Known targets — ChEMBL curated mechanism
ACHEBDKRB2CHRM1CHRM2CHRM3CHRNA1CHRNB1CHRNDCHRNECHRNGGUCY1A1GUCY1A2GUCY1B1GUCY1B2NAMPTPTAFRSLC10A2SLC6A2SLC6A3TACR1dacAdacBdacCftsImrcAmrcBmrdA
The experimentally established mechanism targets of Hydrochloric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6693744 | 0.89 | ALDH1A1 (0.33) | — | |
| SCHEMBL8568629 | 0.89 | ALDH1A1 (0.33) | — | |
| SCHEMBL8573008 | 0.89 | ALDH1A1 (0.33) | — | |
| SCHEMBL2405628 | 0.89 | ALDH1A1 (0.33) | — | |
| SCHEMBL8575204 | 0.89 | ALDH1A1 (0.33) | — | |
| SCHEMBL3535287 | 0.89 | ALDH1A1 (0.33) | — | |
| SCHEMBL8445734 | 0.84 | TSHR (0.38) | — | |
| SCHEMBL8681885 | 0.76 | MEN1 (0.36) | — | |
| SCHEMBL532905 | 0.76 | — | — | |
| SCHEMBL532904 | 0.76 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240194984-A1 | Stampable Sheet and Molded Body Using Same | MITSUBISHI CHEMICAL CORPORATION (JP) | 2024-06-13 | — | — | US | disclosed |
| WO-2024058221-A1 | LAMINATED BODY AND MANUFACTURING METHOD THEREFOR | 三菱ケミカル株式会社 | 2024-03-21 | — | — | WO | disclosed |
| EP-4324869-A1 | STAMPABLE SHEET AND MOLDED BODY USING SAME | Mitsubishi Chemical Corporation (JP) | 2024-02-21 | — | — | EP | disclosed |
| CN-117203268-A | Stampable sheet and molded article using same | 三菱化学株式会社 | 2023-12-08 | — | — | CN | disclosed |
| WO-2022220303-A1 | STAMPABLE SHEET AND MOLDED BODY USING SAME | 三菱ケミカル株式会社 | 2022-10-20 | — | — | WO | disclosed |
| CN-110305357-B | Thermally conductive foam sheet for electronic device and thermally conductive laminate for electronic device | 积水化学工业株式会社 | 2021-06-01 | — | — | CN | disclosed |
| EP-3536739-B1 | HEAT-CONDUCTING FOAM SHEET FOR ELECTRONIC INSTRUMENTS AND HEAT-CONDUCTING LAMINATE FOR ELECTRONIC INSTRUMENTS | SEKISUI CHEMICAL CO LTD (JP) | 2021-04-28 | — | — | EP | disclosed |
| EP-3248510-B1 | FLAME-RESISTANT THREE-DIMENSIONAL LATTICE-SHAPED CUSHION | PACIFIC WAVE CO LTD (JP) | 2019-10-09 | — | — | EP | disclosed |
| EP-3536739-A1 | HEAT-CONDUCTING FOAM SHEET FOR ELECTRONIC INSTRUMENTS AND HEAT-CONDUCTING LAMINATE FOR ELECTRONIC INSTRUMENTS | SEKISUI CHEMICAL CO., LTD. (JP) | 2019-09-11 | — | — | EP | disclosed |
| US-20190136004-A1 | HEAT-CONDUCTING FOAM SHEET FOR ELECTRONIC INSTRUMENTS AND HEAT-CONDUCTING LAMINATE FOR ELECTRONIC INSTRUMENTS | SEKISUI CHEMICAL CO LTD (JP) | 2019-05-09 | — | — | US | disclosed |
| EP-3248510-A1 | FLAME-RESISTANT THREE-DIMENSIONAL LATTICE-SHAPED CUSHION | Pacific Wave Co., Ltd. (JP) | 2017-11-29 | — | — | EP | disclosed |
| US-20170305106-A1 | HEAT-CONDUCTING FOAM SHEET FOR ELECTRONIC DEVICES | SEKISUI CHEMICAL CO., LTD. (JP) | 2017-10-26 | — | — | US | disclosed |
| US-20170072666-A1 | HEAT-CONDUCTING LAMINATE FOR ELECTRONIC DEVICE | SEKISUI CHEMICAL CO., LTD. (JP) | 2017-03-16 | — | — | US | disclosed |
| EP-3124241-A1 | HEAT-CONDUCTING LAMINATE FOR ELECTRONIC DEVICE | Sekisui Chemical Co., Ltd. (JP) | 2017-02-01 | — | — | EP | disclosed |
| US-20150316332-A1 | HEAT-CONDUCTING FOAM SHEET FOR ELECTRONIC INSTRUMENTS AND HEAT-CONDUCTING LAMINATE FOR ELECTRONIC INSTRUMENTS | SEKISUI CHEMICAL CO., LTD. (JP) | 2015-11-05 | — | — | US | disclosed |
| EP-2927269-A1 | HEAT-CONDUCTING FOAM SHEET FOR ELECTRONIC INSTRUMENTS AND HEAT-CONDUCTING LAMINATE FOR ELECTRONIC INSTRUMENTS | Sekisui Chemical Co., Ltd. (JP) | 2015-10-07 | — | — | EP | disclosed |
| EP-2692794-A1 | CARBON-FIBER REINFORCED POLYPROPYLENE RESIN COMPOSITION, MOLDING MATERIAL, AND MOLDED ARTICLES | Toray Industries, Inc. (JP) | 2014-02-05 | — | — | EP | disclosed |
| EP-1970403-B1 | CLOSED CELL FOAM RUBBER SHEET, LAMINATE, AND WATERPROOF/WATERTIGHT SEALING MATERIAL USING THE SHEET OR LAMIANTE | SEKISUI CHEMICAL CO LTD (JP) | 2012-02-08 | — | — | EP | disclosed |
| US-20090169860-A1 | Closed-Cell Foamed Rubber Sheet, Laminate, and Waterproof/Watertight Sealing Material Made of the Sheet or Laminate | SEKISUI CHEMICAL CO., LTD. (JP) | 2009-07-02 | — | — | US | disclosed |
| EP-1970403-A1 | CLOSED CELL FOAM RUBBER SHEET, LAMINATE, AND WATERPROOF/WATERTIGHT SEALING MATERIAL USING THE SHEET OR LAMIANTE | Sekisui Chemical Co., Ltd. (JP) | 2008-09-17 | — | — | EP | disclosed |