Known targets — ChEMBL curated mechanism
ACHEBDKRB2CHRM1CHRM2CHRM3CHRNA1CHRNB1CHRNDCHRNECHRNGGUCY1A1GUCY1A2GUCY1B1GUCY1B2NAMPTPTAFRSLC10A2SLC6A2SLC6A3TACR1dacAdacBdacCftsImrcAmrcBmrdA
The experimentally established mechanism targets of Hydrochloric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NPC1 | O15118 | 4/20 | 0.56 |
| ▸ | RAB9A | P51151 | 4/20 | 0.56 |
| ▸ | L3MBTL1 | Q9Y468 | 4/20 | 0.56 |
| ▸ | NLRP3 | Q96P20 | 2/20 | 0.56 |
| ▸ | MEN1 | O00255 | 3/20 | 0.45 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.45 |
| ▸ | POLB | P06746 | 2/20 | 0.45 |
| ▸ | BLM | P54132 | 2/20 | 0.45 |
| ▸ | USP2 | O75604 | 1/20 | 0.45 |
| ▸ | BRD4 | O60885 | 1/20 | 0.43 |
| ▸ | APP | P05067 | 2/20 | 0.43 |
| ▸ | TERT | O14746 | 1/20 | 0.43 |
| ▸ | PSMB5 | P28074 | 2/20 | 0.41 |
| ▸ | KDM1A | O60341 | 6/20 | 0.40 |
| ▸ | LMNA | P02545 | 2/20 | 0.40 |
| ▸ | MAPT | P10636 | 2/20 | 0.40 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.40 |
| ▸ | HTT | P42858 | 2/20 | 0.40 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.40 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9279444 | 1.00 | NPC1 (0.56) | NPC1RAB9AL3MBTL1NLRP3MEN1 | |
| Hydrochloric Acid SCHEMBL11156397 | 0.95 | NPC1 (0.60) | NPC1RAB9AL3MBTL1NLRP3MEN1 | |
| SCHEMBL12107916 | 0.95 | NPC1 (0.60) | NPC1RAB9AL3MBTL1NLRP3MEN1 | |
| Sulfuric Acid SCHEMBL944025 | 0.92 | NPC1 (0.50) | NPC1RAB9AL3MBTL1NLRP3MEN1 | |
| SCHEMBL12908929 | 0.90 | NPC1 (0.55) | NPC1RAB9AL3MBTL1NLRP3MEN1 | |
| SCHEMBL9274306 | 0.88 | L3MBTL1 (0.51) | NPC1RAB9AL3MBTL1NLRP3MEN1 | |
| SCHEMBL931482 | 0.87 | NPC1 (0.53) | NPC1RAB9AL3MBTL1NLRP3MEN1 | |
| Hydrochloric Acid SCHEMBL2977813 | 0.87 | NPC1 (0.53) | NPC1RAB9AL3MBTL1NLRP3MEN1 | |
| Hydrochloric Acid SCHEMBL6257184 | 0.87 | NPC1 (0.74) | NPC1RAB9AL3MBTL1NLRP3MEN1 | |
| Hydrochloric Acid SCHEMBL30577830 | 0.85 | TDP1 (0.49) | NPC1RAB9AL3MBTL1NLRP3MEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0598763-B1 | ACID BATH FOR THE GALVANIC DEPOSITION OF COPPER, AND THE USE OF SUCH A BATH | ATOTECH DEUTSCHLAND GMBH (DE) | 1995-12-13 | — | — | EP | claimed |
| EP-4018790-A1 | MANUFACTURING SEQUENCES FOR HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOARDS AND A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOARD | Atotech Deutschland GmbH & Co. KG (DE) | 2022-06-29 | — | — | EP | disclosed |
| EP-4018791-A1 | METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOARD INCLUDING MICROVIAS FILLED WITH COPPER | Atotech Deutschland GmbH & Co. KG (DE) | 2022-06-29 | — | — | EP | disclosed |
| US-10982343-B2 | Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate | ATOTECH DEUTSCHLAND GMBH (DE) | 2021-04-20 | — | — | US | disclosed |
| US-20200347504-A1 | PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE | ATOTECH DEUTSCHLAND GMBH (DE) | 2020-11-05 | — | — | US | disclosed |
| EP-3483307-B1 | PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE | ATOTECH DEUTSCHLAND GMBH (DE) | 2020-04-01 | — | — | EP | disclosed |
| EP-3483307-A1 | PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE | ATOTECH Deutschland GmbH (DE) | 2019-05-15 | — | — | EP | disclosed |
| EP-2619244-B1 | IMPROVED METHOD OF PRODUCING POLYMERIC PHENAZONIUM COMPOUNDS | MACDERMID ACUMEN INC (US) | 2018-11-14 | — | — | EP | disclosed |
| EP-2399281-B1 | PROCESS FOR ELECTRODEPOSITION OF COPPER CHIP TO CHIP, CHIP TO WAFER AND WAFER TO WAFER INTERCONNECTS IN THROUGH-SILICON VIAS (TSV) | ATOTECH DEUTSCHLAND GMBH (DE) | 2016-04-20 | — | — | EP | disclosed |
| US-9040700-B2 | Method of producing polymeric phenazonium compounds | CITIBANK, N.A. | 2015-05-26 | — | — | US | disclosed |
| EP-1651801-A2 | AQUEOUS, ACIDIC SOLUTION AND METHOD FOR ELECTROLYTICALLY DEPOSITING COPPER COATINGS AS WELL AS USE OF SAID SOLUTION | ATOTECH Deutschland GmbH (DE) | 2006-05-03 | — | — | EP | disclosed |
| WO-2005014891-A2 | AQUEOUS, ACIDIC SOLUTION AND METHOD FOR ELECTROLYTICALLY DEPOSITING COPPER COATINGS AS WELL AS USE OF SAID SOLUTION | ATOTECH DEUTSCHLAND GMBH (DE) | 2005-02-17 | — | — | WO | disclosed |
| US-6425996-B1 | ADJUSTING ELECTROCONDUCTIVITY | ATOTECH DEUTSCHLAND GMBH (DE) | 2002-07-30 | — | — | US | disclosed |
| US-5849171-A | Acid bath for copper plating and process with the use of this combination | ATOTECH DEUTSCHLAND GMBH (DE) | 1998-12-15 | — | — | US | disclosed |
| EP-0598763-B1 | ACID BATH FOR THE GALVANIC DEPOSITION OF COPPER, AND THE USE OF SUCH A BATH | ATOTECH DEUTSCHLAND GMBH (DE) | 1995-12-13 | — | — | EP | disclosed |
| US-5433840-A | Polyoxyalkylene glycol ethers, copper salts and acid | ATOTECH DEUTSCHLAND GMBH (DE) | 1995-07-18 | — | — | US | disclosed |
| EP-0554275-B1 | ACID BATH FOR COPPER PLATING, AND A PROCESS USING A BATH OF THIS TYPE FOR THIS PURPOSE | ATOTECH DEUTSCHLAND GMBH (DE) | 1994-12-14 | — | — | EP | disclosed |
| WO-1993003204-A1 | ACID BATH FOR THE GALVANIC DEPOSITION OF COPPER, AND THE USE OF SUCH A BATH | ATOTECH DEUTSCHLAND GMBH (DE) | 1993-02-18 | — | — | WO | disclosed |
| EP-0297306-B1 | AQUEOUS ACID BATH FOR THE GALVANIC DEPOSITION OF BRIGHTENING AND LEVELING COPPER COATINGS | SCHERING AKTIENGESELLSCHAFT (DE) | 1993-01-20 | — | — | EP | disclosed |
| EP-0297306-A1 | Aqueous acid bath for the galvanic deposition of brightening and leveling copper coatings | SCHERING AKTIENGESELLSCHAFT (DE) | 1989-01-04 | — | — | EP | disclosed |