SCHEMBL516688

SCHEMBL516688

NC(=CCc1ccccc1)Cc1ccccc1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAOB P27338 1/20 0.46
CES2 O00748 1/20 0.43
CES1 P23141 1/20 0.43
AKR1B1 P15121 1/20 0.43
IDO1 P14902 3/20 0.42
NOS1 P29475 2/20 0.42
NOS3 P29474 1/20 0.42
NOS2 P35228 1/20 0.42
CA1 P00915 1/20 0.41
CA2 P00918 1/20 0.41
ARG2 P78540 1/20 0.41
HIF1A Q16665 1/20 0.40
KMT2A Q03164 2/20 0.39
ALDH1A1 P00352 1/20 0.39
LMNA P02545 1/20 0.39
GAA P10253 1/20 0.39
HTT P42858 1/20 0.39
SMN1; SMN2 Q16637 1/20 0.39
PLAU P00749 1/20 0.38
MEN1 O00255 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9192371 1.00 MAOB (0.46) MAOBCES2CES1AKR1B1IDO1
SCHEMBL5184996 0.81 CES1 (0.55) CES2CES1AKR1B1IDO1NOS1
SCHEMBL1892258 0.79 MAOB (0.52) MAOBIDO1NOS1NOS3NOS2
SCHEMBL1072789 0.79 MAOB (0.52) MAOBIDO1NOS1NOS3NOS2
SCHEMBL9631890 0.77 MAOB (0.50) MAOBCES2CES1AKR1B1CA1
SCHEMBL18768682 0.77 CES2 (0.46) CES2CES1AKR1B1IDO1NOS1
SCHEMBL3473792 0.77 CES1 (0.46) CES2CES1AKR1B1IDO1NOS1
SCHEMBL31568852 0.77 CTSL (0.47) CES2CES1AKR1B1IDO1NOS1
SCHEMBL4881810 0.76 CYP3A4 (0.49) MAOBCES2CES1AKR1B1HIF1A
SCHEMBL6647228 0.76 CYP3A4 (0.49) MAOBCES2CES1AKR1B1HIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023032492-A1 REACTION ACCELERATOR ENEOS株式会社 2023-03-09 WO disclosed
EP-2738010-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR PRODUCING RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR PRODUCING RELIEF PRINTING PLATE, AND RELIEF PRINTING PLATE FUJIFILM Corporation (JP) 2014-06-04 EP disclosed
EP-2481583-B1 Resin composition for laser engraving, relief printing plate precursor for laser engraving, and relief printing plate and process for making the same FUJIFILM CORP (JP) 2014-05-28 EP disclosed
US-20140130693-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR PRODUCING RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR MAKING RELIEF PRINTING PLATE, AND RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2014-05-15 US disclosed
EP-2393666-B1 RELIEF PRINTING PLATE FUJIFILM CORP (JP) 2014-01-15 EP disclosed
US-8618208-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving and process for producing the same, and relief printing plate and process for making the same FUJIFILM CORPORATION (JP) 2013-12-31 US disclosed
US-8541534-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate and method for producing relief printing plate FUJIFILM CORPORATION (JP) 2013-09-24 US disclosed
US-20130133537-A1 RESIN COMPOSITION FOR LASER ENGRAVING, FLEXOGRAPHIC PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, AND FLEXOGRAPHIC PRINTING PLATE AND PROCESS FOR MAKING SAME FUJIFILM CORPORATION (JP) 2013-05-30 US disclosed
EP-2565046-A2 Resin composition for laser engraving, relief printing plate precursor for laser engraving and process for producing same, process for making relief printing plate, and relief printing plate Fujifilm Corporation (JP) 2013-03-06 EP disclosed
US-20130047878-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, PROCESS FOR MAKING RELIEF PRINTING PLATE, AND RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2013-02-28 US disclosed
US-20110076454-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING STARTING PLATE FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, AND RELIEF PRINTING PLATE AND PROCESS FOR MAKING SAME FUJIFILM CORPORATION (JP) 2011-03-31 US disclosed
EP-2301750-A1 Resin composition for laser engraving, relief printing starting plate for laser engraving and process for producing the same Fujifilm Corporation (JP) 2011-03-30 EP disclosed
WO-2010090345-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2010-08-12 WO disclosed
CN-1159341-C Method for treatment of corticosteroid induced osteopenia ɭ�¿�˹(����)�ɷ����޹�˾ 2004-07-28 CN disclosed
CN-1187203-A Method for treating corticosteroid-induced osteopenia SYNTEX INC (US) 1998-07-08 CN disclosed
EP-0658162-A1 CARBAPENEM DERIVATIVES AND PROCESSES FOR PREPARING THE SAME DONG-A PHARM. CO., LTD. (KR) 1995-06-21 EP disclosed
US-5147750-A Amino group containing polymers; narrow electrostatic charge distribution SANYO CHEMICAL INDUSTRIES, LTD. (JP) 1992-09-15 US disclosed
EP-0206621-B1 PROCESS FOR DISPROPORTIONATING SILANES MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-11-15 EP disclosed
EP-0206621-A1 Process for disproportionating silanes MITSUI TOATSU CHEMICALS, Inc. (JP) 1986-12-30 EP disclosed
EP-0111326-A1 Process for the manufacture of chiral azetidinones F. HOFFMANN-LA ROCHE & CO. Aktiengesellschaft (CH) 1984-06-20 EP disclosed