SCHEMBL528275

SCHEMBL528275

N=[N+]([O-])O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL459148 1.00
Nitric Acid SCHEMBL398144 0.75
SCHEMBL12483617 0.72
SCHEMBL305514 0.72
Nitric Acid SCHEMBL13560601 0.67
Nitric Acid SCHEMBL5162028 0.67 CA5A (0.80)
Methane SCHEMBL23726043 0.67
SCHEMBL28412085 0.67
Ammonia Solution, Strong SCHEMBL4116843 0.67
SCHEMBL29615688 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109153886-A Chemically-mechanicapolish polish purposes of (CMP) composition in substrate of the polishing comprising cobalt and/or cobalt alloy 巴斯夫欧洲公司 2019-01-04 CN disclosed
CN-108779367-A Chemically-mechanicapolish polish purposes of (CMP) composition in polishing the base material comprising cobalt and/or cobalt alloy 巴斯夫欧洲公司 2018-11-09 CN disclosed
CN-103210047-B The diazene * dioxide of the substitution containing N and/or the aqueous polishing composition of N '-hydroxyls-diazene * oxide salts 巴斯夫欧洲公司 2018-07-17 CN disclosed
CN-103210047-B The diazene * dioxide of the substitution containing N and/or the aqueous polishing composition of N '-hydroxyls-diazene * oxide salts 巴斯夫欧洲公司 2018-07-17 CN disclosed
CN-108276915-A Aqueous polishing composition and method for chemically-mechanicapolish polishing the substrate for including silicon oxide dielectric and polysilicon film 巴斯夫欧洲公司 2018-07-13 CN disclosed
CN-108178988-A Chemical-mechanical polishing compositions comprising nonionic surfactant and carbonate 巴斯夫欧洲公司 2018-06-19 CN disclosed
CN-107406721-A Chemical Mechanical Polishing (CMP) compositions for high efficiency polishing of germanium-containing substrates 巴斯夫欧洲公司 2017-11-28 CN disclosed
CN-103975001-B Prepare the method and its application of CMP composition 巴斯夫欧洲公司 2017-09-01 CN disclosed
CN-107109132-A Use of Chemical Mechanical Polishing (CMP) compositions for polishing substrates comprising cobalt and/or cobalt alloys 巴斯夫欧洲公司 2017-08-29 CN disclosed
CN-107109133-A Use of Chemical Mechanical Polishing (CMP) compositions for polishing substrates comprising cobalt and/or cobalt alloys 巴斯夫欧洲公司 2017-08-29 CN disclosed
CN-107109134-A Chemically-mechanicapolish polish purposes of (CMP) composition in base material of the polishing comprising cobalt and/or cobalt alloy 巴斯夫欧洲公司 2017-08-29 CN disclosed
CN-106661382-A chemical mechanical polishing (CMP) composition 巴斯夫欧洲公司 2017-05-10 CN disclosed
US-20130213116-A1 METHOD AND DEVICE FOR LAND MINE DETECTION BY NITROGEN GAS ZENGIN AHMET (TR) 2013-08-22 US disclosed
WO-2012015368-A2 METHOD AND DEVICE FOR LAND MINE DETECTION BY NITROGEN GAS METHOD ZENGIN AHMET (TR) 2012-02-02 WO disclosed
US-20100255121-A1 Hard Surface Treatment Compositions with Improved Mold or Fungi Remediation Properties RECKITT & COLMAN (OVERSEAS) LIMITED (GB) 2010-10-07 US disclosed