SCHEMBL5170992

SCHEMBL5170992

CCOC(OCC)[SiH2]CCC[Si](OCC)(OCC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL183067 0.88
SCHEMBL27813321 0.88
SCHEMBL646412 0.79 THRB (0.38)
SCHEMBL704023 0.79 THRB (0.38)
SCHEMBL977221 0.77 THRB (0.33)
SCHEMBL478006 0.77 THRB (0.36)
SCHEMBL6007776 0.77 THRB (0.36)
SCHEMBL3104636 0.77 THRB (0.36)
SCHEMBL5533597 0.74
SCHEMBL554261 0.74 CYP2C19 (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1310142-B1 IMPROVED ADHESION OF POLYMERIC MATERIALS TO METAL SURFACES ATOTECH DEUTSCHLAND GMBH (DE) 2007-05-09 EP claimed
JP-2004536220-A 2004-12-02 JP claimed
EP-1310142-A2 IMPROVED ADHESION OF POLYMERIC MATERIALS TO METAL SURFACES ATOTECH Deutschland GmbH (DE) 2003-05-14 EP claimed
WO-2002079542-A9 IMPROVED ADHESION OF POLYMERIC MATERIALS TO METAL SURFACES ATOTECH DEUTSCHLAND GMBH (DE) 2003-03-20 WO claimed
US-6506314-B1 Intergranular etching; immersing in plating solution con-taining hydrogen peroxide, sulfuric acid or a sulfonic acid, five membered nitrogen heterocyclic compound and such as triphenyl sulfonium chloride ATOTECH DEUTSCHLAND GMBH (DE) 2003-01-14 US claimed
WO-2002079542-A2 IMPROVED ADHESION OF POLYMERIC MATERIALS TO METAL SURFACES ATOTECH DEUTSCHLAND GMBH (DE) 2002-10-10 WO claimed