Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PKM | P14618 | 3/20 | 0.50 |
| ▸ | GAA | P10253 | 2/20 | 0.50 |
| ▸ | MGLL | Q99685 | 1/20 | 0.49 |
| ▸ | MMP2 | P08253 | 2/20 | 0.46 |
| ▸ | NPC1 | O15118 | 1/20 | 0.46 |
| ▸ | PKLR | P30613 | 1/20 | 0.46 |
| ▸ | RAB9A | P51151 | 1/20 | 0.46 |
| ▸ | VDR | P11473 | 1/20 | 0.45 |
| ▸ | GSK3A | P49840 | 2/20 | 0.45 |
| ▸ | GSK3B | P49841 | 2/20 | 0.45 |
| ▸ | EP300 | Q09472 | 1/20 | 0.44 |
| ▸ | KAT2A | Q92830 | 1/20 | 0.44 |
| ▸ | KAT2B | Q92831 | 1/20 | 0.44 |
| ▸ | HTT | P42858 | 2/20 | 0.44 |
| ▸ | LMNA | P02545 | 1/20 | 0.44 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.44 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.44 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.44 |
| ▸ | CA1 | P00915 | 2/20 | 0.43 |
| ▸ | CA2 | P00918 | 2/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL65074 | 0.83 | GAA (0.66) | PKMGAAMMP2NPC1PKLR | |
| SCHEMBL5552231 | 0.82 | VDR (0.65) | PKMGAAMGLLMMP2RAB9A | |
| SCHEMBL4835021 | 0.81 | GAA (0.49) | PKMGAAMMP2NPC1PKLR | |
| SCHEMBL5551953 | 0.81 | VDR (0.55) | PKMGAAMMP2NPC1PKLR | |
| SCHEMBL5369841 | 0.79 | VDR (0.74) | VDRHTTLMNASMN1; SMN2TDP1 | |
| SCHEMBL498754 | 0.78 | PARL (0.67) | PKMMGLLRAB9AVDRHTT | |
| SCHEMBL5556047 | 0.78 | NR1H3 (0.49) | PKMGAAMMP2NPC1PKLR | |
| SCHEMBL4826503 | 0.78 | GAA (0.49) | PKMGAAMMP2NPC1PKLR | |
| SCHEMBL5551764 | 0.76 | GAA (0.51) | PKMGAAMMP2NPC1PKLR | |
| SCHEMBL5557977 | 0.76 | KMT2A (0.58) | PKMGAAVDRHTTLMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-120044752-A | Photosensitive resin composition | 东京应化工业株式会社 | 2025-05-27 | — | — | CN | disclosed |
| US-20240302743-A1 | RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-09-12 | — | — | US | disclosed |
| CN-116583784-A | Resist composition and resist pattern forming method | 东京应化工业株式会社 | 2023-08-11 | — | — | CN | disclosed |
| WO-2022138648-A1 | RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN | 東京応化工業株式会社 | 2022-06-30 | — | — | WO | disclosed |
| WO-2013141376-A1 | PROTECTANT, METHOD FOR PRODUCING COMPOUND PROTECTED BY PROTECTANT, RESIN PROTECTED BY PROTECTANT, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING RESIN PROTECTED BY PROTECTANT, PATTERN-FORMING MATERIAL, PHOTOSENSITIVE FILM, CURED RELIEF PATTERN, METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 (JP) | 2013-09-26 | — | — | WO | disclosed |
| WO-2013018524-A1 | PHOTOSENSITIVE RESIN COMPOSITION, MATERIAL FOR FORMING RELIEF PATTERN, PHOTOSENSITIVE FILM, POLYIMIDE FILM, CURED RELIEF PATTERN AND METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 (JP) | 2013-02-07 | — | — | WO | disclosed |
| US-8173349-B2 | Photosensitive resin composition, polymer compound, method of forming a pattern, and electronic device | FUJIFILM CORPORATION (JP) | 2012-05-08 | — | — | US | disclosed |
| US-20100080963-A1 | PHOTOSENSITIVE RESIN COMPOSITION, POLYMER COMPOUND, METHOD OF FORMING A PATTERN, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2010-04-01 | — | — | US | disclosed |
| US-7615324-B2 | Photosensitive composition, and cured relief pattern production method and semiconductor device using the same | FUJIFILM CORPORATION (JP) | 2009-11-10 | — | — | US | disclosed |
| US-20080227024-A1 | PHOTOSENSITIVE COMPOSITION, AND CURED RELIEF PATTERN PRODUCTION METHOD AND SEMICONDUCTOR DEVICE USING THE SAME | FUJIFILM CORPORATION (JP) | 2008-09-18 | — | — | US | disclosed |
| US-6693049-B2 | FILLING WITH AN OXYALKYLATED MELAMINE, BENZOGUANAMINE, ACETOGUANAMINE, GLYCOL URYL, UREA, THIOUREA, GUANIDINE, ALKYLENEUREA OR SUCCINYLAMIDE AND HEATING AT 150-250 C, WHEREBY NO BUBBLE IS GENERATED WHEN THE FINE HOLE IS FILLED. | TOKYO OHKA KOGYO CO., LTD. (JP) | 2004-02-17 | — | — | US | disclosed |
| US-6689535-B2 | A NOVALAK RESIN CROSSLINKING AGENT HAVING HYDROXYALKYL AND/OR ALKOXYALKYL GROUPS AND AN ACIDIC COMPOUND; UNDERCOATINGS; A RECTANGULAR CROSS-SECTIONAL PROFILE WITHOUT CAUSING FOOTING, UNDERCUTTING, ETC. AT THE BOTTOM | TOKYO OHKA KOGYO CO., LTD (JP) | 2004-02-10 | — | — | US | disclosed |
| US-20030032280-A1 | Method for filling fine hole | TOKYO OHKA KOGYO CO., LTD. (JP) | 2003-02-13 | — | — | US | disclosed |
| US-20020182360-A1 | Material for forming protective film | TOKYO OHKA KOGYO CO., LTD. (JP) | 2002-12-05 | — | — | US | disclosed |
| US-20020055064-A1 | Anti-reflective coating composition, multilayer photoresist material using the same, and method for forming pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2002-05-09 | — | — | US | disclosed |
| EP-0848289-B1 | Negative-working chemical sensitization photoresist composition | TOKYO OHKA KOGYO CO LTD (JP) | 2002-02-27 | — | — | EP | disclosed |
| US-6268108-B1 | MIXTURE OF COMPOUND FORMING ACID UPON EXPOSURE OF ACTINIC RADIATION, COMPOUND CAPABLE OF CROSSLINKING, DYE AND SOLVENT | TOKYO OHKA KOGYO CO., LTD. (JP) | 2001-07-31 | — | — | US | disclosed |
| US-6042988-A | ALKALI-SOLUBLE RESIN, A COMPOUND CAPABLE OF GENERATING AN ACID BY IRRADIATION AND A CROSSLINKING AGENT, AND FURTHER CONTAINS AN ORGANIC CARBOXYLIC ACID AS ACIDIC COMPOUND AND ORGANIC AMINE AS ALKALINE COMPOUND; DEFINITION AND PRECISION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2000-03-28 | — | — | US | disclosed |
| US-5928837-A | Negative-working chemical-sensitization photoresist composition comprising oxime sulfonate compounds | TOKYO OHKA KOGYO CO., LTD. (JP) | 1999-07-27 | — | — | US | disclosed |
| EP-0848289-A1 | Negative-working chemical sensitization photoresist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1998-06-17 | — | — | EP | disclosed |