SCHEMBL543628

SCHEMBL543628

C=C(C)C(=O)OCCOC(=O)c1cc(C(=O)O)ccc1C(=O)O

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
POLB P06746 2/20 0.56
TDP1 Q9NUW8 2/20 0.56
APEX1 P27695 1/20 0.56
HTT P42858 1/20 0.56
KDM4E B2RXH2 2/20 0.42
THRB P10828 1/20 0.41
TSHR P16473 5/20 0.40
SERPINE1 P05121 1/20 0.39
CA1 P00915 1/20 0.38
CA2 P00918 1/20 0.38
RAB9A P51151 2/20 0.38
LMNA P02545 1/20 0.38
CDC25A P30304 1/20 0.36
CDC25B P30305 1/20 0.36
HSD17B10 Q99714 1/20 0.36
MYC P01106 1/20 0.36
ALDH1A1 P00352 2/20 0.36
GAA P10253 1/20 0.36
L3MBTL1 Q9Y468 1/20 0.36
ELANE P08246 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2787758 0.96 POLB (0.52) POLBTDP1APEX1HTTKDM4E
SCHEMBL345789 0.96 TDP1 (0.61) POLBTDP1APEX1HTTKDM4E
SCHEMBL14262486 0.96 TDP1 (0.57) POLBTDP1APEX1HTTKDM4E
SCHEMBL544688 0.94 TDP1 (0.56) POLBTDP1APEX1HTTKDM4E
SCHEMBL31053930 0.94 TDP1 (0.56) POLBTDP1APEX1HTTKDM4E
SCHEMBL14262501 0.94 POLB (0.49) POLBTDP1APEX1HTTKDM4E
SCHEMBL14262495 0.93 POLB (0.48) POLBTDP1APEX1HTTKDM4E
SCHEMBL14262496 0.91 POLB (0.46) POLBTDP1APEX1HTTKDM4E
SCHEMBL837846 0.90 POLB (0.50) POLBTDP1APEX1HTTKDM4E
SCHEMBL29657635 0.89 POLB (0.49) POLBTDP1APEX1HTTKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 86 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-55110171-A None JP disclosed
EP-3479812-B1 RESIN CURED BODY FOR DENTAL CUTTING PROCESSING IMPROVED IN ADHESIVE PROPERTY SHOFU INC (JP) 2025-03-05 EP disclosed
CN-114096603-B Thermally expandable composition comprising endothermic blowing agent SIKA技术股份公司 2024-01-26 CN disclosed
CN-114555745-B Adhesive composition for green sheet molding, slurry for green sheet molding, green sheet and method for producing the same, and apparatus and method for producing the same 株式会社引能仕材料 2023-08-18 CN disclosed
CN-112912425-B Novel foams having improved expansion behaviour when used in thin layers SIKA技术股份公司 2023-04-28 CN disclosed
US-11311350-B2 Resin cured body for dental cutting processing improved in adhesive property SHOFU INC. (JP) 2022-04-26 US disclosed
WO-2021043797-A1 THERMALLY EXPANDABLE PREPARATION HENKEL AG & CO. KGAA (DE) 2021-03-11 WO disclosed
WO-2020212211-A1 PUMPABLE THERMALLY CURABLE AND EXPANDABLE PREPARATIONS HENKEL AG & CO. KGAA (DE) 2020-10-22 WO disclosed
EP-3665217-A1 NEW FOAM WITH IMPROVED EXPANSION BEHAVIOUR WHEN USED IN THIN LAYERS Sika Technology AG (CH) 2020-06-17 EP disclosed
EP-3147323-B1 THERMALLY EXPANDABLE COMPOSITIONS WITH POLYSACCHARIDE HENKEL AG & CO KGAA (DE) 2020-04-15 EP disclosed
CN-1296451-A Cavity sealing article and method TEICH ELECTRONICS CO LTD (US) 2001-05-23 CN disclosed
CN-1265124-A High voltage electrical insulation material RAYCHEM LTD (GB) 2000-08-30 CN disclosed
EP-0310372-B1 DENTAL COMPOSITION KURARAY CO., LTD. (JP) 1992-06-17 EP disclosed
US-4952613-A ANTICARIES AGENTS KURARAY CO., LTD. (JP) 1990-08-28 US disclosed
US-4678819-A CASTING POLYMERIZATION MITSUBISHI RAYON CO., LTD. (JP) 1987-07-07 US disclosed
US-4551215-A EPOXY COMPOUND, PHOTOPOLYMERIZABLE COMPOUND HAVING CARBOXYL, AND PHOTOSENSITIZER TOYO BOSEKI KABUSHIKI KAISHA (JP) 1985-11-05 US disclosed
EP-0019121-B1 PROCESS FOR PRODUCING RADIATION-SHIELDING PLASTIC MATERIALS MITSUBISHI RAYON CO., LTD. (JP) 1983-10-05 EP disclosed
US-4292419-A POLYMERIZING ACRYLIC ESTER AND/OR STYRENE, LEAD COMPOUND, ORGANIC ACID, RADICAL INITIATOR MITSUBISHI RAYON CO., LTD. (JP) 1981-09-29 US disclosed
EP-0019121-A2 Process for producing radiation-shielding plastic materials MITSUBISHI RAYON CO., LTD. (JP) 1980-11-26 EP disclosed
JP-S55110171-A ADHESIVE COMPOSITION MITSUI PETROCHEM IND LTD 1980-08-25 JP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11311350-B2 Resin cured body for dental cutting processing improved in adhesive property CAD, FGB, F13B POLB 791/4885TDP1 1984/4885APEX1 1793/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.