Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 6/20 | 0.46 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.46 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.46 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.42 |
| ▸ | MEN1 | O00255 | 2/20 | 0.37 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.37 |
| ▸ | BRD4 | O60885 | 2/20 | 0.36 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.35 |
| ▸ | HPGD | P15428 | 2/20 | 0.35 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.35 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.35 |
| ▸ | NOS2 | P35228 | 1/20 | 0.35 |
| ▸ | TSHR | P16473 | 1/20 | 0.34 |
| ▸ | HTT | P42858 | 1/20 | 0.34 |
| ▸ | HTR2A | P28223 | 2/20 | 0.34 |
| ▸ | HTR2C | P28335 | 2/20 | 0.34 |
| ▸ | POLB | P06746 | 1/20 | 0.33 |
| ▸ | GAA | P10253 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2083948 | 0.74 | MAPT (0.56) | MAPTTDP1SMN1; SMN2ALDH1A1 | |
| SCHEMBL8648121 | 0.72 | MAOA (0.46) | MAPTSMN1; SMN2ALDH1A1MEN1KMT2A | |
| SCHEMBL9693463 | 0.71 | KDM4E (0.47) | MAPTSMN1; SMN2ALDH1A1MEN1KMT2A | |
| SCHEMBL4655299 | 0.69 | MAPT (0.66) | MAPTTDP1SMN1; SMN2ALDH1A1KDM4E | |
| SCHEMBL22815188 | 0.68 | ALDH1A1 (0.40) | MAPTTDP1ALDH1A1MEN1KMT2A | |
| SCHEMBL3657117 | 0.68 | — | — | |
| SCHEMBL19512122 | 0.67 | — | — | |
| SCHEMBL6179170 | 0.67 | CHRM5 (0.46) | SMN1; SMN2ALDH1A1MEN1KMT2APOLB | |
| SCHEMBL166764 | 0.67 | CHRM5 (0.46) | SMN1; SMN2ALDH1A1MEN1KMT2APOLB | |
| SCHEMBL4153725 | 0.67 | MAPT (0.61) | MAPTTDP1SMN1; SMN2ALDH1A1GAA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12439528-B2 | Method of preparing a high density interconnect printed circuit board including microvias filled with copper | Atotech Deutschland GmbH & Co. KG (DE) | 2025-10-07 | — | — | US | disclosed |
| CN-113924669-B | Copper foil capable of preventing occurrence of wrinkles, electrode comprising the same, secondary battery comprising the same, and method for manufacturing the same | SK纳力世有限公司 | 2025-04-29 | — | — | CN | disclosed |
| US-12245383-B2 | Method of preparing a high density interconnect printed circuit board including microvias filled with copper | Atotech Deutschland GmbH & Co. KG (DE) | 2025-03-04 | — | — | US | disclosed |
| US-20240341042-A1 | METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOARD INCLUDING MICROVIAS FILLED WITH COPPER | Atotech Deutschland GmbH & Co. KG (DE) | 2024-10-10 | — | — | US | disclosed |
| US-12063751-B2 | Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board | Atotech Deutschland GmbH & Co. KG (DE) | 2024-08-13 | — | — | US | disclosed |
| CN-110997983-B | Crease-resistant copper foil, electrode comprising same, secondary battery comprising same, and method for manufacturing same | SK纳力世有限公司 | 2022-10-21 | — | — | CN | disclosed |
| US-20220304164-A1 | MANUFACTURING SEQUENCES FOR HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOARDS AND A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOARD | Atotech Deutschland GmbH & Co. KG (DE) | 2022-09-22 | — | — | US | disclosed |
| US-20220279662-A1 | METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOARD INCLUDING MICROVIAS FILLED WITH COPPER | Atotech Deutschland GmbH & Co. KG (DE) | 2022-09-01 | — | — | US | disclosed |
| EP-4018791-A1 | METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOARD INCLUDING MICROVIAS FILLED WITH COPPER | Atotech Deutschland GmbH & Co. KG (DE) | 2022-06-29 | — | — | EP | disclosed |
| EP-4018790-A1 | MANUFACTURING SEQUENCES FOR HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOARDS AND A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOARD | Atotech Deutschland GmbH & Co. KG (DE) | 2022-06-29 | — | — | EP | disclosed |
| EP-2399281-B1 | PROCESS FOR ELECTRODEPOSITION OF COPPER CHIP TO CHIP, CHIP TO WAFER AND WAFER TO WAFER INTERCONNECTS IN THROUGH-SILICON VIAS (TSV) | ATOTECH DEUTSCHLAND GMBH (DE) | 2016-04-20 | — | — | EP | disclosed |
| CN-102318041-B | PROCESS FOR ELECTRODEPOSITION OF COPPER CHIP TO CHIP, CHIP TO WAFER AND WAFER TO WAFER INTERCONNECTS IN THROUGH-SILICON VIAS (TSV) | ATOTECH DEUTSCHLAND GMBH | 2014-05-07 | — | — | CN | disclosed |
| EP-2611950-B1 | PROCESS FOR ELECTRODEPOSITION OF COPPER CHIP TO CHIP CHIP TO WAFER AND WAFER TO WAFER INTERCONNECTS IN THROUGH-SILICON VIAS (TSV), WITH HEATED SUBSTRATE AND COOLED ELECTROLYTE | ATOTECH DEUTSCHLAND GMBH (DE) | 2013-11-13 | — | — | EP | disclosed |
| EP-2611950-A1 | PROCESS FOR ELECTRODEPOSITION OF COPPER CHIP TO CHIP, CHIP TO WAFER AND WAFER TO WAFER INTERCONNECTS IN THROUGH-SILICON VIAS (TSV) WITH HEATED SUBSTRATE AND COOLED ELECTROLYTE | Atotech Deutschland GmbH (DE) | 2013-07-10 | — | — | EP | disclosed |
| CN-103038397-A | Method for electrodepositing chip-to-chip, chip-to-wafer, and wafer-to-wafer copper interconnects in Through Silicon Vias (TSVs) by heating the substrate and cooling the electrolyte | ATOTECH DEUTSCHLAND GMBH | 2013-04-10 | — | — | CN | disclosed |
| US-20120024713-A1 | PROCESS FOR ELECTRODEPOSITION OF COPPER CHIP TO CHIP, CHIP TO WAFER AND WAFER TO WAFER INTERCONNECTS IN THROUGH-SILICON VIAS (TSV) WITH HEATED SUBSTRATE AND COOLED ELECTROLYTE | ATOTECH DEUTSCHLAND GMBH (DE) | 2012-02-02 | — | — | US | disclosed |
| WO-2012014029-A1 | PROCESS FOR ELECTRODEPOSITION OF COPPER CHIP TO CHIP, CHIP TO WAFER AND WAFER TO WAFER INTERCONNECTS IN THROUGH-SILICON VIAS (TSV) WITH HEATED SUBSTRATE AND COOLED ELECTROLYTE | ATOTECH DEUTSCHLAND GMBH (DE) | 2012-02-02 | — | — | WO | disclosed |
| CN-102318041-A | PROCESS FOR ELECTRODEPOSITION OF COPPER CHIP TO CHIP, CHIP TO WAFER AND WAFER TO WAFER INTERCONNECTS IN THROUGH-SILICON VIAS (TSV) | ATOTECH DEUTSCHLAND GMBH | 2012-01-11 | — | — | CN | disclosed |
| US-20100206737-A1 | PROCESS FOR ELECTRODEPOSITION OF COPPER CHIP TO CHIP, CHIP TO WAFER AND WAFER TO WAFER INTERCONNECTS IN THROUGH-SILICON VIAS (TSV) | ATOTECH DEUTSCHLAND GMBH (DE) | 2010-08-19 | — | — | US | disclosed |