SCHEMBL5350652

SCHEMBL5350652

O=C(C=CCO)C=CCO

nearest known ligand 0.32

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
CA1 P00915 1/20 0.32
CA9 Q16790 1/20 0.32
GABRR1 P24046 2/20 0.30
GABRR2 P28476 2/20 0.30
BLM P54132 2/20 0.30
GABRR3 A8MPY1 1/20 0.30
LMNA P02545 1/20 0.30
TSHR P16473 1/20 0.30
APEX1 P27695 1/20 0.30
NPSR1 Q6W5P4 1/20 0.30
TDP1 Q9NUW8 1/20 0.30
ALDH1A1 P00352 1/20 0.30
CYP2D6 P10635 1/20 0.30
ALOX15 P16050 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13269561 0.82
SCHEMBL60642 0.76
SCHEMBL6026178 0.76
SCHEMBL60643 0.76
SCHEMBL4313651 0.73
SCHEMBL8065365 0.73
SCHEMBL3743069 0.73
SCHEMBL18515739 0.73
SCHEMBL10875371 0.73
SCHEMBL4312137 0.73

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260036904-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-02-05 US disclosed
US-20250004372-A1 BLOCK COPOLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2025-01-02 US disclosed
CN-119213364-A Photosensitive resin composition, method for producing polyimide cured film using same, and polyimide cured film 旭化成株式会社 2024-12-27 CN disclosed
WO-2024148707-A1 POLYIMIDE PRECURSOR AND SYNTHETIC METHOD THEREFOR, AND PHOTOSENSITIVE RESIN COMPOSITION COMPRISING POLYIMIDE PRECURSOR 深圳先进电子材料国际创新研究院 2024-07-18 WO disclosed
US-20240101761-A1 POLYIMIDE PRECURSOR RESIN COMPOSITION AND METHOD FOR MANUFACTURING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-03-28 US disclosed
WO-2023233896-A1 PHOTOSENSITIVE RESIN COMPOSITION 東京応化工業株式会社 2023-12-07 WO disclosed
CN-116868124-A Photosensitive resin composition, method for producing polyimide cured film using same, and polyimide cured film 旭化成株式会社 2023-10-10 CN disclosed
WO-2023176172-A1 POLYIMIDE RESIN PRECURSOR 東京応化工業株式会社 2023-09-21 WO disclosed
CN-116609998-A Polyimide precursor, negative photosensitive resin composition, and method for producing cured relief pattern using same 旭化成株式会社 2023-08-18 CN disclosed
US-11640112-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-05-02 US disclosed
EP-0873185-B1 A POLYMERIZATION PROCESS AND APPARATUS FREEMAN CLARENCE S (US) 2003-05-21 EP disclosed
US-20020193546-A1 Polymerization process, apparatus mid polymer WATERGUARD TELECOMMUNICATIONS TECHNOLOGIES, INC. A TEXAS CORPORATION (US) 2002-12-19 US disclosed
US-6465579-B1 OBTAINED BY REACTING A POLYMER HAVING A POLAR GROUP CONTAINING A HETERO ATOM AND A BENZENE RING, SUCH AS BUTADIENE-STYRENE-VINYLPYRIDINE TERPOLYMER, WITH SILICA; PROVIDES LOW VISCOSITY AND PROCESSABILITY TO RUBBER THE YOKOHAMA RUBBER CO., LTD. (JP) 2002-10-15 US disclosed
US-6399730-B1 MIXTURE OF POLYMERIZATION REAGENTS IS SPRAYED INTO A HEATED, CONTROLLED ATMOSPHERE, FORMING DROPLETS OF THE MIXTURE WHICH ARE ALLOWED TO FALL THROUGH THE HEATED, CONTROLLED ATMOSPHERE TO OBTAIN A DESIRED DEGREE OF POLYMERIZATION. WATERGUARD TELECOMMUNICATIONS TECHNOLOGIES, INC. 2002-06-04 US disclosed
US-20020039655-A1 Water absorbing polymer WATERGUARD TELECOMMUNICATIONS TECHNOLOGIES, INC. 2002-04-04 US disclosed
US-6291605-B1 PREPARING A MIXTURE OF A MONOMER, A CROSSLINKER AND AN INITIATOR IN WATER; HEATING REACTION CHAMBER; CONTROLLING PRESSURE; SPRAYING MIXTURE; ALLOWING DROPLETS TO FALL THROUGH HEATED CHAMBER TO POLYMERIZE AND CROSSLINK FORMING DRY WATERGUARD TELECOMMUNICATIONS TECHNOLOGIES, INC. 2001-09-18 US disclosed
EP-0873185-A1 A POLYMERIZATION PROCESS, APPARATUS AND POLYMER Freeman, Clarence S. (US) 1998-10-28 EP disclosed
WO-1996040427-A1 A POLYMERIZATION PROCESS, APPARATUS AND POLYMER FREEMAN CLARENCE S (US) 1996-12-19 WO disclosed
US-4255338-A HYDROGENATION OF BUTADIENE POLYPEROXIDE E. I. DU PONT DE NEMOURS AND COMPANY (US) 1981-03-10 US disclosed
US-4209651-A Hydrogenation of butadienepolyperoxide to unsaturated diols E. I. DU PONT DE NEMOURS AND COMPANY (US) 1980-06-24 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260036904-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE RER1, ASIC1, FRG1 CA1 193/4885CA9 990/4885GABRR1 181/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.