Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DHFR | P00374 | 1/20 | 0.54 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.54 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.52 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.52 |
| ▸ | MGLL | Q99685 | 5/20 | 0.51 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.46 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL21801769 | 1.00 | DHFR (0.54) | DHFRALDH1A1MAPK1L3MBTL1MGLL | |
| SCHEMBL30541879 | 1.00 | DHFR (0.54) | DHFRALDH1A1MAPK1L3MBTL1MGLL | |
| Cyclohexane SCHEMBL28117089 | 0.97 | DHFR (0.52) | DHFRALDH1A1MAPK1L3MBTL1MGLL | |
| SCHEMBL29374975 | 0.93 | DHFR (0.59) | DHFRALDH1A1MAPK1L3MBTL1MGLL | |
| SCHEMBL121520 | 0.93 | DHFR (0.59) | DHFRALDH1A1MAPK1L3MBTL1MGLL | |
| SCHEMBL21801767 | 0.93 | DHFR (0.59) | DHFRALDH1A1MAPK1L3MBTL1MGLL | |
| Propene SCHEMBL9132191 | 0.92 | DHFR (0.48) | DHFRALDH1A1MAPK1L3MBTL1MGLL | |
| Acrylic Acid SCHEMBL28214340 | 0.92 | DHFR (0.48) | DHFRALDH1A1MAPK1L3MBTL1MGLL | |
| SCHEMBL27625461 | 0.89 | MGLL (0.51) | DHFRMAPK1L3MBTL1MGLL | |
| SCHEMBL28387457 | 0.89 | DHFR (0.55) | DHFRMAPK1L3MBTL1MGLLTDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 813 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-120029006-A | Photosensitive resin composition, photosensitive dry film, cured film, circuit board and display module | 杭州福斯特电子材料有限公司 | 2025-05-23 | — | — | CN | claimed |
| CN-119570202-A | Epoxy resin system for low-viscosity high-Tg prepreg yarns and preparation method thereof | 安徽佳力奇先进复合材料科技股份公司 | 2025-03-07 | — | — | CN | claimed |
| CN-119264777-A | Pump body anti-abrasion protective coating material and preparation method thereof | 宁夏正禹工程技术有限公司 | 2025-01-07 | — | — | CN | claimed |
| CN-119219894-A | Method for synthesizing epoxy resin material by recycling nylon acid | 河南城建学院 | 2024-12-31 | — | — | CN | claimed |
| CN-118363265-A | Photosensitive resin composition, dry film solder resist, solder resist layer and printed circuit board | 杭州福斯特电子材料有限公司 | 2024-07-19 | — | — | CN | claimed |
| CN-116285830-B | Thermosetting adhesive, adhesive tape and preparation method thereof | 湖南联兴光电科技有限公司 | 2023-12-08 | — | — | CN | claimed |
| CN-116648806-A | Electrolyte, secondary battery, battery module, battery pack, and electricity-using device | 宁德时代新能源科技股份有限公司 | 2023-08-25 | — | — | CN | claimed |
| CN-116285830-A | Thermosetting adhesive, adhesive tape and preparation method thereof | 湖南联兴光电科技有限公司 | 2023-06-23 | — | — | CN | claimed |
| EP-4184648-A1 | ELECTROLYTE, SECONDARY BATTERY, BATTERY MODULE, BATTERY PACK, AND POWER-CONSUMING APPARATUS | Contemporary Amperex Technology Co., Limited (CN) | 2023-05-24 | — | — | EP | claimed |
| US-20230094322-A1 | ELECTROLYTE, SECONDARY BATTERY, BATTERY MODULE, BATTERY PACK AND POWER CONSUMPTION APPARATUS | CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) LIMITED (CN) | 2023-03-30 | — | — | US | claimed |
| JP-H09506659-A | — | — | 1997-06-30 | — | — | JP | claimed |
| EP-0734424-A1 | POLYGLYCIDYL ESTER-BASED POWDER COATINGS | AMOCO CORPORATION (US) | 1996-10-02 | — | — | EP | claimed |
| WO-1995016753-A1 | POLYGLYCIDYL ESTER-BASED POWDER COATINGS | AMOCO CORPORATION (US) | 1995-06-22 | — | — | WO | claimed |
| US-5321101-A | Polycarbodiimides; high strength, heat resistance, fireproof and melt processability | NISSHINBO INDUSTRIES, INC. (JP) | 1994-06-14 | — | — | US | claimed |
| EP-0588533-A2 | Printed thermoplastic resin products and method for printing such products | HAYAKAWA RUBBER COMPANY LIMITED (JP) | 1994-03-23 | — | — | EP | claimed |
| EP-0588534-A2 | Radiation curing ink | HAYAKAWA RUBBER COMPANY LIMITED (JP) | 1994-03-23 | — | — | EP | claimed |
| CN-1084193-A | Ink composite | HAYAKAWA RUBBER (JP) | 1994-03-23 | — | — | CN | claimed |
| EP-0240421-B1 | REINFORCED EPOXY RESIN COMPOSITION, IN PARTICULAR IN THE FORM OF PREPREGS, STARTING PRODUCT FOR COMPOSITES, THE OBTAINED COMPOSITES AND EPOXY RESINS CONTAINING SULPHONE GROUPS | SOCIETE NATIONALE ELF AQUITAINE (FR) | 1991-12-18 | — | — | EP | claimed |
| US-4189414-A | QUATERNARY AMMONIUM SILICATE | KOWA CHEMICAL INDUSTRY LTD. (JP) | 1980-02-19 | — | — | US | claimed |
| US-4017434-A | Diallyl phthalate resin-containing aqueous emulsions | OSAKA SODA CO., LTD. (JA) | 1977-04-12 | — | — | US | claimed |