SCHEMBL5247771

SCHEMBL5247771

CC(CO)c1cccc(C(C)CO)c1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ABCB11 O95342 1/20 0.50
TRPA1 O75762 5/20 0.48
HDAC4 P56524 2/20 0.46
HDAC2 Q92769 2/20 0.46
HDAC8 Q9BY41 2/20 0.46
TAAR1 Q96RJ0 2/20 0.39
GABRA1 P14867 1/20 0.38
GABRG2 P18507 1/20 0.38
GABRB3 P28472 1/20 0.38
KDM4E B2RXH2 1/20 0.38
MDM4 O15151 1/20 0.38
ALDH1A1 P00352 1/20 0.38
CA1 P00915 1/20 0.38
CA2 P00918 1/20 0.38
TP53 P04637 1/20 0.38
CYP3A4 P08684 1/20 0.38
MAPT P10636 1/20 0.38
TYR P14679 1/20 0.38
HPGD P15428 1/20 0.38
ALOX15 P16050 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25094316 0.93 HDAC4 (0.47) ABCB11TRPA1HDAC4HDAC2HDAC8
SCHEMBL20738470 0.91 ABCB11 (0.44) ABCB11TRPA1HDAC4HDAC2HDAC8
SCHEMBL28674297 0.91 ABCB11 (0.44) ABCB11TRPA1HDAC4HDAC2HDAC8
SCHEMBL27988694 0.88 ABCB11 (0.42) ABCB11TRPA1HDAC4HDAC2HDAC8
SCHEMBL15842196 0.87 ALDH1A1 (0.46) ABCB11TRPA1ALDH1A1HPGDADRB1
SCHEMBL20738464 0.87 ADRB1 (0.53) ABCB11TRPA1HDAC4HDAC2HDAC8
SCHEMBL7363946 0.87 ABCB11 (0.44) ABCB11TRPA1HDAC4HDAC2HDAC8
SCHEMBL18211070 0.87 ABCB11 (0.44) ABCB11TRPA1HDAC4HDAC2HDAC8
SCHEMBL16419135 0.87 ABCB11 (0.44) ABCB11TRPA1HDAC4HDAC2HDAC8
SCHEMBL15866411 0.87 ALDH1A1 (0.46) ABCB11TRPA1ALDH1A1HPGDADRB1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250236723-A1 RESIN SHEET, LAMINATED BOARD, METAL-CLAD LAMINATED BOARD, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE RESONAC CORPORATION (JP) 2025-07-24 US disclosed
EP-4368674-A1 RESIN COMPOSITION, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE Resonac Corporation (JP) 2024-05-15 EP disclosed
EP-1571491-B1 Photothermographic material and method of forming images FUJIFILM CORP (JP) 2007-09-12 EP disclosed
EP-0901043-B1 Radiation-sensitive resin composition JSR CORP (JP) 2004-10-27 EP disclosed
EP-0374999-B1 Use of oligomers of alkenyl groups-substituted aromatics as co-agents AKZO NOBEL NV (NL) 1995-01-18 EP disclosed
US-5091479-A Crosslinking synthetic rubbers with a dimer, trimer of an oligomer of a di(alkenyl(3-6))-substituted aromatic compound AKZO NV (NL) 1992-02-25 US disclosed
US-5010161-A Of poly (phenylenebisalkylene) poly (phenylamine) with aldehyde, regenerated under hydrolysis, for use in moisture curable polyurethanes MITSUI TOATSU CHEMICALS, INC. (JP) 1991-04-23 US disclosed
EP-0374999-A2 Use of oligomers of alkenyl groups-substituted aromatics as co-agents Akzo Nobel N.V. (NL) 1990-06-27 EP disclosed
EP-0375318-A2 Polyaldimine derivatives MITSUI TOATSU CHEMICALS, Inc. (JP) 1990-06-27 EP disclosed