Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 2/20 | 0.56 |
| ▸ | ALDH1A1 | P00352 | 7/20 | 0.54 |
| ▸ | TSHR | P16473 | 4/20 | 0.54 |
| ▸ | NT5E | P21589 | 1/20 | 0.54 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.52 |
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.48 |
| ▸ | HSD17B10 | Q99714 | 4/20 | 0.45 |
| ▸ | CYP2D6 | P10635 | 2/20 | 0.45 |
| ▸ | POLB | P06746 | 1/20 | 0.45 |
| ▸ | DNMT1 | P26358 | 1/20 | 0.41 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.40 |
| ▸ | TIMP3 | P35625 | 1/20 | 0.39 |
| ▸ | NAPRT | Q6XQN6 | 1/20 | 0.37 |
| ▸ | CA12 | O43570 | 2/20 | 0.36 |
| ▸ | CA1 | P00915 | 2/20 | 0.36 |
| ▸ | CA2 | P00918 | 2/20 | 0.36 |
| ▸ | CA7 | P43166 | 2/20 | 0.36 |
| ▸ | HPGD | P15428 | 2/20 | 0.36 |
| ▸ | CA13 | Q8N1Q1 | 1/20 | 0.36 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL565078 | 1.00 | LMNA (0.56) | LMNAALDH1A1TSHRNT5ESMN1; SMN2 | |
| SCHEMBL5590508 | 0.97 | LMNA (0.54) | LMNAALDH1A1TSHRNT5ESMN1; SMN2 | |
| SCHEMBL11610779 | 0.91 | TSHR (0.62) | LMNAALDH1A1TSHRNT5ESMN1; SMN2 | |
| SCHEMBL979380 | 0.84 | LMNA (0.56) | LMNAALDH1A1TSHRNT5ESMN1; SMN2 | |
| SCHEMBL150334 | 0.83 | LMNA (0.77) | LMNAALDH1A1TSHRNT5ESMN1; SMN2 | |
| SCHEMBL14455222 | 0.82 | LMNA (0.41) | LMNAALDH1A1TSHRNT5ESMN1; SMN2 | |
| SCHEMBL27697112 | 0.80 | LMNA (0.52) | LMNAALDH1A1TSHRNT5ESMN1; SMN2 | |
| SCHEMBL7409451 | 0.80 | LMNA (0.52) | LMNAALDH1A1TSHRNT5ESMN1; SMN2 | |
| SCHEMBL1892147 | 0.80 | TSHR (0.55) | LMNAALDH1A1TSHRNT5ESMN1; SMN2 | |
| SCHEMBL28425275 | 0.80 | LMNA (0.52) | LMNAALDH1A1TSHRNT5ESMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 342 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11746433-B2 | Single step electrolytic method of filling through holes in printed circuit boards and other substrates | MACDERMID ENTHONE INC. (US) | 2023-09-05 | — | — | US | claimed |
| CN-112899736-A | PCB high-longitudinal-transverse-through-hole electro-coppering additive and preparation method thereof | 深圳中科利尔科技有限公司 | 2021-06-04 | — | — | CN | claimed |
| US-10982343-B2 | Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate | ATOTECH DEUTSCHLAND GMBH (DE) | 2021-04-20 | — | — | US | claimed |
| CN-111295468-B | Electroplating composition for electrolytic copper deposition, use thereof and method for electrolytic deposition of a copper or copper alloy layer on at least one surface of a substrate | 安美特德国有限公司 | 2021-03-30 | — | — | CN | claimed |
| US-20200347504-A1 | PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE | ATOTECH DEUTSCHLAND GMBH (DE) | 2020-11-05 | — | — | US | claimed |
| CN-111295468-A | Electroplating composition for electrolytic copper deposition, use thereof and method for electrolytic deposition of a copper or copper alloy layer on at least one surface of a substrate | 安美特德国有限公司 | 2020-06-16 | — | — | CN | claimed |
| EP-3483307-B1 | PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE | ATOTECH DEUTSCHLAND GMBH (DE) | 2020-04-01 | — | — | EP | claimed |
| CN-110684995-A | Electroplating leveling agent and electroplating solution thereof | 深圳海恩特科技有限公司 | 2020-01-14 | — | — | CN | claimed |
| EP-3483307-A1 | PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE | ATOTECH Deutschland GmbH (DE) | 2019-05-15 | — | — | EP | claimed |
| EP-2576867-B1 | METHOD FOR ETCHING SURFACES OF CIRCUIT STRUCTURES OF PLATED COPPER AND PLATED COPPER ALLOYS | ATOTECH DEUTSCHLAND GMBH (DE) | 2018-04-04 | — | — | EP | claimed |
| US-20080142370-A1 | Aqueous, Acidic Solution and Method for Electrolytically Depositing Copper Coatings as Well as Use of Said Solution | ATOTECH DEUTSCHLAND GMBH (DE) | 2008-06-19 | — | — | US | claimed |
| EP-1651801-B1 | AQUEOUS, ACIDIC SOLUTION AND METHOD FOR ELECTROLYTICALLY DEPOSITING COPPER COATINGS AS WELL AS USE OF SAID SOLUTION | ATOTECH DEUTSCHLAND GMBH (DE) | 2008-01-23 | — | — | EP | claimed |
| EP-1152071-B1 | Copper plating method | ELECTROPLATING ENG (JP) | 2005-09-07 | — | — | EP | claimed |
| US-20050087447-A1 | Addition of cyanine dye allows copper plating from trenches and vias having high aspect ratio which have been formed on surfaces of substrate; electromigration | HABA TOSHIO (JP) | 2005-04-28 | — | — | US | claimed |
| EP-1152071-A1 | Copper plating method | Electroplating Engineers of Japan Limited (JP) | 2001-11-07 | — | — | EP | claimed |
| EP-0785297-B1 | An aqueous acid bath for the electrodeposition of a shiny and tear-free copper coating and its application | ATOTECH DEUTSCHLAND GMBH (DE) | 2000-01-05 | — | — | EP | claimed |
| EP-0785297-A2 | An aqueous acid bath for the electrodeposition of a shiny and tear-free copper coating and its application | ATOTECH Deutschland GmbH (DE) | 1997-07-23 | — | — | EP | claimed |
| EP-0598763-B1 | ACID BATH FOR THE GALVANIC DEPOSITION OF COPPER, AND THE USE OF SUCH A BATH | ATOTECH DEUTSCHLAND GMBH (DE) | 1995-12-13 | — | — | EP | claimed |
| WO-1993003204-A1 | ACID BATH FOR THE GALVANIC DEPOSITION OF COPPER, AND THE USE OF SUCH A BATH | ATOTECH DEUTSCHLAND GMBH (DE) | 1993-02-18 | — | — | WO | claimed |
| US-4975159-A | Copper salt, inorganic acid and alkoxylated lactam; reinforcing electroconductivity of printed circuit | SCHERING AKTIENGESELLSCHAFT (DE) | 1990-12-04 | — | — | US | claimed |