SCHEMBL52137

SCHEMBL52137

Cc1ccc(C(=O)c2ccc(C)cc2N)cc1

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 6/20 0.60
NPC1 O15118 2/20 0.60
MAPK1 P28482 1/20 0.60
HTT P42858 1/20 0.60
L3MBTL1 Q9Y468 2/20 0.59
LMNA P02545 2/20 0.59
SMN1; SMN2 Q16637 2/20 0.59
ALDH1A1 P00352 4/20 0.57
GAA P10253 3/20 0.57
AKR1C3 P42330 1/20 0.50
SRD5A2 P31213 2/20 0.48
ALOX15 P16050 2/20 0.45
HSD17B10 Q99714 2/20 0.45
TP53 P04637 1/20 0.45
CYP3A4 P08684 1/20 0.45
THRB P10828 1/20 0.45
TDP1 Q9NUW8 1/20 0.45
CES2 O00748 1/20 0.45
CES1 P23141 1/20 0.45
RAB9A P51151 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5032456 0.90 CES2 (0.51) MAPTNPC1MAPK1HTTL3MBTL1
SCHEMBL8320768 0.90 MAPT (0.54) MAPTNPC1MAPK1HTTL3MBTL1
SCHEMBL10954535 0.90 MAPT (0.54) MAPTNPC1MAPK1HTTL3MBTL1
SCHEMBL145078 0.89 MAPT (0.61) MAPTNPC1MAPK1HTTL3MBTL1
SCHEMBL5286383 0.86 MAPT (0.50) MAPTNPC1MAPK1HTTL3MBTL1
SCHEMBL4140404 0.83 CES2 (0.59) MAPTNPC1MAPK1HTTL3MBTL1
Benzenethiol SCHEMBL27501880 0.82 MAPT (0.53) MAPTNPC1MAPK1HTTL3MBTL1
SCHEMBL9856886 0.82 ALDH1A1 (0.62) MAPTNPC1MAPK1HTTL3MBTL1
SCHEMBL4639277 0.81 MAPT (0.71) MAPTNPC1MAPK1HTTL3MBTL1
SCHEMBL11852104 0.81 ALDH1A1 (0.60) MAPTNPC1MAPK1HTTL3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2101 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115340784-B Solder resist ink with reflection performance, circuit board and display device 广州华星光电半导体显示技术有限公司 2023-08-01 CN claimed
CN-115340784-A Solder resist ink with reflection performance, circuit board and display device 广州华星光电半导体显示技术有限公司 2022-11-15 CN claimed
CN-113198302-A SRR free radical cluster medicament for treating various VOCs (volatile organic compounds) foul waste gas 成都安捷芮环保科技有限公司 2021-08-03 CN claimed
CN-110317473-B Preparation method of photo-induced and thermochromic microcapsule 上海炬通实业有限公司 2021-04-09 CN claimed
CN-109880217-A A kind of green biodegradable plastics film and its processing technology 广州思薇伦特美容生物科技有限公司 2019-06-14 CN claimed
US-10005915-B2 High-stretch energy curable inks and method of use in heat transfer label applications SUN CHEMICAL CORPORATION (US) 2018-06-26 US claimed
EP-3257677-A1 INKS OR COATINGS AND METHOD OF USE IN HEAT TRANSFER LABEL APPLICATIONS Sun Chemical Corporation (US) 2017-12-20 EP claimed
US-9631068-B2 Photo-curable resin composition and method for forming a fine pattern using the same SAMSUNG DISPLAY CO., LTD. (KR) 2017-04-25 US claimed
US-20160272791-A1 PHOTO-CURABLE RESIN COMPOSITION AND METHOD FOR FORMING A FINE PATTERN USING THE SAME SAMSUNG DISPLAY CO., LTD. (KR) 2016-09-22 US claimed
US-20160137857-A1 HIGH-STRETCH ENERGY CURABLE INKS & METHOD OF USE IN HEAT TRANSFER LABEL APPLICATIONS SUN CHEMICAL CORPORATION (US) 2016-05-19 US claimed
US-20040253536-A1 Photosensitive metal nanoparticle and method of forming conductive pattern using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2004-12-16 US claimed
US-20040142272-A1 Photoresist composition and method pattern forming using the same INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2004-07-22 US claimed
US-20040101634-A1 Method of forming a patterned film of surface-modified carbon nanotubes SAMSUNG ELECTRONICS CO., LTD. (KR) 2004-05-27 US claimed
EP-1422563-A1 Method of forming a patterned film of surface-modified carbon nanotubes SAMSUNG ELECTRONICS CO., LTD. (KR) 2004-05-26 EP claimed
US-6432616-B1 Water soluble polymer and photoresist composition containing the same INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2002-08-13 US claimed
US-6326122-B1 HEAT SENSITIVE ELEMENTS MITSUBISHI CHEMICAL CORPORATION (JP) 2001-12-04 US claimed
US-5698611-A ACRYLATED ESTER GC CORPORATION (JP) 1997-12-16 US claimed
US-4996132-A Heat-resistant photosensitive resin composition TOYKO OHKA KOGYO CO. LTD. (JP) 1991-02-26 US claimed
US-4975471-A Photo-curable epoxy resin type composition KABUSHIKI KAISHA TOSHIBA (JP) 1990-12-04 US claimed
EP-0280295-A2 A heat-resistant photosensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 1988-08-31 EP claimed