SCHEMBL534586

SCHEMBL534586

CCO[Si](CC)(CC)Cc1ccccc1

nearest known ligand 0.41

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.41
TSHR P16473 4/20 0.34
CALM1 P0DP23 1/20 0.33
LTA4H P09960 2/20 0.32
KCNH2 Q12809 1/20 0.32
ALDH1A1 P00352 4/20 0.32
IDO1 P14902 1/20 0.32
AOC3 Q16853 1/20 0.32
NUDT1 P36639 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
NOS2 P35228 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3338279 0.91 TP53 (0.44) TP53TSHRCALM1LTA4HKCNH2
SCHEMBL27959423 0.81 NR1H2 (0.37) TP53TSHRALDH1A1
SCHEMBL534257 0.81 TP53 (0.42) TP53TSHRCALM1LTA4HALDH1A1
SCHEMBL534084 0.81 TP53 (0.42) TP53TSHRCALM1LTA4HALDH1A1
SCHEMBL15302309 0.80 TP53 (0.34) TP53SMN1; SMN2
SCHEMBL15302064 0.80 TP53 (0.34) TP53SMN1; SMN2
SCHEMBL16460750 0.79 TP53 (0.37) TP53TSHRCALM1
SCHEMBL2806315 0.78 TP53 (0.44) TP53TSHRCALM1LTA4HALDH1A1
SCHEMBL104109 0.78 TP53 (0.44) TP53TSHRCALM1LTA4HALDH1A1
SCHEMBL109170 0.77 TP53 (0.42) TP53TSHRCALM1KCNH2ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2371509-B1 SHAPING METHOD AJI CO LTD (JP) 2017-06-28 EP disclosed
CN-104321376-B Curable composition and cured material thereof SHOWA DENKO KABUSHIKI KAISHA (JP) 2016-04-06 CN disclosed
CN-102369225-B Curable composition and cured product thereof SHOWA DENKO KK 2015-06-24 CN disclosed
CN-103210008-B Curable resin composition SHOWA DENKO KK 2015-04-15 CN disclosed
CN-104321376-A Curable composition and cured material thereof SHOWA DENKO KK 2015-01-28 CN disclosed
US-8840830-B2 Method of molding AJI CO., LTD. (JP) 2014-09-23 US disclosed
CN-102232014-B Shaping method Aji corp 2014-08-20 CN disclosed
WO-2013176279-A1 CURABLE COMPOSITION AND CURED MATERIAL OF THE SAME SHOWA DENKO K.K. (JP) 2013-11-28 WO disclosed
US-20130310516-A1 CURABLE COMPOSITION AND CURED MATERIAL OF THE SAME SHOWA DENKO K.K. (JP) 2013-11-21 US disclosed
EP-2380916-B1 HARDENING COMPOSITION AND HARDENED PRODUCT OF SAME SHOWA DENKO KK (JP) 2013-11-13 EP disclosed
US-20110263779-A1 HARDENING COMPOSITION AND HARDENED PRODUCT THEREOF SHOWA DENKO K.K. (JP) 2011-10-27 US disclosed
EP-2380916-A1 HARDENING COMPOSITION AND HARDENED PRODUCT OF SAME Showa Denko K.K. (JP) 2011-10-26 EP disclosed
EP-2371509-A1 SHAPING METHOD Showa Denko K.K. (JP) 2011-10-05 EP disclosed
US-20110227239-A1 METHOD OF MOLDING SHOWA DENKO K.K. (JP) 2011-09-22 US disclosed
CN-102076723-A Curable composition and cured product thereof SHOWA DENKO KK 2011-05-25 CN disclosed
US-20110098411-A1 CURABLE COMPOSITION AND CURED PRODUCT THEREOF SHOWA DENKO K.K. (JP) 2011-04-28 US disclosed
CN-102037035-A Curable composition containing a reactive (meth)acrylate polymer and a cured product thereof SHOWA DENKO KK 2011-04-27 CN disclosed
US-20110077334-A1 CURABLE COMPOSITION CONTAINING REACTIVE (METH) ACRYLATE POLYMER AND CURED PRODUCTS THEREOF SHOWA DENKO K.K. (JP) 2011-03-31 US disclosed
EP-2298822-A1 HARDENING COMPOSITION AND RESULTANT HARDENED MATERIAL Showa Denko K.K. (JP) 2011-03-23 EP disclosed
EP-2295481-A1 CURABLE COMPOSITION CONTAINING A REACTIVE (METH)ACRYLATE POLYMER AND A CURED PRODUCT THEREOF Showa Denko K.K. (JP) 2011-03-16 EP disclosed