SCHEMBL522905

SCHEMBL522905

CC(C)(N)CN1CCN(CC(C)(C)N)CC1

nearest known ligand 0.32

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
ALOX15 P16050 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL861779 0.89 HTT (0.39) ALOX15
SCHEMBL18426938 0.89 MAPT (0.36)
SCHEMBL372272 0.88 SIGMAR1 (0.33)
SCHEMBL23277739 0.87 GRIN2D (0.31)
SCHEMBL372303 0.86 SIGMAR1 (0.36)
Hydrochloric Acid SCHEMBL20474339 0.86 ATM (0.36)
SCHEMBL9944691 0.85 ALOX15 (0.59) ALOX15
SCHEMBL18457919 0.85 ALOX15 (0.35) ALOX15
SCHEMBL21117053 0.85 DRD2 (0.38) ALOX15
SCHEMBL3919857 0.82 SIGMAR1 (0.38)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 406 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9822279-B2 Two-component compositions based on silane-functional polymers SIKA TECHNOLOGY AG (CH) 2017-11-21 US claimed
EP-2748263-A1 TWO-COMPONENT COMPOSITION BASED ON SILANE-FUNCTIONAL POLYMERS Sika Technology AG (CH) 2014-07-02 EP claimed
US-20140179830-A1 TWO-COMPONENT COMPOSITIONS BASED ON SILANE-FUNCTIONAL POLYMERS SIKA TECHNOLOGY AG (CH) 2014-06-26 US claimed
WO-2013030135-A1 TWO-COMPONENT COMPOSITION BASED ON SILANE-FUNCTIONAL POLYMERS SIKA TECHNOLOGY AG (CH) 2013-03-07 WO claimed
US-5606010-A REACTING A DIAMINE AND A QUINONE COMPOUND IN PRESENCE OF AN OXIDIZER Erhan, Semih (US) 1997-02-25 US claimed
EP-4738433-A1 LIQUID COMPRESSION MOLDING MATERIAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT Namics Corporation (JP) 2026-05-06 EP disclosed
EP-3858937-B1 TWO-PACK CURABLE ADHESIVE COMPOSITION YOKOHAMA RUBBER CO LTD (JP) 2026-04-01 EP disclosed
EP-3858939-B1 TWO-PACK CURABLE ADHESIVE COMPOSITION YOKOHAMA RUBBER CO LTD (JP) 2026-03-11 EP disclosed
EP-3797623-B1 ARTICLES INCLUDING COATED FIBERS AND METHODS OF MAKING COATED FIBERS AND ARTICLES NIKE INNOVATE CV (US) 2025-11-26 EP disclosed
US-12460077-B2 Curable resin compositions containing an aliphatic polyketone toughener and composites made therefrom HUNTSMAN ADVANCED MATERIALS AMERICAS LLC (US) 2025-11-04 US disclosed
EP-4130184-B1 TWO-LIQUID CURABLE ADHESIVE COMPOSITION YOKOHAMA RUBBER CO LTD (JP) 2025-10-08 EP disclosed
US-20250297145-A1 SURFACE TOLERANT ADHESIVE HUNTSMAN ADVANCED MATERIALS AMERICAS LLC 2025-09-25 US disclosed
US-5945482-A Resin composition for water-repellent coating and water-repellent coating TOYO INK MANUFACTURING CO., LTD. (JP) 1999-08-31 US disclosed
EP-0807664-B1 Resin composition for water-repellent coating and water-repellent coating TOYO INK MFG CO (JP) 1999-07-14 EP disclosed
EP-0899287-A1 Multi-branched compounds and curable composition TOYO INK MFG. CO., LTD. (JP) 1999-03-03 EP disclosed
US-5705602-A Process for the production of star-like or comb-like branched aliphatic polyamino compound and curable resin composition TOYO INK MANUFACTURING CO., LTD. (JP) 1998-01-06 US disclosed
EP-0807664-A1 Resin composition for water-repellent coating and water-repellent coating TOYO INK MANUFACTURING CO., LTD. (JP) 1997-11-19 EP disclosed
US-5606010-A REACTING A DIAMINE AND A QUINONE COMPOUND IN PRESENCE OF AN OXIDIZER Erhan, Semih (US) 1997-02-25 US disclosed
EP-0735076-A1 Process for the production of star-like or comb-like branched aliphatic polyamino compound and curable resin composition TOYO INK MANUFACTURING CO., LTD. (JP) 1996-10-02 EP disclosed
WO-1996001862-A1 METHODS FOR THE PREPARATION OF INHERENTLY METAL BINDING POLY-AMINE-QUINONE POLYMERS ERHAN SEMIH (US) 1996-01-25 WO disclosed