Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 | P00915 | 2/20 | 0.43 |
| ▸ | BBOX1 | O75936 | 4/20 | 0.40 |
| ▸ | FFAR3 | O14843 | 2/20 | 0.37 |
| ▸ | HDAC3 | O15379 | 2/20 | 0.37 |
| ▸ | HDAC1 | Q13547 | 2/20 | 0.37 |
| ▸ | HDAC2 | Q92769 | 2/20 | 0.37 |
| ▸ | HDAC8 | Q9BY41 | 2/20 | 0.37 |
| ▸ | FAAH | O00519 | 1/20 | 0.37 |
| ▸ | CA2 | P00918 | 1/20 | 0.34 |
| ▸ | ABCC4 | O15439 | 1/20 | 0.34 |
| ▸ | MAPT | P10636 | 1/20 | 0.34 |
| ▸ | FABP3 | P05413 | 4/20 | 0.34 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.34 |
| ▸ | LMNA | P02545 | 1/20 | 0.34 |
| ▸ | TSHR | P16473 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL23581685 | 0.96 | CA1 (0.43) | CA1BBOX1FFAR3HDAC3HDAC1 | |
| SCHEMBL6026124 | 0.96 | CA1 (0.43) | CA1BBOX1FFAR3HDAC3HDAC1 | |
| SCHEMBL2577035 | 0.89 | BBOX1 (0.42) | CA1BBOX1FFAR3HDAC3HDAC1 | |
| SCHEMBL2852894 | 0.84 | — | — | |
| Potassium Ion SCHEMBL5583784 | 0.84 | — | — | |
| Lithium Ion SCHEMBL29596108 | 0.84 | — | — | |
| Acetic Acid SCHEMBL23581824 | 0.82 | MAPT (0.44) | CA1FAAHABCC4MAPTALDH1A1 | |
| SCHEMBL6310110 | 0.80 | ALDH1A1 (0.34) | CA1BBOX1FAAHCA2ABCC4 | |
| SCHEMBL1681460 | 0.80 | FAAH (0.36) | CA1BBOX1FAAHCA2ABCC4 | |
| SCHEMBL531413 | 0.80 | ALDH1A1 (0.34) | CA1BBOX1FAAHCA2ABCC4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20070256857-A1 | Conductive Paste and Flexible Printed Wiring Board Produced Using the Conductive Paste | MITSUI MINING & SMELTING CO., LTD. (JP) | 2007-11-08 | — | — | US | claimed |
| EP-1804256-A1 | CONDUCTIVE PASTE AND FLEXIBLE PRINTED WIRING BOARD OBTAINED BY USING THE CONDUCTIVE PASTE | Mitsui Mining & Smelting Co., Ltd. (JP) | 2007-07-04 | — | — | EP | claimed |
| US-20240101762-A1 | TWO-COMPONENT TYPE ROOM TEMPERATURE FAST-CURING ORGANOPOLYSILOXANE COMPOSITION AND ARTICLE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-03-28 | — | — | US | disclosed |
| EP-4286468-A1 | TWO-COMPONENT TYPE ROOM TEMPERATURE FAST-CURING ORGANOPOLYSILOXANE COMPOSITION AND ARTICLE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-12-06 | — | — | EP | disclosed |
| WO-2021132345-A1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION, CURED PRODUCT THEREOF, PROTECTIVE AGENT OR ADHESIVE, AND ELECTRIC/ELECTRONIC DEVICE | ダウ・東レ株式会社 | 2021-07-01 | — | — | WO | disclosed |
| WO-2021132349-A1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION AND CURED PRODUCT THEREOF, PROTECTIVE AGENT OR ADHESIVE, AND ELECTRIC/ELECTRONIC DEVICE | ダウ・東レ株式会社 | 2021-07-01 | — | — | WO | disclosed |
| WO-2020070984-A1 | ROOM-TEMPERATURE-CURABLE RESIN COMPOSITION, COATING AGENT, ADHESIVE, AND SEALING AGENT, AND ARTICLE | 信越化学工業株式会社 | 2020-04-09 | — | — | WO | disclosed |
| US-10442896-B2 | Room temperature-curable organopolysiloxane composition and cured product thereof | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-10-15 | — | — | US | disclosed |
| EP-3279267-B1 | ROOM-TEMPERATURE-CURABLE ORGANOPOLYSILOXANE COMPOSITION AND CURED PRODUCT THEREOF | SHINETSU CHEMICAL CO (JP) | 2019-09-18 | — | — | EP | disclosed |
| US-20180079867-A1 | ROOM TEMPERATURE-CURABLE ORGANOPOLYSILOXANE COMPOSITION AND CURED PRODUCT THEREOF | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-03-22 | — | — | US | disclosed |
| US-9850349-B2 | Multicomponent room temperature-curable organopolysiloxane composition, cured product of said composition, and molded product comprising said cured product | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-12-26 | — | — | US | disclosed |
| US-20170306099-A1 | MULTICOMPONENT ROOM TEMPERATURE-CURABLE ORGANOPOLYSILOXANE COMPOSITION, CURED PRODUCT OF SAID COMPOSITION, AND MOLDED PRODUCT COMPRISING SAID CURED PRODUCT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-10-26 | — | — | US | disclosed |
| US-20070256857-A1 | Conductive Paste and Flexible Printed Wiring Board Produced Using the Conductive Paste | MITSUI MINING & SMELTING CO., LTD. (JP) | 2007-11-08 | — | — | US | disclosed |
| EP-1804256-A1 | CONDUCTIVE PASTE AND FLEXIBLE PRINTED WIRING BOARD OBTAINED BY USING THE CONDUCTIVE PASTE | Mitsui Mining & Smelting Co., Ltd. (JP) | 2007-07-04 | — | — | EP | disclosed |