SCHEMBL27196294

SCHEMBL27196294

C=C(C)C(=O)OC1COC(=O)C23CCC12C3

nearest known ligand 0.32

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL449190 0.77 ALDH1A1 (0.37) ALDH1A1
SCHEMBL18774894 0.76 ALDH1A1 (0.36) ALDH1A1
SCHEMBL17878802 0.74 ALDH1A1 (0.35) ALDH1A1
SCHEMBL17882139 0.71 ALDH1A1 (0.33) ALDH1A1
SCHEMBL20776848 0.65 ALDH1A1 (0.33) ALDH1A1
SCHEMBL967974 0.64 ALDH1A1 (0.33) ALDH1A1
SCHEMBL31534017 0.63 ALDH1A1 (0.41) ALDH1A1
SCHEMBL5377409 0.63 ALDH1A1 (0.33) ALDH1A1
SCHEMBL3154291 0.63 ATM (0.39) ALDH1A1
SCHEMBL4689566 0.62 OPRK1 (0.44)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240124635-A1 POLYMER, RESIST COMPOSITION INCLUDING THE SAME, AND METHOD OF FORMING PATTERN USING THE RESIST COMPOSITION SAMSUNG ELECTRONICS CO., LTD. (KR) 2024-04-18 US disclosed