SCHEMBL51738

SCHEMBL51738

[Cu+2].[Cu+2].[Cu+2].[N-3].[N-3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3630562 0.82
SCHEMBL2204575 0.82
SCHEMBL9901242 0.82
SCHEMBL7897303 0.82
SCHEMBL3290231 0.82
SCHEMBL2429907 0.82
SCHEMBL1002726 0.82
SCHEMBL18889660 0.82
SCHEMBL975457 0.82
SCHEMBL7597370 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 4364 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260136901-A1 COPPER-BASED TUNNELING BARRIER LAYER FOR STRESS REDUCTION IN COPPER STRUCTURES AND METHODS FOR FORMING THE SAME TAIWAN SEMICONDUCTOR MANUFACTURING CO LIMITED (TW) 2026-05-14 US claimed
CN-113380694-B Interconnect structure, semiconductor structure and forming method thereof 台湾积体电路制造股份有限公司 2026-05-12 CN claimed
EP-4736223-A1 CONDUCTIVE MATERIALS FOR DIRECT BONDING Adeia Semiconductor Bonding Technologies Inc. (US) 2026-05-06 EP claimed
US-20260114167-A1 ANTI-REFLECTIVE FILM AND DISPLAY DEVICE INCLUDING THE SAME SAMSUNG DISPLAY CO LTD (KR) 2026-04-23 US claimed
US-12588521-B2 Metal nitride core-shell particle die-attach material WOLFSPEED, INC. (US) 2026-03-24 US claimed
US-20260060021-A1 Method for Stripping Organic Material and Residue from Semiconductor Integrated Circuit IBM (US) 2026-02-26 US claimed
US-20260060065-A1 SEMICONDUCTOR DEVICE INCLUDING INTERCONNECT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2026-02-26 US claimed
US-20260044191-A1 ELECTRONIC DEVICE Innolux Corporation (TW) 2026-02-12 US claimed
US-12532780-B2 Hybrid bonding for semiconductor device assemblies MICRON TECHNOLOGY, INC. (US) 2026-01-20 US claimed
US-20260009147-A1 HIGHLY EFFICIENT COPPER NITRIDE BIMETALLIC CATALYSTS FOR ELECTROCHEMICAL REDUCTION OF ONE OR MORE CARBON OXIDES TO N-PROPANOL AND/OR ETHANOL TOTALENERGIES ONETECH (FR) 2026-01-08 US claimed
EP-0952131-A1 GAS-GENERATING AGENT FOR AIR BAG NIPPON KAYAKU KABUSHIKI KAISHA (JP) 1999-10-27 EP claimed
US-5955219-A CRYSTAL STRUCTURE OF LITHIUM NICKEL COPPER OXIDE COMPOSITE FOR BATTERIES SHARP KABUSHIKI KAISHA (JP) 1999-09-21 US claimed
WO-1999020576-A1 METAL NITRIDES AS PERFORMANCE MODIFIERS FOR GLASS COMPOSITIONS LIBBEY-OWENS-FORD CO. (US) 1999-04-29 WO claimed
EP-0845436-A1 Lithium nickel copper composite oxide and its production process and use SHARP KABUSHIKI KAISHA (JP) 1998-06-03 EP claimed
US-5536339-A Air bag inflator gas compositions and inflator containing the same CONDUCTING MATERIALS CORPORATION (US) 1996-07-16 US claimed
US-4877768-A Processes for the preparation of copper oxide superconductors XEROX CORPORATION (US) 1989-10-31 US claimed
US-4876240-A Processes for the preparation of copper oxide superconductors XEROX CORPORATION (US) 1989-10-24 US claimed
US-4109176-A INSULATING DIELECTRIC FOR GAS DISCHARGE DEVICE OWEN-ILLINOIS, INC. (US) 1978-08-22 US claimed
US-4070182-A Recovery of precious metals from metal sulphides SHERRITT GORDON MINES LIMITED (CA) 1978-01-24 US claimed
US-3936502-A Copper compound catalysts for hydration of nitriles to amides AMERICAN CYANAMID COMPANY (US) 1976-02-03 US claimed