SCHEMBL5409243

SCHEMBL5409243

O=S(=O)(O)Nc1cc(NS(=O)(=O)O)cc(S(=O)(=O)O)c1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LCK P06239 1/20 0.41
FYN P06241 1/20 0.41
ING2 Q9H160 2/20 0.40
TSHR P16473 3/20 0.37
SMN1; SMN2 Q16637 1/20 0.37
PRMT1 Q99873 1/20 0.36
LMNA P02545 1/20 0.36
SNCA P37840 2/20 0.35
ALDH1A1 P00352 4/20 0.34
NT5E P21589 3/20 0.34
HSD17B10 Q99714 3/20 0.34
TDP1 Q9NUW8 1/20 0.34
CASP6 P55212 3/20 0.33
NSD2 O96028 2/20 0.33
TIMP3 P35625 1/20 0.33
CYP2C9 P11712 1/20 0.33
CYP2C19 P33261 1/20 0.33
DUSP3 P51452 1/20 0.33
PTPN5 P54829 1/20 0.33
CASP7 P55210 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5414637 0.79 TSHR (0.52) TSHRSMN1; SMN2LMNASNCAALDH1A1
SCHEMBL27182762 0.77 TSHR (0.50) TSHRSMN1; SMN2SNCAALDH1A1HSD17B10
SCHEMBL8736327 0.74 ALDH1A1 (0.43) LCKFYNING2TSHRSMN1; SMN2
SCHEMBL8733495 0.74 ALDH1A1 (0.43) LCKFYNING2TSHRSMN1; SMN2
SCHEMBL6051980 0.73 PTPN1 (0.51) SMN1; SMN2ALDH1A1PTPN1HTR6
SCHEMBL219222 0.73 LCK (0.57) LCKFYNING2TSHRSMN1; SMN2
SCHEMBL12110006 0.71 ALDH1A1 (0.45) LCKFYNING2TSHRSMN1; SMN2
SCHEMBL7258962 0.71 MAPT (0.42) TSHRLMNAALDH1A1GAA
SCHEMBL11516571 0.71 ING2 (0.45) LCKFYNING2TSHRSMN1; SMN2
SCHEMBL14508933 0.71 LMNA (0.44) ING2SMN1; SMN2LMNAALDH1A1CYP2C9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7247566-B2 CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers DUPONT AIR PRODUCTS NANOMATERIALS LLC (US) 2007-07-24 US disclosed
US-20050090109-A1 CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers VERSUM MATERIALS US, LLC 2005-04-28 US disclosed