SCHEMBL534084

SCHEMBL534084

CC[Si](CC)(Cc1ccccc1)OC

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.42
LTA4H P09960 1/20 0.38
TSHR P16473 4/20 0.36
CALM1 P0DP23 1/20 0.35
ALDH1A1 P00352 3/20 0.33
NPC1 O15118 1/20 0.33
RAB9A P51151 1/20 0.33
EPHX1 P07099 1/20 0.33
CA12 O43570 1/20 0.33
CA1 P00915 1/20 0.33
CA2 P00918 1/20 0.33
CA4 P22748 1/20 0.33
CA7 P43166 1/20 0.33
CA9 Q16790 1/20 0.33
CA14 Q9ULX7 1/20 0.33
MAPK1 P28482 1/20 0.33
IDO1 P14902 1/20 0.33
F2 P00734 1/20 0.33
PRSS1 P07477 1/20 0.33
PRSS2 P07478 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3341648 0.89 TP53 (0.42) TP53LTA4HTSHRCALM1ALDH1A1
SCHEMBL534586 0.81 TP53 (0.41) TP53LTA4HTSHRCALM1ALDH1A1
SCHEMBL534035 0.80 TP53 (0.44) TP53LTA4HTSHRCALM1ALDH1A1
SCHEMBL15734213 0.79 LMNA (0.38) TSHRIDO1MAOB
SCHEMBL15738582 0.77 IDO1 (0.44) IDO1MAOB
SCHEMBL15302769 0.76 SMN1; SMN2 (0.34) TP53LTA4HTSHRALDH1A1MAOB
SCHEMBL16460750 0.76 TP53 (0.37) TP53TSHRCALM1
SCHEMBL15734264 0.76 IDO1 (0.44) TP53ALDH1A1MAPK1IDO1MAOB
SCHEMBL15302019 0.76 SMN1; SMN2 (0.34) TP53LTA4HTSHRALDH1A1MAOB
SCHEMBL12677542 0.76 TP53 (0.37) TP53TSHRCALM1MAOB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2371509-B1 SHAPING METHOD AJI CO LTD (JP) 2017-06-28 EP disclosed
CN-104321376-B Curable composition and cured material thereof SHOWA DENKO KABUSHIKI KAISHA (JP) 2016-04-06 CN disclosed
CN-102369225-B Curable composition and cured product thereof SHOWA DENKO KK 2015-06-24 CN disclosed
CN-103210008-B Curable resin composition SHOWA DENKO KK 2015-04-15 CN disclosed
CN-104321376-A Curable composition and cured material thereof SHOWA DENKO KK 2015-01-28 CN disclosed
US-8840830-B2 Method of molding AJI CO., LTD. (JP) 2014-09-23 US disclosed
CN-102232014-B Shaping method Aji corp 2014-08-20 CN disclosed
WO-2013176279-A1 CURABLE COMPOSITION AND CURED MATERIAL OF THE SAME SHOWA DENKO K.K. (JP) 2013-11-28 WO disclosed
US-20130310516-A1 CURABLE COMPOSITION AND CURED MATERIAL OF THE SAME SHOWA DENKO K.K. (JP) 2013-11-21 US disclosed
EP-2380916-B1 HARDENING COMPOSITION AND HARDENED PRODUCT OF SAME SHOWA DENKO KK (JP) 2013-11-13 EP disclosed
US-20110263779-A1 HARDENING COMPOSITION AND HARDENED PRODUCT THEREOF SHOWA DENKO K.K. (JP) 2011-10-27 US disclosed
EP-2380916-A1 HARDENING COMPOSITION AND HARDENED PRODUCT OF SAME Showa Denko K.K. (JP) 2011-10-26 EP disclosed
EP-2371509-A1 SHAPING METHOD Showa Denko K.K. (JP) 2011-10-05 EP disclosed
US-20110227239-A1 METHOD OF MOLDING SHOWA DENKO K.K. (JP) 2011-09-22 US disclosed
CN-102076723-A Curable composition and cured product thereof SHOWA DENKO KK 2011-05-25 CN disclosed
US-20110098411-A1 CURABLE COMPOSITION AND CURED PRODUCT THEREOF SHOWA DENKO K.K. (JP) 2011-04-28 US disclosed
CN-102037035-A Curable composition containing a reactive (meth)acrylate polymer and a cured product thereof SHOWA DENKO KK 2011-04-27 CN disclosed
US-20110077334-A1 CURABLE COMPOSITION CONTAINING REACTIVE (METH) ACRYLATE POLYMER AND CURED PRODUCTS THEREOF SHOWA DENKO K.K. (JP) 2011-03-31 US disclosed
EP-2298822-A1 HARDENING COMPOSITION AND RESULTANT HARDENED MATERIAL Showa Denko K.K. (JP) 2011-03-23 EP disclosed
EP-2295481-A1 CURABLE COMPOSITION CONTAINING A REACTIVE (METH)ACRYLATE POLYMER AND A CURED PRODUCT THEREOF Showa Denko K.K. (JP) 2011-03-16 EP disclosed