SCHEMBL5363872

SCHEMBL5363872

[O-][S+](c1cc(O)cc(O)c1)c1cc(O)cc(O)c1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
BACE1 P56817 1/20 0.50
LCK P06239 1/20 0.36
ACHE P22303 1/20 0.35
CA12 O43570 3/20 0.33
CA9 Q16790 3/20 0.33
CA2 P00918 2/20 0.33
CA14 Q9ULX7 2/20 0.33
CA5A P35218 2/20 0.33
ALDH1A1 P00352 2/20 0.33
CA1 P00915 2/20 0.33
CYP3A4 P08684 2/20 0.33
HSD17B10 Q99714 2/20 0.33
LMNA P02545 1/20 0.33
CA5B Q9Y2D0 1/20 0.33
CA7 P43166 1/20 0.33
NQO1 P15559 1/20 0.33
ABL1 P00519 1/20 0.33
ABCB1 P08183 1/20 0.33
BCR P11274 1/20 0.33
GAA P10253 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Phloroglucinol SCHEMBL23346245 0.75 BACE1 (0.89) BACE1LCKACHECA12CA9
SCHEMBL5842887 0.73 ALDH1A1 (0.52) LCKACHECA12CA9CA2
Phloroglucinol SCHEMBL26311 0.71
Phloroglucinol SCHEMBL30542958 0.71
Phloroglucinol SCHEMBL2889628 0.71 BACE1 (1.00) BACE1LCKACHECA12CA9
SCHEMBL7922256 0.69 ESR1 (0.33)
SCHEMBL727419 0.69 CA1 (0.50) ACHECA2ALDH1A1CA1CYP3A4
SCHEMBL9621812 0.69 HSD17B10 (0.50) LCKACHECA2ALDH1A1CA1
SCHEMBL270714 0.69 CYP3A4 (0.50) CA2ALDH1A1CA1CYP3A4HSD17B10
SCHEMBL5316031 0.69 BACE1 (0.50) BACE1LCKACHECA12CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240213072-A1 LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING PROCESSED SEMICONDUCTOR SUBSTRATE NISSAN CHEMICAL CORPORATION (JP) 2024-06-27 US disclosed
US-20240199924-A1 LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING PROCESSED SEMICONDUCTOR SUBSTRATE NISSAN CHEMICAL CORPORATION (JP) 2024-06-20 US disclosed
EP-4310157-A1 LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING MACHINED SEMICONDUCTOR SUBSTRATE Nissan Chemical Corporation (JP) 2024-01-24 EP disclosed
EP-4309893-A1 LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE Nissan Chemical Corporation (JP) 2024-01-24 EP disclosed
CN-117157738-A Laminate, stripper composition, and method for producing processed semiconductor substrate 日产化学株式会社 2023-12-01 CN disclosed
CN-117157739-A Laminate, stripper composition, and method for producing processed semiconductor substrate 日产化学株式会社 2023-12-01 CN disclosed
WO-2022210262-A1 LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE 日産化学株式会社 2022-10-06 WO disclosed
US-10607876-B2 Method for processing mold material and method for manufacturing structural body TOKYO OHKA KOGYO CO., LTD. (JP) 2020-03-31 US disclosed
US-10112377-B2 Supporting member separation method and supporting member separation apparatus TOKYO OHKA KOGYO CO., LTD. (JP) 2018-10-30 US disclosed
US-9837298-B2 Method for manufacturing laminate, method for manufacturing sealed substrate laminate, sealed substrate laminate, and sealed substrate TOKYO OHKA KOGYO CO., LTD. (JP) 2017-12-05 US disclosed
US-20010044080-A1 Method for forming a finely patterned photoresist layer TOKYO OHKA KOGYO CO., LTD. (JP) 2001-11-22 US disclosed
US-6284428-B1 FOR FORMING OF ANTIREFLECTION UNDERCOATING LAYER TO INTERVENE BETWEEN SURFACE OF SUBSTRATE AND PHOTORESIST LAYER TO BE PATTERNED IN MANUFACTURING PROCESS OF SEMICONDUCTOR DEVICES TOKYO OHKA KOGYO CO., LTD, (JP) 2001-09-04 US disclosed
US-20010018163-A1 Undercoating composition for photolithographic resist TOKYO OHKA KOGYO CO., LTD. (JP) 2001-08-30 US disclosed
US-6268108-B1 MIXTURE OF COMPOUND FORMING ACID UPON EXPOSURE OF ACTINIC RADIATION, COMPOUND CAPABLE OF CROSSLINKING, DYE AND SOLVENT TOKYO OHKA KOGYO CO., LTD. (JP) 2001-07-31 US disclosed
US-6083665-A Photoresist laminate and method for patterning using the same TOKYO OHKA KOGYO CO., LTD. (JP) 2000-07-04 US disclosed
US-6071673-A Method for the formation of resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2000-06-06 US disclosed
US-5948847-A ACRYLATED ESTER CROSSLINKED WITH NITROGEN CONTAINING ORGANIC COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 1999-09-07 US disclosed
US-5925495-A Photoresist laminate and method for patterning using the same TOKYO OHKA KOGYO CO., LTD. (JP) 1999-07-20 US disclosed
US-5908738-A Undercoating composition for photolithography TOKYO OHKA KOGYO CO., LTD. (JP) 1999-06-01 US disclosed
US-5756255-A Undercoating composition for photolithography TOKYO OHKA KOGYO CO., LTD. (JP) 1998-05-26 US disclosed