SCHEMBL530161

SCHEMBL530161

C=C(C)C(=O)OCCCC#N

nearest known ligand 0.56

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
TSHR P16473 5/20 0.56
THRB P10828 1/20 0.48
POLB P06746 1/20 0.43
APEX1 P27695 1/20 0.43
HTT P42858 1/20 0.43
TDP1 Q9NUW8 1/20 0.43
ALDH1A1 P00352 4/20 0.38
MEN1 O00255 1/20 0.34
KMT2A Q03164 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL528601 0.94 TSHR (0.59) TSHRTHRBPOLBAPEX1HTT
SCHEMBL11774726 0.93 TSHR (0.62) TSHRTHRBPOLBAPEX1HTT
SCHEMBL10409035 0.93 TSHR (0.62) TSHRTHRBPOLBAPEX1HTT
SCHEMBL7061249 0.93 TSHR (0.62) TSHRTHRBPOLBAPEX1HTT
SCHEMBL33780 0.88 THRB (0.52) TSHRTHRBPOLBAPEX1HTT
Acrylic Acid SCHEMBL27993445 0.85 TSHR (0.50) TSHRTHRBPOLBAPEX1HTT
Acetic Acid SCHEMBL28158415 0.85 THRB (0.48) TSHRTHRBPOLBAPEX1HTT
SCHEMBL11030871 0.83 TSHR (0.44) TSHRTHRBPOLBAPEX1HTT
SCHEMBL28009088 0.83 TSHR (0.44) TSHRTHRBPOLBAPEX1HTT
Methacrylic Acid SCHEMBL10424224 0.83 THRB (0.47) TSHRTHRBPOLBAPEX1HTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11735737-B2 Binder for electricity storage devices improving dispersibility of conductive assistant FUJIFILM WAKO PURE CHEMICAL CORPORATION (JP) 2023-08-22 US disclosed
CN-113891713-A Methylphenidate compositions for the treatment of attention deficit hyperactivity disorder 艾伦索尔医药发展股份有限公司 2022-01-04 CN disclosed
WO-2021071086-A1 LATEX COMPOSITION FOR DIP MOLDING, METHOD FOR PRODUCING SAME, AND DIP-MOLDED PRODUCT PRODUCED USING SAME 주식회사 엘지화학 2021-04-15 WO disclosed
WO-2021071092-A1 LATEX COMPOSITION FOR DIP MOLDING, MOLDED ARTICLE MOLDED THEREFROM, AND METHOD FOR PRODUCING SAME 주식회사 엘지화학 2021-04-15 WO disclosed
WO-2021071078-A1 METHOD FOR PREPARING CARBOXYLIC ACID-MODIFIED NITRILE-BASED COPOLYMER LATEX 주식회사 엘지화학 2021-04-15 WO disclosed
WO-2021066317-A1 LATEX COMPOSITION FOR DIP MOLDING, DIP-MOLDED PRODUCT COMPRISING SAME, AND METHOD FOR MANUFACTURING DIP-MOLDED PRODUCT BY USING SAME 주식회사 엘지화학 2021-04-08 WO disclosed
WO-2021060729-A1 LATEX COMPOSITION FOR DIP MOLDING, MANUFACTURING METHOD THEREFOR, AND MOLDED PRODUCT MOLDED THEREFROM 주식회사 엘지화학 2021-04-01 WO disclosed
US-20200243903-A1 SOLID ELECTROLYTE COMPOSITION, SOLID ELECTROLYTE-CONTAINING SHEET, ALL-SOLID STATE SECONDARY BATTERY, AND METHODS FOR MANUFACTURING SOLID ELECTROLYTE-CONTAINING SHEET AND ALL-SOLID STATE SECONDARY BATTERY FUJIFILM CORPORATION (JP) 2020-07-30 US disclosed
WO-2020122647-A1 LATEX COMPOSITION FOR DIP MOLDING, METHOD FOR MANUFACTURING SAME, AND MOLDED PRODUCT MOLDED FROM SAME 주식회사 엘지화학 2020-06-18 WO disclosed
WO-2020116793-A1 LATEX COMPOSITION FOR DIP MOLDING, MANUFACTURING METHOD THEREFOR, AND MOLDED ARTICLE THEREFROM 주식회사 엘지화학 2020-06-11 WO disclosed
EP-0930542-A1 Polymers and photoresist compositions for short wavelength imaging Shipley Company LLC (US) 1999-07-21 EP disclosed
EP-0915133-A1 DIPPING LATEX COMPOSITION AND RUBBER ARTICLES MADE THEREFROM BY DIPPING NIPPON ZEON CO., LTD. (JP) 1999-05-12 EP disclosed
EP-0747458-B1 Adhesive composition and composite of rubber with fiber NIPPON ZEON CO (JP) 1999-03-31 EP disclosed
US-5861212-A LATEX OF CARBOXYLATED HIGHLY SATURATED NITRILE-CONJUGATED DIENE COPOLYMER RUBBER, RESORCINOL-FORMALDEHYDE RESIN, AND AROMATIC EPOXY RESIN; BELTS NIPPON ZEON CO., LTD. (JP) 1999-01-19 US disclosed
US-5783625-A SELF-CROSSLINKING LATEX CONTAINING HYDROGENATED RUBBER COPOLYMERS OF UNSATURATED NITRILES, CARBOXYLIC ACIDS AND CONJUGATED DIENES BLENDED WITH RESORCINOL-FORMALDEHYDE RESIN, FOR BONDING TO FABRICS, ABRASION, WATER AND HEAT RESISTANCE NIPPON ZEON CO., LTD. (JP) 1998-07-21 US disclosed
EP-0704508-B1 Adhesive composition and composite of rubber with fiber NIPPON ZEON CO (JP) 1997-09-17 EP disclosed
EP-0747458-A1 Adhesive composition and composite of rubber with fiber NIPPON ZEON CO., LTD. (JP) 1996-12-11 EP disclosed
EP-0704508-A1 Adhesive composition and composite of rubber with fiber NIPPON ZEON CO., LTD. (JP) 1996-04-03 EP disclosed
US-4942906-A FOR FUEL TRANSPORTATION TOKAI RUBBER INDUSTRIES, LTD. (JP) 1990-07-24 US disclosed
US-4021397-A LATEX, HYDROXYLAMINE SULFATE THE B. F. GOODRICH COMPANY (US) 1977-05-03 US disclosed