02545 1/20 0.41
HPGD P15428 1/20 0.41
PNMT P11086 1/20 0.38
ADORA1 P30542 2/20 0.38
ADORA2A P29274 1/20 0.38
PKM P14618 1/20 0.35
MET P08581 1/20 0.33
SLC6A2 P23975 1/20 0.33
SLC6A4 P31645 1/20 0.33
SLC6A3 Q01959 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31046749 1.00 PGR (0.44) PGRALDH1A1CYP3A4TSHRTDP1
Benzene SCHEMBL28224971 0.99 PGR (0.43) PGRALDH1A1CYP3A4TSHRTDP1
SCHEMBL29800244 0.89 PGR (0.41) PGRALDH1A1CYP3A4TSHRTDP1
SCHEMBL5679834 0.87 ALDH1A1 (0.47) PGRALDH1A1CYP3A4TSHRTDP1
SCHEMBL25248438 0.83 KDM4E (0.41) PGRALDH1A1NPC1RAB9AKDM4E
SCHEMBL5717486 0.83 TLR8 (0.42) PGRALDH1A1CYP3A4NPC1RAB9A
SCHEMBL30314491 0.83 TLR8 (0.42) PGRALDH1A1CYP3A4NPC1RAB9A
SCHEMBL29409550 0.83 ALDH1A1 (0.42) PGRALDH1A1CYP3A4TSHRNPC1
SCHEMBL20483771 0.83 CYP3A4 (0.43) PGRALDH1A1CYP3A4TDP1NPC1
SCHEMBL29921844 0.83 TLR8 (0.42) PGRALDH1A1CYP3A4NPC1RAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110114384-A Curable compositions 3M创新有限公司 2019-08-09 CN claimed
WO-2023085041-A1 POLYIMIDE RESIN, VARNISH, AND POLYIMIDE FILM 三菱瓦斯化学株式会社 2023-05-19 WO disclosed
CN-104379635-B Flexible substrate with thermal stability applied to electronic equipment 阿克隆聚合物系统有限公司 2022-10-28 CN disclosed
CN-114175859-A Insulating layer for multilayer printed circuit board, multilayer printed circuit board including the same, and method for manufacturing the same 株式会社LG化学 2022-03-11 CN disclosed
US-10906855-B2 Method for producing fluorenylidene diallylphenols, and fluorenylidene diallylphenols JFE CHEMICAL CORPORATION (JP) 2021-02-02 US disclosed
US-20200190001-A1 METHOD FOR PRODUCING FLUORENYLIDENE DIALLYLPHENOLS, AND FLUORENYLIDENE DIALLYLPHENOLS JFE CHEMICAL CORPORATION (JP) 2020-06-18 US disclosed
CN-106574163-B Temporary bonding adhesive, adhesive layer, wafer processed body, method for manufacturing semiconductor device using same, polyimide copolymer, polyimide hybrid resin, and resin composition 东丽株式会社 2019-12-03 CN disclosed
CN-110475806-A Polyimides, polyimide solution and Kapton MITSUBISHI GAS CHEMICAL CO 2019-11-19 CN disclosed
CN-110382097-A ASYMMETRIC MEMBRANE 三菱瓦斯化学株式会社 2019-10-25 CN disclosed
CN-110114384-A Curable compositions 3M创新有限公司 2019-08-09 CN disclosed
CN-108603028-A Resin combination, resin layer, permanent adhesive agent, the manufacturing method for pasting bonding agent, stacked film, chip processome and electronic unit or semiconductor devices temporarily 东丽株式会社 2018-09-28 CN disclosed
CN-106029744-B Polyimide resin, resin combination and stacked film using it 东丽株式会社 2018-08-28 CN disclosed
CN-108367512-A Resin infusion method for manufacturing fiber reinforced composite material 塞特工业公司 2018-08-03 CN disclosed
CN-108138013-A Temporary adhesion laminate film uses the substrate processome of temporary adhesion laminate film and the manufacturing method of multilayer board processome and the manufacturing method using their semiconductor devices 东丽株式会社 2018-06-08 CN disclosed
EP-1141073-A1 ELECTRONIC CIRCUIT DEVICE COMPRISING AN EPOXY-MODIFIED AROMATIC VINYL-CONJUGATED DIENE BLOCK COPOLYMER 3M Innovative Properties Company (US) 2001-10-10 EP disclosed
WO-2000039189-A1 ELECTRONIC CIRCUIT DEVICE COMPRISING AN EPOXY-MODIFIED AROMATIC VINYL-CONJUGATED DIENE BLOCK COPOLYMER 3M INNOVATIVE PROPERTIES COMPANY (US) 2000-07-06 WO disclosed
EP-0858488-A1 REACTIVE HOT MELT COMPOSITION, COMPOSITION FOR PREPARATION OF REACTIVE HOT MELT COMPOSITION, AND FILM-FORM HOT MELT ADHESIVE MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1998-08-19 EP disclosed
WO-1997016500-A1 REACTIVE HOT MELT COMPOSITION, COMPOSITION FOR PREPARATION OF REACTIVE HOT MELT COMPOSITION, AND FILM-FORM HOT MELT ADHESIVE MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1997-05-09 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-10906855-B2 Method for producing fluorenylidene diallylphenols, and fluorenylidene diallylphenols AKR7A2, GSTP1, CYP4F2 PGR 2218/4885ALDH1A1 27/4885CYP3A4 38/4885
US-20200190001-A1 METHOD FOR PRODUCING FLUORENYLIDENE DIALLYLPHENOLS, AND FLUORENYLIDENE DIALLYLPHENOLS AKR7A2, GSTP1, CYP4F2 PGR 2218/4885ALDH1A1 27/4885CYP3A4 38/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.