SCHEMBL5377409

SCHEMBL5377409

[CH2]COC12[C](OC(=O)OCC1OC(=O)C(=C)C)OC(=O)OCC2OC(=O)C(=C)C

nearest known ligand 0.33

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6248189 0.76
SCHEMBL449190 0.69 ALDH1A1 (0.37) ALDH1A1
SCHEMBL18774894 0.68 ALDH1A1 (0.36) ALDH1A1
SCHEMBL17878802 0.67 ALDH1A1 (0.35) ALDH1A1
SCHEMBL11354095 0.67 ALDH1A1 (0.35) ALDH1A1
SCHEMBL3561873 0.65 ALDH1A1 (0.39) ALDH1A1
SCHEMBL17882139 0.64 ALDH1A1 (0.33) ALDH1A1
SCHEMBL27196294 0.63 ALDH1A1 (0.32) ALDH1A1
SCHEMBL28225564 0.62 ALDH1A1 (0.42) ALDH1A1
SCHEMBL31534017 0.62 ALDH1A1 (0.41) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7244548-B2 Photopolymerizing composition and photopolymerizing recording medium manufactured using the same and used to manufacture 3D optical memory having ultra-high information storage capacity SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-07-17 US claimed
US-20060111461-A1 Photopolymerizing composition and photopolymerizing recording medium manufactured using the same and used to manufacture 3D optical memory having ultra-high information storage capacity SAMSUNG ELECTRONICS CO., LTD. (KR) 2006-05-25 US claimed
US-7244548-B2 Photopolymerizing composition and photopolymerizing recording medium manufactured using the same and used to manufacture 3D optical memory having ultra-high information storage capacity SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-07-17 US disclosed
US-20060111461-A1 Photopolymerizing composition and photopolymerizing recording medium manufactured using the same and used to manufacture 3D optical memory having ultra-high information storage capacity SAMSUNG ELECTRONICS CO., LTD. (KR) 2006-05-25 US disclosed