SCHEMBL5355018

SCHEMBL5355018

COC(=O)OCC1(C)CC2C=CC1C2

nearest known ligand 0.35

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
CYP2D6 P10635 1/20 0.35
CYP2C19 P33261 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.32
P2RX7 Q99572 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5358484 0.87 ALDH1A1 (0.38) CYP2D6CYP2C19
SCHEMBL13025197 0.84 CYP2D6 (0.36) CYP2D6CYP2C19SMN1; SMN2P2RX7
SCHEMBL5348568 0.84 CYP2D6 (0.35) CYP2D6CYP2C19
SCHEMBL5366311 0.82 CYP2D6 (0.34) CYP2D6CYP2C19SMN1; SMN2
SCHEMBL4270319 0.78 CYP2D6 (0.36) CYP2D6CYP2C19P2RX7
SCHEMBL7719333 0.77 CYP2D6 (0.38) CYP2D6CYP2C19
SCHEMBL5355994 0.74 CYP2D6 (0.36) CYP2D6CYP2C19
SCHEMBL5347779 0.73 CYP2D6 (0.34) CYP2D6CYP2C19P2RX7
SCHEMBL202057 0.73 CYP2D6 (0.38) CYP2D6CYP2C19
SCHEMBL14409133 0.73 MEN1 (0.36)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7202016-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2007-04-10 US disclosed
EP-1085379-B1 Radiation-sensitive resin composition JSR CORP (JP) 2006-01-04 EP disclosed
US-20050214680-A1 Radiation-sensitive resin composition MIYAJI MASAAKI 2005-09-29 US disclosed
US-6933094-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2005-08-23 US disclosed
US-6623907-B2 Chemical amplified photoresist JSR CORPORATION (JP) 2003-09-23 US disclosed
US-6482568-B1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-11-19 US disclosed
US-20020058201-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-05-16 US disclosed
EP-1193558-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2002-04-03 EP disclosed
US-20010023050-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2001-09-20 US disclosed
EP-1122605-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2001-08-08 EP disclosed
EP-1085379-A1 Radiation-sensitive resin composition JSR Corporation (JP) 2001-03-21 EP disclosed