SCHEMBL5360468

SCHEMBL5360468

O=C(O)C=CC(F)(F)C(F)(F)C(F)(F)C(F)(F)CF

nearest known ligand 0.32

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.32
TP53 P04637 1/20 0.32
EGLN1 Q9GZT9 1/20 0.32
EGLN3 Q9H6Z9 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5412517 0.98 TSHR (0.31) TSHRTP53EGLN1EGLN3
SCHEMBL4340454 0.98 TSHR (0.31) TSHRTP53EGLN1EGLN3
SCHEMBL755844 0.94 TSHR (0.33) TSHRTP53EGLN1EGLN3
SCHEMBL561207 0.85 TSHR (0.36) TSHRTP53EGLN1EGLN3
SCHEMBL15413474 0.78
SCHEMBL4373387 0.77 GABRR1 (0.33) TSHR
SCHEMBL4373384 0.77 GABRR1 (0.33) TSHR
SCHEMBL8830567 0.76 THRB (0.46) TSHRTP53EGLN1EGLN3
SCHEMBL16178793 0.76 THRB (0.46) TSHRTP53EGLN1EGLN3
SCHEMBL1448934 0.76 TSHR (0.36) TSHRTP53EGLN1EGLN3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0835294-B1 LIGHT DIFFUSING ADHESIVE MINNESOTA MINING & MFG (US) 2003-01-29 EP claimed
CN-118119480-A Method and apparatus for in-situ monitoring of chemical mechanical planarization CMP process 崇硕科技公司 2024-05-31 CN disclosed
EP-4355528-A2 METHOD AND APPARATUS FOR IN-SITU MONITORING OF CHEMICAL MECHANICAL PLANARIZATION (CMP) PROCESSES Axus Technology, LLC (US) 2024-04-24 EP disclosed
WO-2022265967-A2 METHOD AND APPARATUS FOR IN-SITU MONITORING OF CHEMICAL MECHANICAL PLANARIZATION (CMP) PROCESSES AXUS TECHNOLOGY, LLC (US) 2022-12-22 WO disclosed
US-20220395956-A1 METHOD AND APPARATUS FOR IN-SITU MONITORING OF CHEMICAL MECHANICAL PLANARIZATION (CMP) PROCESSES AXUS TECHNOLOGY, LLC 2022-12-15 US disclosed
US-7198544-B2 Polishing pad with window APPLIED MATERIALS, INC. (US) 2007-04-03 US disclosed
US-6994607-B2 Polishing pad with window APPLIED MATERIALS, INC. (US) 2006-02-07 US disclosed
US-20050266771-A1 Polishing pad with window APPLIED MATERIALS, INC., A DELAWARE CORPORATION 2005-12-01 US disclosed
US-20040082271-A1 Polishing pad with window APPLIED MATERIALS, INC. 2004-04-29 US disclosed
US-6716085-B2 OPTICAL MONITORING SYSTEM AND A COMPUTER THAT ANALYZES A SIGNAL FROM THE DETECTOR AND CALCULATES WHETHER THE ENDPOINT HAS BEEN DETECTED APPLIED MATERIALS INC. 2004-04-06 US disclosed
US-20040033758-A1 Polishing pad with window APPLIED MATERIALS, INC. 2004-02-19 US disclosed
WO-2004014603-A2 POLISHING PAD WITH WINDOW APPLIED MATERIALS, INC. (US) 2004-02-19 WO disclosed