SCHEMBL524182

SCHEMBL524182

CC(=O)C(F)(F)C(=O)c1ccccc1

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CES1 P23141 6/20 0.61
CES2 O00748 4/20 0.46
SRC P12931 1/20 0.46
MLYCD O95822 1/20 0.44
MAPT P10636 2/20 0.43
SMN1; SMN2 Q16637 1/20 0.43
HSD17B10 Q99714 2/20 0.42
CYP1A2 P05177 1/20 0.42
CYP2D6 P10635 1/20 0.42
TSHR P16473 3/20 0.42
DAO P14920 1/20 0.42
NAPRT Q6XQN6 1/20 0.42
ALDH1A1 P00352 1/20 0.42
POLB P06746 1/20 0.39
CYP3A4 P08684 1/20 0.39
PARP1 P09874 1/20 0.39
CYP2C19 P33261 1/20 0.39
RECQL P46063 1/20 0.39
BLM P54132 1/20 0.39
PMP22 Q01453 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7907262 0.86 CES1 (0.73) CES1CES2SRCMLYCDMAPT
SCHEMBL13662398 0.81 CES1 (0.59) CES1CES2SRCMLYCDHSD17B10
SCHEMBL6171178 0.80 CES1 (0.64) CES1CES2SRCMLYCDMAPT
SCHEMBL31010341 0.79 CES1 (0.52) CES1CES2SRCMLYCDTSHR
SCHEMBL633283 0.77 CES1 (0.67) CES1CES2SRCMLYCDMAPT
SCHEMBL10862049 0.77 CES1 (0.54) CES1CES2SRCMAPTSMN1; SMN2
SCHEMBL11261530 0.77 CES1 (0.67) CES1CES2SRCMLYCDMAPT
SCHEMBL33083 0.77 CES1 (1.00) CES1CES2MLYCDTSHRDAO
Benzene SCHEMBL27672585 0.77 CES1 (1.00) CES1CES2MLYCDTSHRDAO
SCHEMBL12913259 0.76 CES1 (0.52) CES1CES2SRCMAPTSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20130236655-A1 PHOTO-SENSITIVE ELECTROMAGNETIC-WAVE INTERCEPTION INK COMPOSITION, ELECTROMAGNETIC-WAVE INTERCEPTION CURED MATERIAL, AND MANUFACTURING METHOD OF ELECTROMAGNETIC-WAVE INTERCEPTION CURED MATERIAL PANASONIC CORPORATION (JP) 2013-09-12 US disclosed
CN-102343326-A Thin film manufacturing method and thin-film element RICOH CO LTD 2012-02-08 CN disclosed
US-20120028075-A1 THIN FILM MANUFACTURING METHOD AND THIN-FILM ELEMENT RICOH COMPANY, LIMITED (JP) 2012-02-02 US disclosed
EP-2357264-A2 Thin film manufacturing method and thin film element Ricoh Company, Ltd. (JP) 2011-08-17 EP disclosed
US-7990228-B2 Semiconductor device and wiring part thereof HITACHI, LTD. (JP) 2011-08-02 US disclosed
US-20110123728-A1 THIN FILM MANUFACTURING METHOD AND THIN FILM ELEMENT RICOH COMPANY, LTD. (JP) 2011-05-26 US disclosed
US-20080266031-A1 SEMICONDUCTOR DEVICE AND WIRING PART THEREOF HITACHI LTD. AND ELPIDA MEMORY, INC. 2008-10-30 US disclosed
US-20020083863-A1 Metal complex solution, photosensitive metal complex solution and method for forming metallic oxide films DAI NIPPON PRINTING CO., LTD 2002-07-04 US disclosed
US-6387012-B1 A METAL COMPLEX SOLUTION COMPRISING AN ORGANIC SOLVENT, AND A COMPLEX COMPOSED OF AN ORGANIC ACID SALT OF AT LEAST ONE METAL AND AN ORGANIC AMINE OR ORGANIC KETONE COMPOUND, DISSOLVED IN THE ORGANIC SOLVENT DAI NIPPON PRINTING CO., LTD. (JP) 2002-05-14 US disclosed