Tetrahydrofuran

Tetrahydrofuran

SCHEMBL5208313

C1CCOC1.O=C(O)c1ccc(N2C(=O)C=CC2=O)cc1.O=C(O)c1ccc(N2C(=O)C=CC2=O)cc1

nearest known ligand 0.74

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
DDAH1 O94760 1/20 0.74
CA12 O43570 6/20 0.53
CA9 Q16790 6/20 0.53
CA1 P00915 5/20 0.53
NSD2 O96028 1/20 0.50
G6PD P11413 1/20 0.50
KEAP1 Q14145 1/20 0.50
NFE2L2 Q16236 1/20 0.50
HSP90AA1 P07900 3/20 0.49
TDP1 Q9NUW8 3/20 0.49
ALDH1A1 P00352 3/20 0.49
CACNA1B Q00975 2/20 0.49
APBA1 Q02410 2/20 0.49
LMNA P02545 1/20 0.49
CCR6 P51684 1/20 0.49
APOBEC3G Q9HC16 1/20 0.49
MGLL Q99685 5/20 0.48
FAAH O00519 3/20 0.48
CA2 P00918 2/20 0.46
SCN2A Q99250 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL235166 0.86 DDAH1 (1.00) DDAH1CA12CA9CA1NSD2
Hydrochloric Acid SCHEMBL9278333 0.84 DDAH1 (0.96) DDAH1CA12CA9CA1NSD2
SCHEMBL1822680 0.84 DDAH1 (0.96) DDAH1CA12CA9CA1NSD2
Terephthalic Acid SCHEMBL27839875 0.80 TSHR (0.60) CA12CA9CA1ALDH1A1CA2
Terephthalic Acid SCHEMBL3249925 0.80 TSHR (0.60) CA12CA9CA1ALDH1A1CA2
Maleic Anhydride SCHEMBL8720551 0.80 DDAH1 (0.79) DDAH1CA12CA9CA1NSD2
Ethylene Glycol SCHEMBL8420849 0.80 DDAH1 (0.85) DDAH1CA12CA9CA1NSD2
Terephthalic Acid SCHEMBL10970615 0.78 TSHR (0.57) CA12CA9CA1ALDH1A1CA2
Alcohol SCHEMBL29133199 0.78 DDAH1 (0.82) DDAH1CA12CA9CA1NSD2
SCHEMBL11667624 0.77 DDAH1 (0.79) DDAH1CA12CA9CA1NSD2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023013709-A1 RESIN COMPOSITION, RESIN SHEET, PREPREG, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD 三菱瓦斯化学株式会社 2023-02-09 WO claimed
EP-3321319-B1 RESIN COMPOSITION AND PREPREG, RESIN SHEET, LAMINATE PLATE, AND PRINTED CIRCUIT BOARD MITSUBISHI GAS CHEMICAL CO (JP) 2022-10-05 EP claimed
US-10721817-B2 Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2020-07-21 US claimed
US-10703874-B2 Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2020-07-07 US claimed
US-10676579-B2 Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2020-06-09 US claimed
US-10563029-B2 Resin composition and prepreg, resin sheet, laminate, and printed circuit board MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2020-02-18 US claimed
EP-3321320-B1 RESIN COMPOSITION, PREPREG, RESIN SHEET, METAL FOIL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD MITSUBISHI GAS CHEMICAL CO (JP) 2019-10-02 EP claimed
US-20180186952-A1 RESIN COMPOSITION AND PREPREG, RESIN SHEET, LAMINATE, AND PRINTED CIRCUIT BOARD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2018-07-05 US claimed
US-20180179353-A1 RESIN COMPOSITION, PREPREG OR RESIN SHEET COMPRISING THE RESIN COMPOSITION, AND LAMINATE AND PRINTED CIRCUIT BOARD COMPRISING THEM MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2018-06-28 US claimed
US-20180177047-A1 RESIN COMPOSITION, PREPREG OR RESIN SHEET COMPRISING THE RESIN COMPOSITION, AND LAMINATE AND PRINTED CIRCUIT BOARD COMPRISING THEM MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2018-06-21 US claimed
US-20180155514-A1 RESIN COMPOSITION, PREPREG, RESIN SHEET, METAL FOIL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2018-06-07 US claimed
EP-3321320-A1 RESIN COMPOSITION, PREPREG, RESIN SHEET, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD Mitsubishi Gas Chemical Company, Inc. (JP) 2018-05-16 EP claimed
EP-3321319-A1 RESIN COMPOSITION, PREPREG, RESIN SHEET, LAMINATE PLATE, AND PRINTED WIRING BOARD Mitsubishi Gas Chemical Company, Inc. (JP) 2018-05-16 EP claimed
EP-4372015-A1 NOVEL POLYMER, RESIN COMPOSITION INCLUDING SAME, AND MOLDED BODY THEREOF Nippon Soda Co., Ltd. (JP) 2024-05-22 EP disclosed
EP-4372019-A1 NOVEL (METH)ACRYLAMIDE POLYMER, RESIN COMPOSITION CONTAINING SAME, AND MOLDED BODY THEREOF Nippon Soda Co., Ltd. (JP) 2024-05-22 EP disclosed
WO-2023190374-A1 DIPHENYL(METH)ACRYLAMIDE-CONTAINING THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT THEREFROM 日本曹達株式会社 2023-10-05 WO disclosed
EP-3006503-A1 RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD MATERIAL, AND PREPREG, RESIN SHEET, METAL FOIL-LAMINATED BOARD, AND PRINTED CIRCUIT BOARD EMPLOYING SAME Mitsubishi Gas Chemical Company, Inc. (JP) 2016-04-13 EP disclosed
EP-1605009-B1 Curable resin composition and its use MITSUBISHI GAS CHEMICAL CO (JP) 2007-08-01 EP disclosed
US-20050277743-A1 Curable resin composition and its use MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2005-12-15 US disclosed
EP-1605009-A1 Curable resin composition and its use MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2005-12-14 EP disclosed