Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2910271 | 0.81 | ALDH1A1 (0.39) | ALDH1A1 | |
| Hydrochloric Acid SCHEMBL9661487 | 0.79 | ALDH1A1 (0.40) | ALDH1A1 | |
| SCHEMBL23862434 | 0.79 | ALDH1A1 (0.31) | ALDH1A1 | |
| SCHEMBL8776993 | 0.77 | ALDH1A1 (0.31) | ALDH1A1 | |
| SCHEMBL8757281 | 0.74 | ALDH1A1 (0.44) | ALDH1A1 | |
| SCHEMBL8776990 | 0.68 | LMNA (0.31) | — | |
| SCHEMBL9724590 | 0.63 | ALDH1A1 (0.31) | ALDH1A1 | |
| SCHEMBL17644192 | 0.62 | — | — | |
| SCHEMBL2548646 | 0.62 | — | — | |
| SCHEMBL94304 | 0.62 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-102318042-B | Polishing agent for polishing copper and polishing method using same | HITACHI CHEMICAL CO LTD | 2015-07-01 | — | — | CN | claimed |
| CN-102690605-B | Polishing agent for copper polishing and polishing method using same | HITACHI CHEMICAL CO LTD | 2015-01-21 | — | — | CN | claimed |
| US-20240191361-A1 | CHEMICAL SOLUTION FOR REMOVING PRECIOUS METAL, METHOD FOR MANUFACTURING CHEMICAL SOLUTION, METHOD FOR TREATING SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-06-13 | — | — | US | disclosed |
| US-20240191362-A1 | CHEMICAL SOLUTION FOR REMOVING PRECIOUS METAL, METHOD FOR MANUFACTURING CHEMICAL SOLUTION, METHOD FOR TREATING SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-06-13 | — | — | US | disclosed |
| US-20240191360-A1 | CHEMICAL SOLUTION FOR REMOVING PRECIOUS METAL, METHOD FOR MANUFACTURING CHEMICAL SOLUTION, METHOD FOR TREATING SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-06-13 | — | — | US | disclosed |
| US-11981880-B2 | Cleaning composition and cleaning method for component of semiconductor manufacturing process chamber | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-05-14 | — | — | US | disclosed |
| WO-2024095926-A1 | CLEANING LIQUID AND SUBSTRATE CLEANING METHOD | 東京応化工業株式会社 | 2024-05-10 | — | — | WO | disclosed |
| US-20240101936-A1 | AQUEOUS CLEANING LIQUID AND METHOD OF CLEANING ELECTRONIC DEVICE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-03-28 | — | — | US | disclosed |
| US-20230203408-A1 | CLEANING LIQUID AND METHOD FOR CLEANING SUBSTRATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-06-29 | — | — | US | disclosed |
| US-20230203409-A1 | CLEANING LIQUID AND METHOD FOR CLEANING SUBSTRATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-06-29 | — | — | US | disclosed |
| US-11686002-B2 | Method for manufacturing ruthenium wiring | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-06-27 | — | — | US | disclosed |
| US-8845915-B2 | Abrading agent and abrading method | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-09-30 | — | — | US | disclosed |
| US-20130020283-A1 | POLISHING SOLUTION FOR COPPER POLISHING, AND POLISHING METHOD USING SAME | HITACHI CHEMICAL COMPANY, LTD. | 2013-01-24 | — | — | US | disclosed |
| CN-102834479-A | Polishing agent for polishing copper and polishing method using the same | HITACHI CHEMICAL CO LTD | 2012-12-19 | — | — | CN | disclosed |
| CN-102703027-A | Use of polishing agent for polishing copper | HITACHI CHEMICAL CO LTD | 2012-10-03 | — | — | CN | disclosed |
| CN-102690605-A | Polishing agent for copper polishing and polishing method using same | HITACHI CHEMICAL CO LTD | 2012-09-26 | — | — | CN | disclosed |
| US-20120160804-A1 | POLISHING AGENT FOR COPPER POLISHING AND POLISHING METHOD USING SAME | HITACHI CHEMICAL CO., LTD. (JP) | 2012-06-28 | — | — | US | disclosed |
| US-20120024818-A1 | POLISHING AGENT FOR COPPER POLISHING AND POLISHING METHOD USING SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-02-02 | — | — | US | disclosed |
| CN-102318042-A | Polishing agent for polishing copper and polishing method using same | HITACHI CHEMICAL CO LTD | 2012-01-11 | — | — | CN | disclosed |
| US-20110300778-A1 | ABRADING AGENT AND ABRADING METHOD | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-12-08 | — | — | US | disclosed |